Abstract: The driving circuit of the display includes a timing controller. The timing controller is coupled to a general purpose input/output (GPIO) pin of the touch driver. The timing controller receives an instruction signal via the GPIO pin of the touch driver. The timing controller starts a detection period according to a first edge switched from a first voltage level to a second voltage level of the instruction signal. The timing controller detects a number of pulse signals of the instruction signal, and determines a current operating status of the touch driver according to the number of pulse signals of the instruction signal during the detection period. The timing controller determines that the current operating status of the touch driver is one of touch operation type statuses according to the number of pulse signals of the instruction signal during the detection period being a default number.

Abstract: A fan with increased heat-removing ability and reduced noise in operation includes a hub, a baffle, a first blade layer, and a second blade layer. The first blade layer includes a plurality of first blades, and the second blade layer includes a plurality of second blades. An orthogonal projection of each of the plurality of first blades on the baffle is located between orthogonal projections of adjacent two of the plurality of second blades on the baffle. A length of the plurality of first blades is greater or less than a length of the plurality of second blades to avoid any resonance. An electronic device including the fan is also disclosed.

Abstract: An electrical receptacle connector includes a metallic shell, an insulated housing in the metallic shell, a plurality of terminals at the insulated housing, and a metallic plate. The terminals are arranged in two rows, and the metallic plate is at the insulated housing and between the terminals in the two rows. The metallic plate includes a through hole at a front portion of the tongue portion. The through hole has several through portions and a communication portion between the through portions. By allowing that the communication portion to be in communication with the through portions to form a through hole in an elongated shape, the molding efficiency for forming the tongue portion with the filling of the plastic materials can be increased.

Abstract: An orchestrator that manages security appliances for an organization determines a sink configured for traffic mirroring and correspondingly configures components for the correlation and secure conveyance. The orchestrator also configures the security appliances. The orchestrator configures the security appliances to copy cryptographic keys (hereinafter “tunnel keys”) and identifiers associated with the keys of secure VPN tunnels established by the security appliances to a repository of the cloud-service provider. The orchestrator configures a virtual machine associated with the mirroring sink with correlation logic. The virtual machine correlates sets of packets aggregated across different mirroring streams and tunnel keys with the associated identifiers. Correlating the sets of packets and the tunnel keys allows an organization to efficiently access the content of the encrypted packets or facilitates secure conveyance.

Abstract: An electronic device includes a circuit structure, an electronic component electrically connected to the circuit structure, an antenna unit disposed on the circuit structure, and a shielding layer surrounding the electronic component. The circuit structure has a first surface and a second surface opposite to the first surface. The first surface has a first portion, a second portion, and a third portion, wherein the third portion connects the first portion and the second portion. In the normal direction of the electronic device, the third portion is closer to the second surface than the first portion or the second portion, thereby forming a recess. The electronic component is disposed in the recess. The antenna unit is disposed on the first surface of the circuit structure and is electrically connected to the electronic component through the circuit structure.

Abstract: A lithium battery cell includes an upper cover module, a first battery electrode group, a second battery electrode group, and a plurality of first electrode connection straps. The first electrode connection straps are stacked together. A first end of the first electrode connection straps is welded to a first tab, a second end of the first electrode connection straps is welded to a second tab, and a middle part of the first electrode connection straps is welded to a first electrode terminal. An even number of first bending parts are formed between the middle part and the first end, and an even number of second bending parts are formed between the middle part and the second end, and the first bending parts and the second bending parts are symmetrical to each other. A lithium battery cell manufacturing method is also disclosed therein.

Abstract: A method includes forming Magnetic Tunnel Junction (MTJ) stack layers, which includes depositing a bottom electrode layer; depositing a bottom magnetic electrode layer over the bottom electrode layer; depositing a tunnel barrier layer over the bottom magnetic electrode layer; depositing a top magnetic electrode layer over the tunnel barrier layer; and depositing a top electrode layer over the top magnetic electrode layer. The method further includes patterning the MTJ stack layers to form a MTJ; and performing a passivation process on a sidewall of the MTJ to form a protection layer. The passivation process includes reacting sidewall surface portions of the MTJ with a process gas comprising elements selected from the group consisting of oxygen, nitrogen, carbon, and combinations thereof.

Abstract: While organizations can employ IPsec based VPNs to securely connect different sites (e.g., branch sites, data centers, and/or virtual private clouds), the security can disrupt network performance by obfuscating information used for load balancing. Disclosed is technology that employs minimal decryption in a secure manner to load balance multiple network traffic flows within a secure connection (“tunnel”) across security appliances that effectively operate as alternative endpoints for the tunnel. The security appliances within a load balancing pool are configured/programmed to share tunnel keys with each other after tunnel establishment and with the load balancer. The load balancer uses the tunnel keys to minimally decrypt in a lookaside memory encrypted packets to ascertain N-tuples. The load balancer then uses the N-tuples to load balance the flows within a tunnel across the security appliances.

Abstract: An interconnect structure and methods of forming the same are described. In some embodiments, the structure includes a first dielectric layer and one or more first conductive features disposed in the first dielectric layer. The one or more first conductive features includes a first metal. The structure further includes a plurality of graphene layers disposed on each of the one or more first conductive features, the plurality of graphene layers include a second metal intercalated therebetween, and the second metal is different from the first metal.

Abstract: The present disclosure provides an antenna system, which includes a defected ground structure board and an antenna structure board. The defected ground structure board includes a first insulating plate and a defected ground structure layer, and the defected ground structure layer is disposed on the first insulating plate. The antenna structure board is disposed on the defected ground structure board. The antenna structure board includes at least one antenna body and a second insulating plate, the at least one antenna body is disposed on the second insulating plate, and the second insulating plate is disposed on the defected ground structure layer.

Abstract: Semiconductor device and methods of manufacture are provided. In an embodiment, the a semiconductor device may include a first semiconductor die; an oxide layer on the first semiconductor die, wherein the first semiconductor die has a first top surface opposite the oxide layer; a first insulating material encapsulating the first semiconductor die and the oxide layer, wherein the first insulating material has a second top surface planar with the first top surface; and a first polymer buffer disposed between a sidewall of the first semiconductor die and a sidewall of the oxide layer, wherein the first polymer buffer has a third top surface planar with both the first top surface and the second top surface.

Abstract: In an embodiment, a method includes: forming active devices over a semiconductor substrate; forming an interconnect structure over the active devices, the interconnect structure comprising a first portion of a seal ring over the semiconductor substrate, the seal ring being electrically insulated from the active devices; forming a first passivation layer over the interconnect structure; forming a first metal pad and a second metal pad extending through the first passivation layer and over the interconnect structure, the first metal pad having a bowl shape, the second metal pad having a step shape; and depositing a second passivation layer over the first metal pad and the second metal pad.

Abstract: A semiconductor package includes a circuit substrate, a die, a frame structure, and a heat sink lid. The die is disposed on the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies.

Abstract: A stacked via structure disposed on a conductive pillar of a semiconductor die is provided. The stacked via structure includes a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer, a second conductive via, and a second redistribution wiring. The first dielectric layer covers the semiconductor die. The first conductive via is embedded in the first dielectric layer and electrically connected to the conductive pillar. The first redistribution wiring covers the first conductive via and the first dielectric layer. The second dielectric layer covers the first dielectric layer and the first redistribution wiring. The second conductive via is embedded in the second dielectric layer and landed on the first redistribution wiring. The second redistribution wiring covers the second conductive via and the second dielectric layer. A lateral dimension of the first conductive via is greater than a lateral dimension of the second conductive via.

Abstract: An exemplary method includes, capturing, during a semiconductor fabrication process performed using a semiconductor processing device including a liquid distribution component configured to dispense a liquid flowing with an intact curtain profile, first images of a view of a chamber of the semiconductor processing device. The method includes determining curtain profile classifications of the first images. A curtain profile classification of the curtain profile classifications indicates a first value indicating that an image exhibits the liquid flowing with the intact curtain profile, or a second value indicating that the image does not exhibit the liquid flowing with the intact curtain profile. The method includes determining a plurality of groups of images based upon an order of the first images and the curtain profile classifications of the first images.

Abstract: A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.

Abstract: An oral drug tablet manufacturing device and a manufacturing method thereof comprise a tablet manufacturing area, a dust arresting area, a motor, a micro-control unit, a collecting area and a static platform. The tablet manufacturing area comprises a tablet spraying device having a roller and a piezoelectric nozzle, a medicine powder filling container is communicated to the piezoelectric nozzle, the container contains medicine powders, the medicine powders are sprayed and printed through the piezoelectric nozzle, and then the medicine powders are pressed and flattened through the roller to cause the medicine powders to form a drug tablet. The micro-control unit is disposed in the piezoelectric nozzle, and has a storage module and an execution control module. The storage module stores a tablet spray information, the execution control module controls the tablet spraying device through the tablet spray information, and the collecting area is used to collect the drug tablet.

Abstract: A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the second pad.

Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a cap and outer flanges. The cap overlies the semiconductor package. The outer flanges are disposed at edges of the cap, are connected with the cap, and extend towards the circuit substrate. A region of the bottom surface of the cap has a curved profile matching a warpage profile of the semiconductor package and the circuit substrate, and the region having the curved profile extends over the semiconductor package.

Abstract: Techniques for providing a networking and security split architecture are disclosed. In some embodiments, a system, process, and/or computer program product for providing a networking and security split architecture includes receiving a flow at a security service; processing the flow at a network layer of the security service to perform one or more networking functions; and offloading the flow to a security layer of the security service to perform security enforcement based on a policy.