Abstract: A display device including a substrate including a display area and a non-display area, a plurality of signal lines disposed in the display area and extending along a first direction and from the non-display area to the display area, a connection line extending from the non-display area and electrically connected to a respective signal line of the plurality of signal lines in the non-display area, and an initialization voltage line extending in a second direction intersecting the first direction, wherein the connection line overlaps the initialization voltage line in a thickness direction of the display device.

Abstract: An embodiment provides a lighting device comprising: a body having a first opening at a central part thereof; a light source member, which is disposed on the body and includes a circuit board having a plurality of light-emitting elements arranged thereon; and a cover disposed on the light source member and coupled to the body, wherein the circuit board comprises at least one second opening vertically overlapping the first opening and at least one first protrusion protruding toward the inside of the second opening from a side surface of the second opening, and at least one of the light-emitting elements is mounted on the first protrusion.

Abstract: An assembly unit includes side plate having first coupling member on first side, second coupling member on second side, and third coupling member on each of third and fourth sides, top plate including fourth coupling member and top stud, and bottom plate including fifth coupling member and bottom stud. The first coupling member is engaged with the second coupling member of neighboring side plate. The fourth coupling member is engaged with the third coupling member. The fifth coupling member is engaged with the third coupling member. The first coupling member includes protrusion. The second coupling member includes groove. The protrusion is fitted into the groove of the neighboring side plate. The third coupling member includes thread. Each of the fourth and fifth coupling members includes thread. The fourth and fifth coupling members are engaged with the third coupling member in a screwed manner using the threads.

Abstract: A display device including a display area and a non-display area, a substrate including a through hole in the display area, an element layer including an anode disposed on the substrate, a light emitting layer disposed on the anode, and a cathode disposed on the light emitting layer, and a thin-film encapsulation layer including a first inorganic layer disposed on the element layer, an organic layer disposed on the first inorganic layer, and a second inorganic layer disposed on the organic layer, in which the first inorganic layer includes a plurality of first refractors having a first inclination angle.

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

Abstract: An assembly unit includes side plate having first coupling member on first side, second coupling member on second side, and third coupling member on each of third and fourth sides, top plate including fourth coupling member and top stud, and bottom plate including fifth coupling member and bottom stud. The first coupling member is engaged with the second coupling member of neighboring side plate. The fourth coupling member is engaged with the third coupling member. The fifth coupling member is engaged with the third coupling member. The first coupling member includes protrusion. The second coupling member includes groove. The protrusion is fitted into the groove of the neighboring side plate. The third coupling member includes thread. Each of the fourth and fifth coupling members includes thread. The fourth and fifth coupling members are engaged with the third coupling member in a screwed manner using the threads.

Abstract: A display device includes a flat area, and a first bending area at which the display device is bendable, the first bending area including in order in a direction away from the flat area, a first upper bending portion, a first extending portion, and a first lower bending portion, a light-emitting element including an emission layer in the flat area and in the first upper bending portion and with which an image is displayable in both the flat area and the first upper bending portion, and an inorganic layer in the flat area and the in the first bending area. A thickness of the inorganic layer in each of the first upper bending portion, the first extending portion and the first lower bending portion of the first bending area is smaller than a thickness of the inorganic layer in the flat area.

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.

Abstract: An apparatus for attaching a pad on or to an edge ring includes a chamber defining a space for attaching a pad on or to an edge ring, a pad support within the chamber and supporting the pad thereon, an edge ring support within the chamber and facing the pad support, the edge ring support securing the edge ring thereon, a driving system connected to at least one of the pad support and the edge ring support and configured to move the edge ring support relative to the pad support, and a vacuum exhaust system configured to create a vacuum atmosphere within the chamber.

Abstract: A fan-out semiconductor package includes a core member having a through-hole. A semiconductor chip is in the through-hole and has an active surface with connection pads and an inactive surface opposing the active surface. An encapsulant encapsulates at least portions of the core member and the semiconductor chip and fills at least a portion of the through-hole. A connection member is on the core member and the active surface of the semiconductor chip and includes a redistribution layer electrically connected to the connection pads. The core member includes a groove portion penetrating from a wall of the through-hole up to an outer side surface of the core member in a lower portion of the core member on which the connection member is disposed.

Abstract: A flexible display panel of an expandable display device includes a first side with a display unit, and a second side opposite to the first side. A bending guide includes an external guide that faces part of the first side and has a first curved side, and an internal guide that faces part of the second side and has a second curved side. A slider that slides on the bending guide is attached to one end portion of the flexible display panel. A radius of the first curved side is greater than a radius of the second curved side. When the slider moves toward the bending guide, the first side contacts the first curved side and is bent by the first curved side, and when the slider moves away from the bending guide, the second side contacts the second curved side and is bent by the second curved side.

Abstract: A display device includes a substrate including a pixel region and a peripheral region. The display device also includes a plurality of pixels provided in the pixel region for displaying an image. The display device also includes a light emitting element provided in each pixel for emitting light. The display device includes a first transistor provided in each pixel for driving the light emitting element, and a second transistor connected to the first transistor. The display device includes an insulating layer disposed between a second semiconductor layer of the second transistor and the substrate; and a crack blocking layer disposed between the insulating layer and the second semiconductor layer of the second transistor. A first semiconductor layer of the first transistor and the second semiconductor layer of the second transistor are provided in layers different from each other.

Abstract: Disclosed are an apparatus for estimating a pedestrian position based on pedestrian motion recognition, and a method therefor. The method for estimating the pedestrian position based on pedestrian motion recognition includes recognizing a specific motion of a plurality of motions of the pedestrian, performing a unique pedestrian dead-reckoning (PDR) technique corresponding to the recognized specific motion among unique PDR techniques for each of the plurality of motions of the pedestrian, and estimating the pedestrian's position by the performed unique PDR technique.

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

Abstract: A flexible display panel of an expandable display device includes a first side with a display unit, and a second side opposite to the first side. A bending guide includes an external guide that faces part of the first side and has a first curved side, and an internal guide that faces part of the second side and has a second curved side. A slider that slides on the bending guide is attached to one end portion of the flexible display panel. A radius of the first curved side is greater than a radius of the second curved side. When the slider moves toward the bending guide, the first side contacts the first curved side and is bent by the first curved side, and when the slider moves away from the bending guide, the second side contacts the second curved side and is bent by the second curved side.

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.

Abstract: A fan-out semiconductor package includes a core member having a through-hole. A semiconductor chip is in the through-hole and has an active surface with connection pads and an inactive surface opposing the active surface. An encapsulant encapsulates at least portions of the core member and the semiconductor chip and fills at least a portion of the through-hole. A connection member is on the core member and the active surface of the semiconductor chip and includes a redistribution layer electrically connected to the connection pads. The core member includes a groove portion penetrating from a wall of the through-hole up to an outer side surface of the core member in a lower portion of the core member on which the connection member is disposed.

Abstract: An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a component disposition region defined by an inner wall of the frame surrounding the electronic component, and an encapsulant filling at least a portion of the component disposition region. A portion of the inner wall of the frame forms a protrusion protruding toward the electronic component.

Abstract: A flexible organic light-emitting diode display and a method of manufacturing the same are disclosed. In one aspect, the display includes a substrate formed of a first material including a metal and an OLED formed over the substrate.