Patents by Inventor Steven V. Sansoni

Steven V. Sansoni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170254
    Abstract: Embodiments of the disclosure are directed to PEALD batch processing chambers. Some embodiments are directed to processing chambers having one or more inductively coupled plasma (ICP) coils electrically connected to at least one RF power source. Some embodiments are directed to processing chambers having a wafer cassette comprising a plurality of platforms, each platform configured to support at least one wafer for processing, and one or more RF power sources electrically connected to the plurality of platforms in the wafer cassette. In some embodiments, the plurality of platforms have a first set of electrodes having a first polarity and a second set of electrodes having a second polarity, and one or more RF power sources electrically connected to the plurality of platforms in the wafer cassette.
    Type: Application
    Filed: November 21, 2022
    Publication date: May 23, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Jianming Fu, Tza-Jing Gung, Sanjeev Baluja, Haitao Wang, Mandyam Sriram, Srinivas Gandikota, Steven V. Sansoni
  • Patent number: 11887878
    Abstract: Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: January 30, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shreesha Yogish Rao, Mukund Sundararajan, Cheng-Hsiung Matthew Tsai, Manjunatha P. Koppa, Steven V. Sansoni
  • Patent number: 11414740
    Abstract: Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: August 16, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Alexander N. Lerner, Roey Shaviv, Michael P. Karazim, Kevin Vincent Moraes, Steven V. Sansoni, Andrew J. Constant, Jeffrey Allen Brodine, Kim Ramkumar Vellore, Amikam Sade, Niranjan Kumar
  • Patent number: 11348823
    Abstract: Substrate transfer robot blades used to engage and support a substrate during transfer include a blade body having a blade support surface and at least one pad having a top surface and an opposite bottom surface, a central opening extending from the top surface to the bottom surface, and a resilient portion formed from the at least one pad. The resilient portion formed from the at least one pad extends from and cantilevers from a side surface of the central opening of the at least one pad that is disposed directly on the side surface at the end of a long axis of the resilient portion. The resilient portion further includes a curved substrate contact surface on an outermost end of the resilient portion on which a substrate is supported when disposed on the substrate transfer robot blade.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: May 31, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Steven V. Sansoni, Jeffrey Brodine, Glen Mori
  • Patent number: 11170982
    Abstract: Methods and apparatus for low angle, selective plasma deposition on a substrate. A plasma chamber uses a process chamber having an inner processing volume, a three dimensional (3D) magnetron with a sputtering target with a hollow inner area that overlaps at least a portion of sides of the sputtering target and moves in a linear motion over a length of the sputtering target, a housing surrounding the 3D magnetron and the sputtering target such that at least one side of the housing exposes the hollow inner area of the sputtering target, and a linear channel interposed between the housing and a wall of the process chamber.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 9, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Anantha K. Subramani, Praburam Raja, Steven V. Sansoni, John Forster, Philip Kraus, Yang Guo, Prashanth Kothnur, Farzad Houshmand, Bencherki Mebarki, John Joseph Mazzocco, Thomas Brezoczky
  • Publication number: 20200411354
    Abstract: Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.
    Type: Application
    Filed: June 12, 2020
    Publication date: December 31, 2020
    Inventors: Shreesha Yogish RAO, Mukund SUNDARARAJAN, Cheng-Hsiung Matthew TSAI, Manjunatha P. KOPPA, Steven V. SANSONI
  • Publication number: 20200385851
    Abstract: Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.
    Type: Application
    Filed: May 1, 2020
    Publication date: December 10, 2020
    Inventors: Alexander N. LERNER, Roey SHAVIV, Michael P. KARAZIM, Kevin Vincent MORAES, Steven V. SANSONI, Andrew J. CONSTANT, Jeffrey Allen BRODINE, Kim Ramkumar VELLORE, Amikam SADE, Niranjan KUMAR
  • Patent number: 10704147
    Abstract: Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: July 7, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Muhammad M. Rasheed, Muhannad Mustafa, Hamid Tavassoli, Steven V Sansoni, Cheng-Hsiung Tsai, Vikash Banthia
  • Publication number: 20200051794
    Abstract: Methods and apparatus for low angle, selective plasma deposition on a substrate. A plasma chamber uses a process chamber having an inner processing volume, a three dimensional (3D) magnetron with a sputtering target with a hollow inner area that overlaps at least a portion of sides of the sputtering target and moves in a linear motion over a length of the sputtering target, a housing surrounding the 3D magnetron and the sputtering target such that at least one side of the housing exposes the hollow inner area of the sputtering target, and a linear channel interposed between the housing and a wall of the process chamber.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 13, 2020
    Inventors: ANANTHA K. SUBRAMANI, PRABURAM RAJA, STEVEN V. SANSONI, JOHN FORSTER, PHILIP KRAUS, YANG GUO, PRASHANTH KOTHNUR, FARZAD HOUSHMAND, BENCHERKI MEBARKI, JOHN JOSEPH MAZZOCCO, THOMAS BREZOCZKY
  • Patent number: 10431489
    Abstract: Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes: a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: October 1, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Pulkit Agarwal, Song-Moon Suh, Glen Mori, Steven V. Sansoni
  • Publication number: 20190267275
    Abstract: Embodiments of substrate transfer robot blades to engage and support a substrate during transfer are provided herein. In some embodiments, a substrate transfer robot may include a blade body having a blade support surface; and a plurality of compliant pads, each comprising a contact surface and an opposite bottom surface supported by the body and arranged to support a substrate when disposed on the substrate transfer robot blade.
    Type: Application
    Filed: May 7, 2019
    Publication date: August 29, 2019
    Inventors: STEVEN V. SANSONI, JEFFREY BRODINE, GLEN MORI
  • Patent number: 10312127
    Abstract: Embodiments of substrate transfer robot blades to engage and support a substrate during transfer are provided herein. In some embodiments, a substrate transfer robot may include a blade body having a blade support surface; and a plurality of compliant pads, each comprising a contact surface and an opposite bottom surface supported by the body and arranged to support a substrate when disposed on the substrate transfer robot blade.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: June 4, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Steven V. Sansoni, Jeffrey Brodine, Glen Mori
  • Patent number: 10312116
    Abstract: Methods and apparatus for changing the temperature of a substrate are provided. In some embodiments, a method includes: placing a substrate onto a support surface of a substrate support disposed within an inner volume of a cooling chamber; moving at least one of the substrate support or a plate disposed in the cooling chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; flowing a gas into the second volume to increase a pressure within the second volume; and flowing a coolant through a plurality of channels disposed in at least one of the substrate support or the plate to cool the substrate.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: June 4, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jallepally Ravi, Steven V. Sansoni, Kirankumar Savandaiah
  • Publication number: 20180155838
    Abstract: Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.
    Type: Application
    Filed: February 1, 2017
    Publication date: June 7, 2018
    Inventors: Muhammad M. RASHEED, Muhannad MUSTAFA, Hamid TAVASSOLI, Steven V. SANSONI, Cheng-Hsiung TSAI, Vikash Banthia
  • Publication number: 20180025924
    Abstract: Methods and apparatus for changing the temperature of a substrate are provided. In some embodiments, a method includes: placing a substrate onto a support surface of a substrate support disposed within an inner volume of a cooling chamber; moving at least one of the substrate support or a plate disposed in the cooling chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; flowing a gas into the second volume to increase a pressure within the second volume; and flowing a coolant through a plurality of channels disposed in at least one of the substrate support or the plate to cool the substrate.
    Type: Application
    Filed: October 2, 2017
    Publication date: January 25, 2018
    Inventors: Jallepally Ravi, Steven V. Sansoni, Kirankumar Savandaiah
  • Patent number: D891382
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: July 28, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Manjunatha P. Koppa, Aravind Kamath, Cheng-Hsiung Matt Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni, David Or
  • Patent number: D933725
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: October 19, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Manjunatha P. Koppa, Aravind Kamath, Cheng-Hsiung Matt Tsai, Manjunath H. Venkataswamappa, Steven V. sansoni, David Or
  • Patent number: D942516
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: February 1, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Manjunatha P. Koppa, Aravind Kamath, Cheng-Hsiung Matt Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni, David Or
  • Patent number: D947914
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: April 5, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shreesha Yogish Rao, Mukund Sundararajan, Cheng-Hsiung Matthew Tsai, Manjunatha P. Koppa, Steven V. Sansoni
  • Patent number: D960216
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: August 9, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shreesha Yogish Rao, Mukund Sundararajan, Cheng-Hsiung Matthew Tsai, Manjunatha P. Koppa, Steven V. Sansoni