Patents by Inventor Sun Ho Kim

Sun Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component package and method of manufacturing the same
    Patent number: 9905526
    Abstract: An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: February 27, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyoung Moo Harr, Ji Hoon Kim, Kyung Seob Oh, Sun Ho Kim
  • Link structure
    Patent number: 9889556
    Abstract: A link structure includes a first link, a second link having an end that is connected to an end of the first link, a third link having an end that is connected to the end of the first link, and provided on a portion of the second link, a first rotary shaft partially provided in the first link, a first actuator configured to rotate the first link about the first rotary shaft; a second rotary shaft partially provided in the second link, the second rotary shaft being different from the first rotary shaft, and a second actuator configured to rotate the second link about the second rotary shaft, the first and second actuators being provided in the first link.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: February 13, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sun-Ho Kim, Ki-Hoon Nam, Tae-Min Earmme, Seok Heo, Jae-Chul Hwang
  • ROLLABLE DISPLAY DEVICE
    Publication number: 20180014415
    Abstract: A rollable display device includes a roller, a display panel configured to be wound around the roller in a wound-up configuration and to display an image in an unwound configuration, a housing configured to house the display panel in the wound-up configuration and the roller, and a roller controller connected to the roller and configured to change a radius of the roller.
    Type: Application
    Filed: June 19, 2017
    Publication date: January 11, 2018
    Inventors: JIN HWAN CHOI, Sun Ho Kim, Jeong Ho Kim, Bo Ik Park, Tae An Seo, Jung Hun Lee
  • ROLLABLE DISPLAY DEVICE
    Publication number: 20170359911
    Abstract: A rollable display device includes a roller, a rollable display that is rollable onto the roller in a first direction, and a plurality of thin plates positioned at a rear surface of the rollable display, the thin plates being rollable onto the roller in the first direction along with the rollable display.
    Type: Application
    Filed: June 1, 2017
    Publication date: December 14, 2017
    Inventors: Khachatryan HAYK, Ki Hyun KIM, Sun Ho KIM, Jeong Ho KIM, Tae Woong KIM, Jung Hun LEE
  • Method for forming PN junction in graphene with application of DNA and PN junction structure formed using the same
    Patent number: 9831452
    Abstract: A method for forming a PN junction in graphene includes: forming a graphene layer, and forming a DNA molecule layer on a partial region of the graphene layer, the DNA molecule layer having a nucleotide sequence structure designed to provide the graphene layer with a predetermined doping property upon adsorption on the graphene layer. The DNA molecule has a nucleotide sequence structure designed for doping of graphene so that doped graphene has a specific semiconductor property. The DNA molecule is coated on the surface of the graphene layer of which the partial region is exposed by micro patterning, and thereby, PN junctions of various structures may be formed by a region coated with the DNA molecule and a non-coated region in the graphene layer.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: November 28, 2017
    Assignee: Korea Institute of Science and Technology
    Inventors: Chulki Kim, Yeong Jun Kim, Young Mo Jung, Seong Chan Jun, Taikjin Lee, Seok Lee, Young Tae Byun, Deok Ha Woo, Sun Ho Kim, Min Ah Seo, Jae Hun Kim, Jong Chang Yi
  • Antenna module package, antenna module package circuit, battery pack including the same and mobile device including the same
    Patent number: 9767450
    Abstract: Provided is an antenna module package including a substrate, a wireless card payment antenna structure mounted on the substrate and including a first antenna chip and wireless card payment matching elements electrically connected to the first antenna chip, a near field communication (NFC) antenna structure mounted on the substrate, sharing the first antenna chip, and including an extended NFC antenna loop and NFC matching elements electrically connected to the first antenna chip, and a wireless charging antenna structure mounted on the substrate and including a second antenna chip, and an extended wireless charging antenna loop and wireless charging matching elements electrically connected to the second antenna chip.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: September 19, 2017
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyeok Hwi Na, Ho Seok Hwang, Young Seok Kim, Seong Beom Park, Sang Hoon Ahn, Sun Ho Kim
  • Display panel and method of fabricating the same
    Patent number: 9755184
    Abstract: A display panel includes a thin film transistor substrate and a display layer disposed on the thin film transistor substrate and having a display. The thin film transistor substrate may include a base substrate, a stress relief layer disposed on the base substrate and including at least one stress relief pattern, and a driver layer disposed on the stress relief layer and including at least one thin film transistor coupled to the display.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: September 5, 2017
    Assignee: Samsung Display Co., Ltd.
    Inventors: Bo Ik Park, Sun Ho Kim, Tae Woong Kim, Pil Suk Lee
  • Lighting device
    Patent number: 9739469
    Abstract: A lighting device including: a light emitting module; a heat sink which is disposed on the light emitting module; a heat sink fan which is disposed over the heat sink; an upper case which covers the heat sink fan and the heat sink; and a lower case which is coupled to the upper case and fixes the light emitting module. A first air inlet is disposed in the lower case. A second air inlet is disposed in the upper case.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: August 22, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: In Soo Park, Sun Ho Kim, Jae O Kwak, Seung Kyun Hong
  • ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY
    Publication number: 20170222176
    Abstract: An organic light emitting device includes a substrate. An organic light emitting diode is disposed on the substrate. A thin film encapsulation layer is disposed over the organic light emitting diode. The thin film encapsulation layer includes at least one organic layer. An organic passivation layer is disposed directly on the thin film encapsulation layer. The organic passivation layer has a smaller Young's modulus than the organic layer of the thin film encapsulation layer.
    Type: Application
    Filed: January 19, 2017
    Publication date: August 3, 2017
    Inventors: KHACHATRYAN HAYK, KI HYUN KIM, SUN HO KIM, JEONG HO KIM, TAE WOONG KIM, DAN BI CHOI
  • ELECTRONIC COMPONENT PACKAGE
    Publication number: 20170178992
    Abstract: An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a component disposition region defined by an inner wall of the frame surrounding the electronic component, and an encapsulant filling at least a portion of the component disposition region. A portion of the inner wall of the frame forms a protrusion protruding toward the electronic component.
    Type: Application
    Filed: July 8, 2016
    Publication date: June 22, 2017
    Inventors: Sung Won JEONG, Ji Hoon KIM, Sun Ho KIM, Shang Hoon SEO, Seung Yeop KOOK, Christian ROMERO
  • Electronic device capable of NFC communication
    Patent number: 9680973
    Abstract: Disclosed is an electronic device capable of near field communication (NFC) and of achieving high integration, size reduction, and good sensitivity. The electronic device includes an antenna chip provided inside a battery protection circuit package of a battery pack and having embedded an NFC antenna therein, and an extended antenna loop electrically connected to the antenna chip and provided outside the battery protection circuit package.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: June 13, 2017
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyeok Hwi Na, Ho Seok Hwang, Young Seok Kim, Seong Beom Park, Sang Hoon Ahn, Sun Ho Kim
  • Method of manufacturing flexible display panel and method of manufacturing flexible display apparatus
    Patent number: 9664935
    Abstract: A method of manufacturing a flexible display panel includes forming an adhesive layer by depositing an inorganic material on a flexible substrate, forming a hydroxyl group on a surface of the adhesive layer by modifying the surface of the adhesive layer, laminating a glass substrate to the modified surface of the adhesive layer and forming a heat-treated layer by heating the glass substrate and the adhesive layer.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: May 30, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Sun-Ho Kim
  • FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20170133309
    Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.
    Type: Application
    Filed: October 27, 2016
    Publication date: May 11, 2017
    Inventors: Sun Ho KIM, Ji Hoon KIM, Ha Young AHN, Shang Hoon SEO, Seung Yeop KOOK, Sung Won JEONG
  • FLEXIBLE DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20170125453
    Abstract: Disclosed herein is a flexible display device, including: a substrate that comprises a first surface and a second surface which is an opposite surface to the first surface; a light-emitting device disposed on the first surface; a reduction layer disposed on the second surface; and a barrier layer disposed between the second surface and the reduction layer.
    Type: Application
    Filed: September 20, 2016
    Publication date: May 4, 2017
    Inventors: Khachatryan HAYK, Ki Hyun KIM, Sun Ho Kim, Jeong Ho KIM, Tae Woong KIM, Yeon Gon MO, Dan Bi CHOI
  • ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20170125318
    Abstract: An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.
    Type: Application
    Filed: June 24, 2016
    Publication date: May 4, 2017
    Inventors: Kyoung Moo HARR, Ji Hoon KIM, Kyung Seob OH, Sun Ho KIM
  • Electronic device module and manufacturing method thereof
    Patent number: 9633923
    Abstract: There are provided an electronic device module capable of increasing a degree of integration by mounting electronic components on both surfaces of a board, and a manufacturing method thereof. The electronic device module includes a board having mounting electrodes formed on both surfaces thereof, a plurality of electronic devices mounted on the mounting electrodes, a molded portion sealing the electronic devices, at least one connection wire having one end bonded to one surface of the board and the other end exposed to the outside of the molded portion, and an external connection terminal coupled to the other end of the connection wire.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: April 25, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Do Jae Yoo, Jae Hyun Lim, Sun Ho Kim
  • GAS SENSOR AND METHOD OF FABRICATING THE SAME
    Publication number: 20170082574
    Abstract: A gas sensor and a method of fabricating the same are provided. The gas sensor includes a substrate, carbon nanotubes (CNTs) adsorbed onto the substrate, platinum nanoparticles (NPs) decorated to surfaces of the CNTs, and an electrode formed on the substrate onto which the CNTs with the platinum NPs decorated thereto are adsorbed. When the platinum NPs and CNTs are used as a sensing material, the gas sensor can be useful in sensing gases with high sensitivity even when present at a low concentration of at least 2 ppm and stably sensing noxious gases such as C6H6, C7H8, C3H6O, CO, NO, and NH3 as well as NO2, and can have particularly excellent selectivity and response characteristics with respect to NO2 gas.
    Type: Application
    Filed: September 1, 2016
    Publication date: March 23, 2017
    Applicant: Korea Institute of Science and Technology
    Inventors: Young Tae BYUN, Jae Seong KIM, Je Haeng LEE, Sun Ho KIM, Young Min JHON, Sun Woo CHOI
  • Deposition apparatus, method for forming thin film using the same, organic light emitting display apparatus and method for manufacturing the same
    Patent number: 9590207
    Abstract: A deposition apparatus is configured to form a deposition layer on a substrate. The deposition apparatus includes a deposition source configured to face a first side of the substrate and to spray one or more depositing materials toward the substrate, a cooling stage configured to support a second side of the substrate that is opposite from the first side of the substrate, and a hardening unit configured to harden the one or more depositing materials sprayed from the deposition source and that have reached the substrate. A method of forming a thin film deposition layer on a substrate by using a deposition apparatus is also provided. The method includes spraying one or more depositing materials toward the substrate by using a deposition source of the deposition apparatus while the substrate is on a cooling stage of the deposition apparatus.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: March 7, 2017
    Assignee: Samsung Display Co., Ltd.
    Inventors: Myung-Soo Huh, Sun-Ho Kim, Hyun-Woo Joo, Jae-Hyun Kim
  • Electronic component module and manufacturing method thereof
    Patent number: 9585260
    Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: February 28, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hyun Lim, Jong In Ryu, Sun Ho Kim, Eun Jung Jo, Kyu Hwan Oh, Do Jae Yoo
  • ELECTRONIC DEVICE AND METHOD FOR DISASSEMBLING THE ELECTRONIC DEVICE
    Publication number: 20170023973
    Abstract: An electronic device and a method for disassembling the electronic device are provided. The electronic device includes a housing including at least one of a first plate or a second plate, when the housing includes the first plate and the second plate, the second plate faces in an opposite direction to the first plate, a substrate disposed between the first and second plates in substantially parallel with the first and second plates, a first attachment layer disposed between the first plate and the substrate, and a second attachment layer disposed between the second plate and the substrate. When the first and second attachment layers are seen from above the first plate, the first and second attachment layers overlap with each other at least partially, and one of the first and second attachment layer includes at least one tear line extended at least partially across the one attachment layer.
    Type: Application
    Filed: June 17, 2016
    Publication date: January 26, 2017
    Inventors: Sun-Ho KIM, Chul-Hyung YANG, Ji-Woo LEE