Patents by Inventor Steven V. Sansoni
Steven V. Sansoni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170254Abstract: Embodiments of the disclosure are directed to PEALD batch processing chambers. Some embodiments are directed to processing chambers having one or more inductively coupled plasma (ICP) coils electrically connected to at least one RF power source. Some embodiments are directed to processing chambers having a wafer cassette comprising a plurality of platforms, each platform configured to support at least one wafer for processing, and one or more RF power sources electrically connected to the plurality of platforms in the wafer cassette. In some embodiments, the plurality of platforms have a first set of electrodes having a first polarity and a second set of electrodes having a second polarity, and one or more RF power sources electrically connected to the plurality of platforms in the wafer cassette.Type: ApplicationFiled: November 21, 2022Publication date: May 23, 2024Applicant: Applied Materials, Inc.Inventors: Jianming Fu, Tza-Jing Gung, Sanjeev Baluja, Haitao Wang, Mandyam Sriram, Srinivas Gandikota, Steven V. Sansoni
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Patent number: 11887878Abstract: Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.Type: GrantFiled: June 12, 2020Date of Patent: January 30, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Shreesha Yogish Rao, Mukund Sundararajan, Cheng-Hsiung Matthew Tsai, Manjunatha P. Koppa, Steven V. Sansoni
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Patent number: 11414740Abstract: Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.Type: GrantFiled: May 1, 2020Date of Patent: August 16, 2022Assignee: Applied Materials, Inc.Inventors: Alexander N. Lerner, Roey Shaviv, Michael P. Karazim, Kevin Vincent Moraes, Steven V. Sansoni, Andrew J. Constant, Jeffrey Allen Brodine, Kim Ramkumar Vellore, Amikam Sade, Niranjan Kumar
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Patent number: 11348823Abstract: Substrate transfer robot blades used to engage and support a substrate during transfer include a blade body having a blade support surface and at least one pad having a top surface and an opposite bottom surface, a central opening extending from the top surface to the bottom surface, and a resilient portion formed from the at least one pad. The resilient portion formed from the at least one pad extends from and cantilevers from a side surface of the central opening of the at least one pad that is disposed directly on the side surface at the end of a long axis of the resilient portion. The resilient portion further includes a curved substrate contact surface on an outermost end of the resilient portion on which a substrate is supported when disposed on the substrate transfer robot blade.Type: GrantFiled: May 7, 2019Date of Patent: May 31, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Steven V. Sansoni, Jeffrey Brodine, Glen Mori
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Patent number: 11170982Abstract: Methods and apparatus for low angle, selective plasma deposition on a substrate. A plasma chamber uses a process chamber having an inner processing volume, a three dimensional (3D) magnetron with a sputtering target with a hollow inner area that overlaps at least a portion of sides of the sputtering target and moves in a linear motion over a length of the sputtering target, a housing surrounding the 3D magnetron and the sputtering target such that at least one side of the housing exposes the hollow inner area of the sputtering target, and a linear channel interposed between the housing and a wall of the process chamber.Type: GrantFiled: August 1, 2019Date of Patent: November 9, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Anantha K. Subramani, Praburam Raja, Steven V. Sansoni, John Forster, Philip Kraus, Yang Guo, Prashanth Kothnur, Farzad Houshmand, Bencherki Mebarki, John Joseph Mazzocco, Thomas Brezoczky
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Publication number: 20200411354Abstract: Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.Type: ApplicationFiled: June 12, 2020Publication date: December 31, 2020Inventors: Shreesha Yogish RAO, Mukund SUNDARARAJAN, Cheng-Hsiung Matthew TSAI, Manjunatha P. KOPPA, Steven V. SANSONI
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Publication number: 20200385851Abstract: Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.Type: ApplicationFiled: May 1, 2020Publication date: December 10, 2020Inventors: Alexander N. LERNER, Roey SHAVIV, Michael P. KARAZIM, Kevin Vincent MORAES, Steven V. SANSONI, Andrew J. CONSTANT, Jeffrey Allen BRODINE, Kim Ramkumar VELLORE, Amikam SADE, Niranjan KUMAR
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Patent number: 10704147Abstract: Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.Type: GrantFiled: February 1, 2017Date of Patent: July 7, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Muhammad M. Rasheed, Muhannad Mustafa, Hamid Tavassoli, Steven V Sansoni, Cheng-Hsiung Tsai, Vikash Banthia
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Publication number: 20200051794Abstract: Methods and apparatus for low angle, selective plasma deposition on a substrate. A plasma chamber uses a process chamber having an inner processing volume, a three dimensional (3D) magnetron with a sputtering target with a hollow inner area that overlaps at least a portion of sides of the sputtering target and moves in a linear motion over a length of the sputtering target, a housing surrounding the 3D magnetron and the sputtering target such that at least one side of the housing exposes the hollow inner area of the sputtering target, and a linear channel interposed between the housing and a wall of the process chamber.Type: ApplicationFiled: August 1, 2019Publication date: February 13, 2020Inventors: ANANTHA K. SUBRAMANI, PRABURAM RAJA, STEVEN V. SANSONI, JOHN FORSTER, PHILIP KRAUS, YANG GUO, PRASHANTH KOTHNUR, FARZAD HOUSHMAND, BENCHERKI MEBARKI, JOHN JOSEPH MAZZOCCO, THOMAS BREZOCZKY
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Patent number: 10431489Abstract: Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes: a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive.Type: GrantFiled: November 26, 2014Date of Patent: October 1, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Pulkit Agarwal, Song-Moon Suh, Glen Mori, Steven V. Sansoni
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Publication number: 20190267275Abstract: Embodiments of substrate transfer robot blades to engage and support a substrate during transfer are provided herein. In some embodiments, a substrate transfer robot may include a blade body having a blade support surface; and a plurality of compliant pads, each comprising a contact surface and an opposite bottom surface supported by the body and arranged to support a substrate when disposed on the substrate transfer robot blade.Type: ApplicationFiled: May 7, 2019Publication date: August 29, 2019Inventors: STEVEN V. SANSONI, JEFFREY BRODINE, GLEN MORI
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Patent number: 10312127Abstract: Embodiments of substrate transfer robot blades to engage and support a substrate during transfer are provided herein. In some embodiments, a substrate transfer robot may include a blade body having a blade support surface; and a plurality of compliant pads, each comprising a contact surface and an opposite bottom surface supported by the body and arranged to support a substrate when disposed on the substrate transfer robot blade.Type: GrantFiled: September 16, 2014Date of Patent: June 4, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Steven V. Sansoni, Jeffrey Brodine, Glen Mori
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Patent number: 10312116Abstract: Methods and apparatus for changing the temperature of a substrate are provided. In some embodiments, a method includes: placing a substrate onto a support surface of a substrate support disposed within an inner volume of a cooling chamber; moving at least one of the substrate support or a plate disposed in the cooling chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; flowing a gas into the second volume to increase a pressure within the second volume; and flowing a coolant through a plurality of channels disposed in at least one of the substrate support or the plate to cool the substrate.Type: GrantFiled: October 2, 2017Date of Patent: June 4, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Jallepally Ravi, Steven V. Sansoni, Kirankumar Savandaiah
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Publication number: 20180155838Abstract: Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.Type: ApplicationFiled: February 1, 2017Publication date: June 7, 2018Inventors: Muhammad M. RASHEED, Muhannad MUSTAFA, Hamid TAVASSOLI, Steven V. SANSONI, Cheng-Hsiung TSAI, Vikash Banthia
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Publication number: 20180025924Abstract: Methods and apparatus for changing the temperature of a substrate are provided. In some embodiments, a method includes: placing a substrate onto a support surface of a substrate support disposed within an inner volume of a cooling chamber; moving at least one of the substrate support or a plate disposed in the cooling chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; flowing a gas into the second volume to increase a pressure within the second volume; and flowing a coolant through a plurality of channels disposed in at least one of the substrate support or the plate to cool the substrate.Type: ApplicationFiled: October 2, 2017Publication date: January 25, 2018Inventors: Jallepally Ravi, Steven V. Sansoni, Kirankumar Savandaiah
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Patent number: D891382Type: GrantFiled: February 8, 2019Date of Patent: July 28, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Manjunatha P. Koppa, Aravind Kamath, Cheng-Hsiung Matt Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni, David Or
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Patent number: D933725Type: GrantFiled: February 8, 2019Date of Patent: October 19, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Manjunatha P. Koppa, Aravind Kamath, Cheng-Hsiung Matt Tsai, Manjunath H. Venkataswamappa, Steven V. sansoni, David Or
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Patent number: D942516Type: GrantFiled: February 8, 2019Date of Patent: February 1, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Manjunatha P. Koppa, Aravind Kamath, Cheng-Hsiung Matt Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni, David Or
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Patent number: D947914Type: GrantFiled: November 23, 2020Date of Patent: April 5, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Shreesha Yogish Rao, Mukund Sundararajan, Cheng-Hsiung Matthew Tsai, Manjunatha P. Koppa, Steven V. Sansoni
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Patent number: D960216Type: GrantFiled: March 11, 2022Date of Patent: August 9, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Shreesha Yogish Rao, Mukund Sundararajan, Cheng-Hsiung Matthew Tsai, Manjunatha P. Koppa, Steven V. Sansoni