Patents by Inventor Shinji Kubota

Shinji Kubota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11019314
    Abstract: A projector moves a first imaging lens and a second imaging lens in a direction that intersects the optical axis of an imaging section to adjust the imaging range of the imaging section and moves the first imaging lens and the second imaging lens in the direction that intersects the optical axis of the imaging section to switch the imaging lens located in a position corresponding to the imaging section from one to another.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: May 25, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Shinji Kubota
  • Patent number: 10978274
    Abstract: The plasma processing apparatus according to an exemplary embodiment includes a chamber, a radio-frequency power supply, and a correction signal generator. The radio-frequency power supply outputs a pulsed radio-frequency power in a first period. The radio-frequency power supply outputs a pulsed radio-frequency power in one or more second periods after the first period. The correction signal generator generates a correction signal that oscillates in a reverse phase with respect to a reflected wave monitor signal in the first period. The radio-frequency power supply generates a combined radio-frequency power using the correction signal. The power supply is configured to alternately repeat output of the pulsed radio-frequency power in the first period and output of the combined radio-frequency power in the one or more second periods.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: April 13, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Shinji Kubota
  • Patent number: 10971336
    Abstract: A plasma processing apparatus includes a processing vessel; a carrier wave group generating unit configured to generate a carrier wave group including multiple carrier waves having different frequencies belonging to a preset frequency band centered around a predetermined center frequency; and a plasma generating unit configured to generate plasma within the processing vessel by using the carrier wave group.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: April 6, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Shinji Kubota
  • Publication number: 20210076013
    Abstract: A projector includes a projection section, a spectral imaging section, and a control section, wherein the control section makes the projection section project an adjusting image corresponding to a color and a gray level of an image to be projected by the projection section while changing the color and the gray level to a first color and a first gray level, the first color and a second gray level, a second color and a third gray level, and the second color and a fourth gray level, sets a measurement condition corresponding to the color to the spectral imaging section, and makes the spectral imaging section take the adjusting images projected by the projection section to obtain spectral imaging data.
    Type: Application
    Filed: November 20, 2020
    Publication date: March 11, 2021
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Tetsuo MANO, Shinji KUBOTA, Hiroyuki ICHIEDA
  • Publication number: 20210066040
    Abstract: A plasma processing apparatus includes: a first electrode on which a substrate is placed; a plasma generation source that generates plasma; a bias power supply that supplies bias power to the first electrode; a source power supply that supplies source power to the plasma generation source; and a controller. The controller performs a control such that a first state and a second state of the source power are alternately applied in synchronization with a high frequency cycle of the bias power, or a phase within one cycle of a reference electrical state indicating any one of a voltage, a current and an electromagnetic field measured in a power feed system of the bias power, and performs a control to turn OFF the source power at least at a negative side peak of the phase within one cycle of the reference electrical state.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 4, 2021
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shinji KUBOTA, Yuji AOTA, Chishio KOSHIMIZU
  • Publication number: 20210051792
    Abstract: A plasma processing method includes performing a first plasma processing in a processing chamber in a first period, and performing a second plasma processing in the processing chamber during a second period continuously after the first period. In the first period and the second period, a first radio-frequency power for bias is continuously supplied to a lower electrode. A second radio-frequency power for plasma generation may be supplied as a pulsed radio-frequency power in a first partial period in each cycle of the first radio-frequency power in the first period. The second radio-frequency power may be supplied as a pulsed radio-frequency power in a second partial period in each cycle of the first radio-frequency power in the second period.
    Type: Application
    Filed: June 10, 2019
    Publication date: February 18, 2021
    Applicant: Tokyo Electron Limited
    Inventors: Takashi DOKAN, Shinji KUBOTA, Chishio KOSHIMIZU
  • Publication number: 20210043472
    Abstract: A control method of a plasma processing apparatus including a first electrode and a second electrode includes supplying a bias power to the first electrode, and supplying a negative DC voltage to the second electrode. The negative DC voltage periodically repeats a first state that takes a first voltage value and a second state that takes a second voltage value having an absolute value smaller than the first voltage value. The control method further includes a first control process of applying the first state of the negative DC voltage in a partial time period within each cycle of a signal synchronized with a cycle of a radio frequency of the bias power, or in a partial time period within each cycle of a periodically varying parameter measured in a transmission path of the bias power, and applying the second state continuously with the first state.
    Type: Application
    Filed: July 17, 2019
    Publication date: February 11, 2021
    Applicant: Tokyo Electron Limited
    Inventors: Chishio KOSHIMIZU, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN, Koichi NAGAMI
  • Patent number: 10886135
    Abstract: In a substrate processing method, electrons having a first energy are supplied from an electron beam generator into an inner space of a chamber body of a substrate processing apparatus to generate negative ions by attaching the electrons to molecules in a processing gas supplied to the inner space. Then a positive bias voltage is applied to an electrode of a supporting table that supports a substrate mounted on thereon in the inner space to attract the negative ions to the substrate.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: January 5, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shinji Kubota, Kazuya Nagaseki, Akihiro Yokota, Gen Tamamushi
  • Publication number: 20200411286
    Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
    Type: Application
    Filed: September 10, 2020
    Publication date: December 31, 2020
    Applicant: Tokyo Electron Limited
    Inventors: Chishio KOSHIMIZU, Taichi HIRANO, Toru HAYASAKA, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN
  • Patent number: 10873731
    Abstract: A projector includes a projection section, a spectral imaging section, and a control section, wherein the control section makes the projection section project an adjusting image corresponding to a color and a gray level of an image to be projected by the projection section while changing the color and the gray level to a first color and a first gray level, the first color and a second gray level, a second color and a third gray level, and the second color and a fourth gray level, sets a measurement condition corresponding to the color to the spectral imaging section, and makes the spectral imaging section take the adjusting images projected by the projection section to obtain spectral imaging data.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: December 22, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tetsuo Mano, Shinji Kubota, Hiroyuki Ichieda
  • Publication number: 20200294770
    Abstract: In a plasma processing apparatus of an exemplary embodiment, a radio frequency power source generates radio frequency power for plasma generation. A bias power source periodically applies a pulsed negative direct-current voltage to a lower electrode to draw ions into a substrate support. The radio frequency power source supplies the radio frequency power as one or more pulses in a period in which the pulsed negative direct-current voltage is not applied to the lower electrode. The radio frequency power source stops supply of the radio frequency power in a period in which the pulsed negative direct-current voltage is applied to the lower electrode. Each of the one or more pulses has a power level that gradually increases from a point in time of start thereof to a point in time when a peak thereof appears.
    Type: Application
    Filed: June 3, 2020
    Publication date: September 17, 2020
    Applicant: Tokyo Electron Limited
    Inventor: Shinji KUBOTA
  • Publication number: 20200286714
    Abstract: The plasma processing apparatus according to an exemplary embodiment includes a chamber, a radio-frequency power supply, and a correction signal generator. The radio-frequency power supply outputs a pulsed radio-frequency power in a first period. The radio-frequency power supply outputs a pulsed radio-frequency power in one or more second periods after the first period. The correction signal generator generates a correction signal that oscillates in a reverse phase with respect to a reflected wave monitor signal in the first period. The radio-frequency power supply generates a combined radio-frequency power using the correction signal. The power supply is configured to alternately repeat output of the pulsed radio-frequency power in the first period and output of the combined radio-frequency power in the one or more second periods.
    Type: Application
    Filed: June 10, 2019
    Publication date: September 10, 2020
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Shinji KUBOTA
  • Publication number: 20200267356
    Abstract: A projector moves a first imaging lens and a second imaging lens in a direction that intersects the optical axis of an imaging section to adjust the imaging range of the imaging section and moves the first imaging lens and the second imaging lens in the direction that intersects the optical axis of the imaging section to switch the imaging lens located in a position corresponding to the imaging section from one to another.
    Type: Application
    Filed: February 18, 2020
    Publication date: August 20, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Shinji KUBOTA
  • Publication number: 20200251308
    Abstract: A radio frequency power source according to an exemplary embodiment includes a power generator configured to generate radio frequency power. The radio frequency power includes a plurality of power components. The plurality of power components respectively have a plurality of frequencies set symmetrically with respect to a fundamental frequency at an interval of a predetermined frequency. The envelope of the radio frequency power has peaks that periodically appear at a time interval defined by the predetermined frequency or a frequency that is a multiple of twice or more the predetermined frequency. The power level of the radio frequency power is set to be zero in a period excluding a period between a zero-cross region of the envelope immediately before a point in time of appearance of each of the peaks and a zero-cross region of the envelope immediately after the point in time of the appearance.
    Type: Application
    Filed: January 27, 2020
    Publication date: August 6, 2020
    Applicant: Tokyo Electron Limited
    Inventors: Shinji KUBOTA, Takashi DOKAN
  • Publication number: 20200221058
    Abstract: A projector includes a projection section, a spectral imaging section, and a control section, wherein the control section makes the projection section project an adjusting image corresponding to a color and a gray level of an image to be projected by the projection section while changing the color and the gray level to a first color and a first gray level, the first color and a second gray level, a second color and a third gray level, and the second color and a fourth gray level, sets a measurement condition corresponding to the color to the spectral imaging section, and makes the spectral imaging section take the adjusting images projected by the projection section to obtain spectral imaging data.
    Type: Application
    Filed: January 7, 2020
    Publication date: July 9, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Tetsuo MANO, Shinji KUBOTA, Hiroyuki ICHIEDA
  • Patent number: 10707054
    Abstract: In a plasma processing apparatus of an exemplary embodiment, a radio frequency power source generates radio frequency power for plasma generation. A bias power source periodically applies a pulsed negative direct-current voltage to a lower electrode to draw ions into a substrate support. The radio frequency power source supplies the radio frequency power as one or more pulses in a period in which the pulsed negative direct-current voltage is not applied to the lower electrode. The radio frequency power source stops supply of the radio frequency power in a period in which the pulsed negative direct-current voltage is applied to the lower electrode. Each of the one or more pulses has a power level that gradually increases from a point in time of start thereof to a point in time when a peak thereof appears.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: July 7, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Shinji Kubota
  • Publication number: 20200203129
    Abstract: In a plasma processing apparatus according to an embodiment, a first radio-frequency power supply is connected to a lower electrode of a substrate support provided within a chamber via a first matcher. The first radio-frequency power supply supplies first radio-frequency power for bias to the lower electrode. The second radio-frequency power supply is connected to a load via a second matcher. The second radio-frequency power supply supplies second radio-frequency power for plasma generation. A controller of the second matcher sets an impedance of a matching circuit of the second matcher such that a reflection from the load of the second radio-frequency power supply is reduced in a designated partial period within each cycle of the first radio-frequency power.
    Type: Application
    Filed: December 18, 2019
    Publication date: June 25, 2020
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Chishio Koshimizu, Takashi Dokan, Shinji Kubota
  • Patent number: 10672616
    Abstract: A plasma processing apparatus includes a microwave generation unit configured to generate a microwave, a processing vessel configured to introduce the microwave thereinto, and a gas supply mechanism configured to supply a gas into the processing vessel, plasma being generated within the processing vessel so that a plasma processing is performed on a processing target object. The microwave generation unit includes an oscillation circuit configured to oscillate the microwave, a pulse generation circuit configured to oscillate a control wave having a predetermined frequency bandwidth at a predetermined cycle, and a frequency modulation circuit configured to modulate a frequency of the microwave to a modulated wave having the predetermined frequency bandwidth by the control wave and output the modulated wave, and the frequency modulation circuit alternately and repeatedly outputs the modulated wave and a non-modulated microwave at the predetermined cycle.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: June 2, 2020
    Assignee: TOKYO ELECTON LIMITED
    Inventor: Shinji Kubota
  • Patent number: 10665416
    Abstract: A substrate processing apparatus includes a chamber, a pedestal provided in the chamber and having a substrate holding region to hold a substrate thereon, and a gas supply part to supply a gas into the chamber. A plurality of electron gun arrays two-dimensionally arranged so as to cover the substrate holding region is provided and configured to emit electrons toward the gas to cause interactions between the emitted electrons and the gas. A plurality of electron energy control parts is correspondingly provided at each of the electron gun arrays and configured to control energy of the electrons emitted from each of the electron gun arrays independently of each other.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 26, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Shinji Kubota, Naohiko Okunishi, Yosuke Tamuro, Shota Kaneko
  • Publication number: 20200118814
    Abstract: A plasma processing method includes performing a first plasma processing in a processing chamber in a first period, and performing a second plasma processing in the chamber in a second period which is after the first period or following the first period. The first plasma processing and the second plasma processing are performed in a state where a substrate is disposed on a substrate support stage provided in the processing chamber. A sequence including the first plasma processing and the second plasma processing is performed a plurality of times.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 16, 2020
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Takashi DOKAN, Shinji KUBOTA