Abstract: A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.

Abstract: Described herein are systems, methods, and software to enhance failover operations in a cloud computing environment. In one implementation, a method of operating a first service instance in a cloud computing environment includes obtaining a communication from a computing asset, wherein the communication comprises a first destination address. The method further provides replacing the first destination address with a second destination address in the communication, wherein the second destination address comprises a shared address for failover from a second service instance. After replacing the address, the method determines whether the communication is permitted based on the second destination address, and if permitted, processes the communication in accordance with a service executing on the service instance.

Abstract: A method for fabricating a semiconductor device includes the steps of forming a gate structure on a substrate, forming an epitaxial layer adjacent to the gate structure, and then forming a first cap layer on the epitaxial layer. Preferably, a top surface of the first cap layer includes a curve concave upward and a bottom surface of the first cap layer includes a planar surface higher than a top surface of the substrate.

Abstract: A stacked via structure disposed on a conductive pillar of a semiconductor die is provided. The stacked via structure includes a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer, a second conductive via, and a second redistribution wiring. The first dielectric layer covers the semiconductor die. The first conductive via is embedded in the first dielectric layer and electrically connected to the conductive pillar. The first redistribution wiring covers the first conductive via and the first dielectric layer. The second dielectric layer covers the first dielectric layer and the first redistribution wiring. The second conductive via is embedded in the second dielectric layer and landed on the first redistribution wiring. The second redistribution wiring covers the second conductive via and the second dielectric layer. A lateral dimension of the first conductive via is greater than a lateral dimension of the second conductive via.

Abstract: Techniques for providing flow meta data exchanges between network and security functions for a security service are disclosed. In some embodiments, a system/process/computer program product for providing flow meta data exchanges between network and security functions for a security service includes receiving a flow at a network gateway of a security service from a software-defined wide area network (SD-WAN) device; inspecting the flow to determine meta information associated with the flow; and communicating the meta information associated with the flow to the SD-WAN device.

Abstract: The present disclosure provides methods and apparatus for calibrating cost estimator for trustworthy DBMS performance. An aspect of the disclosure provides for a method, which includes generating a plurality of plans for potential execution by a DBMS, each of the plurality of plans being configured to generate a same response to a same specified database query. The method further includes generating, for each plan, a set of probability-cost value pairs, each indicative of an estimated upper cost for said plan and a probability that a cost for said plan will be equal to or less than said estimated upper cost, if and when said plan is executed. The method further includes selecting one of the plurality of plans based at least in part on an evaluation of the sets of probability-cost value pairs for the plurality of plans, and causing the DBMS to execute the selected plan.

Abstract: A permeable spraying device for making drug tablets mainly comprises a carrying platform, a spraying equipment, a flattening device and a control equipment, the carrying platform defines a powder dropping area and a flattened spraying area, and a moving device combined with the carrying platform is capable of moving vertically. The spraying equipment is mounted above the carrying platform, and the spraying equipment comprises a powder box, a colloid spraying equipment, a driving device and a placement platform. The placement platform is disposed with a plurality of supplementary colloid carriers. The flattening device is installed on the carrying platform and moves horizontally back and forth in the flattened spraying area. The control equipment is equipped with a storage unit and an execution control unit. A multi-layer drug body structure can be formed by deposition, stacking and bonding.

Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.

Abstract: The present disclosure provides a method of reading data maintained in a tree data structure, such as B+ tree, using near data processing (NDP) in a cloud native database. According to embodiments, a desired LSN will be used in NDP page reads on the master computing node (e.g. master SQL node). When the master computing node (e.g. master SQL node) reads the regular page, the maximum desired LSN (e.g. the latest page version number) for that regular page will be used. Embodiments use features of the desired LSN and page locking, wherein correct versions of pages can be obtained by using the desired LSN associated with a page, in combination with page locking, and can enable the reading of a consistent tree structure and achieve good read/write concurrency.

Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

Abstract: Techniques for providing a networking and security split architecture are disclosed. In some embodiments, a system, process, and/or computer program product for providing a networking and security split architecture includes receiving a flow at a security service; processing the flow at a network layer of the security service to perform one or more networking functions; and offloading the flow to a security layer of the security service to perform security enforcement based on a policy.

Abstract: Traffic log data generated by cloud firewalls executing in a cloud environment during a time period that indicate classes and corresponding amounts of network traffic detected across sessions as well as usage cost data recorded for the cloud firewalls during the time period are obtained. The traffic log data are preprocessed to generate training data comprising feature vectors indicating the aggregate amount of network traffic detected for each traffic class during a corresponding time interval within the time period and are labeled with the associated usage cost. A machine learning model is trained on the labeled traffic log data to learn the impact each traffic class has on the accumulated usage costs. The trained model generates predicted usage costs based on distributions of detected network traffic across traffic classes that are analyzed to correlate traffic patterns with usage costs to determine the optimal size(s) of cloud firewalls to deploy.

Abstract: A semiconductor structure includes a first die, second dies coupled to and on the first die, a dielectric layer on the first die and covering each second die, and through dielectric vias (TDVs) coupled to and on the first die. The first die includes a bonding dielectric layer and bonding features embedded in and leveled with the bonding dielectric layer. An array of second dies is arranged in a first region of the first die. Each second die includes a bonding dielectric layer and a bonding feature embedded in and leveled with the bonding dielectric layer. The bonding dielectric layer and the bonding feature of each second die are respectively bonded to those of the first die. The TDVs are laterally covered by the dielectric layer in a second region of the first die which is connected to the first region and arranged along a periphery of the first die.

Abstract: Provided are certain PI3K inhibitors, pharmaceutical compositions thereof, and methods of use thereof.

Abstract: Provided are certain Bcl-2 inhibitors, pharmaceutical compositions thereof, and methods of use thereof.

Abstract: Methods, processing units, and computer-readable media in a cloud-based database are described. Redo log records are applied to a page at a database replica only when an updated version of the page is requested at the database replica. A log cache may be used by a replica node of the database to track recent redo log records applicable to a given page. The recent redo log records stored in the log cache may be applied to update the page on-demand when an updated version of the page is requested. By applying only the redo log records applicable to pages that are currently being requested, processing resources may be used only to generate pages that are currently required. Methods for registering redo log records into the log cache by the master or replica server are also described.

Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.

Abstract: An embodiment is a structure including a first die having an active surface with a first center point, a molding compound at least laterally encapsulating the first die, and a first redistribution layer (RDL) including metallization patterns extending over the first die and the molding compound. A first portion of the metallization patterns of the first RDL extending over a first portion of a boundary of the first die to the molding compound, the first portion of the metallization patterns not extending parallel to a first line, the first line extending from the first center point of the first die to the first portion of the boundary of the first die.

Abstract: A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.

Abstract: Provided are certain BTK inhibitors, pharmaceutical compositions thereof, and methods of use thereof.