Patents by Inventor Sun Ho Kim

Sun Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10446481
    Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: October 15, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
  • Patent number: 10426046
    Abstract: A rollable display device includes a roller, a rollable display that is rollable onto the roller in a first direction, and a plurality of thin plates positioned at a rear surface of the rollable display, the thin plates being rollable onto the roller in the first direction along with the rollable display.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: September 24, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Khachatryan Hayk, Ki Hyun Kim, Sun Ho Kim, Jeong Ho Kim, Tae Woong Kim, Jung Hun Lee
  • Publication number: 20190240590
    Abstract: An assembly unit includes side plate having first coupling member on first side, second coupling member on second side, and third coupling member on each of third and fourth sides, top plate including fourth coupling member and top stud, and bottom plate including fifth coupling member and bottom stud. The first coupling member is engaged with the second coupling member of neighboring side plate. The fourth coupling member is engaged with the third coupling member. The fifth coupling member is engaged with the third coupling member. The first coupling member includes protrusion. The second coupling member includes groove. The protrusion is fitted into the groove of the neighboring side plate. The third coupling member includes thread. Each of the fourth and fifth coupling members includes thread. The fourth and fifth coupling members are engaged with the third coupling member in a screwed manner using the threads.
    Type: Application
    Filed: October 4, 2018
    Publication date: August 8, 2019
    Inventors: Seok LEE, Taikjin Lee, Jeong Hun Shin, Won Kyo JEONG, Sun Ho KIM, Hyunsoo CHUNG, Hyunduk Kim, Yong-Joon PARK, Deokha WOO
  • Patent number: 10373887
    Abstract: A fan-out semiconductor package includes a core member having a through-hole. A semiconductor chip is in the through-hole and has an active surface with connection pads and an inactive surface opposing the active surface. An encapsulant encapsulates at least portions of the core member and the semiconductor chip and fills at least a portion of the through-hole. A connection member is on the core member and the active surface of the semiconductor chip and includes a redistribution layer electrically connected to the connection pads. The core member includes a groove portion penetrating from a wall of the through-hole up to an outer side surface of the core member in a lower portion of the core member on which the connection member is disposed.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: August 6, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Soo Ha, Hyeon Seok Lee, Sun Ho Kim
  • Publication number: 20190194730
    Abstract: The present invention relates to a quencher having a quenching effect on a fluorescent material exhibiting luminescence characteristics at an excited energy level, and various uses thereof.
    Type: Application
    Filed: November 23, 2018
    Publication date: June 27, 2019
    Inventors: Do-Min LEE, Seung-Soo LEE, Jin-Hee PARK, Sun-Ho KIM, Goutam Masanta, Jong-Tae JE
  • Patent number: 10274995
    Abstract: A rollable display device includes: a panel supporting portion including a plurality of supporters arranged in substantially parallel relationship and a plurality of hinge linking portions rotatably connecting adjacent supporters to one another, and having rolled and unrolled configurations; a flexible display panel having a display area disposed on the panel supporting portion and a non-display area outside the display area; and a driving module including a flexible circuit board having a bent portion and connected to the non-display area, and a printed circuit board (PCB) connected to the flexible circuit board. The plurality of supporters includes a housing disposed at an outermost side of the rollable display device. The housing has a hole through which the non-display area passes and a chamber communicating with the hole and receiving the driving module. A sealant is disposed between the flexible display panel and the housing at the outside of the hole.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: April 30, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae An Seo, Sun Ho Kim, Jung Hun Lee, Jin Hwan Choi
  • Patent number: 10264687
    Abstract: A rollable display device includes a roller, a display panel configured to be wound around the roller in a wound-up configuration and to display an image in an unwound configuration, a housing configured to house the display panel in the wound-up configuration and the roller, and a roller controller connected to the roller and configured to change a radius of the roller.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: April 16, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jin Hwan Choi, Sun Ho Kim, Jeong Ho Kim, Bo Ik Park, Tae An Seo, Jung Hun Lee
  • Patent number: 10256430
    Abstract: An organic light emitting device includes a substrate. An organic light emitting diode is disposed on the substrate. A thin film encapsulation layer is disposed over the organic light emitting diode. The thin film encapsulation layer includes at least one organic layer. An organic passivation layer is disposed directly on the thin film encapsulation layer. The organic passivation layer has a smaller Young's modulus than the organic layer of the thin film encapsulation layer.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Khachatryan Hayk, Ki Hyun Kim, Sun Ho Kim, Jeong Ho Kim, Tae Woong Kim, Dan Bi Choi
  • Publication number: 20190088566
    Abstract: A fan-out semiconductor package includes a core member having a through-hole. A semiconductor chip is in the through-hole and has an active surface with connection pads and an inactive surface opposing the active surface. An encapsulant encapsulates at least portions of the core member and the semiconductor chip and fills at least a portion of the through-hole. A connection member is on the core member and the active surface of the semiconductor chip and includes a redistribution layer electrically connected to the connection pads. The core member includes a groove portion penetrating from a wall of the through-hole up to an outer side surface of the core member in a lower portion of the core member on which the connection member is disposed.
    Type: Application
    Filed: February 13, 2018
    Publication date: March 21, 2019
    Inventors: Seung Soo HA, Hyeon Seok LEE, Sun Ho KIM
  • Patent number: 10188961
    Abstract: An assembly unit includes a side plate having a plate shape and including a first coupling member on first side, a second coupling member on second side, and a third coupling member on each of third side and fourth side, a top plate having a plate shape and including a fourth coupling member on each side and a top stud on the top surface, and a bottom plate having a plate shape and including a fifth coupling member on each side and a bottom stud on the bottom surface. The first coupling member includes a protrusion. The second coupling member includes a groove. When the first coupling member of the side plate is engaged with the second coupling member of a neighboring side plate of the same type as the side plate, the protrusion of the side plate is fitted into the groove of the neighboring side plate.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: January 29, 2019
    Assignee: CREAMO INC.
    Inventors: Seok Lee, Taikjin Lee, Jeong Hun Shin, Won Kyo Jeong, Sun Ho Kim, Hyunsoo Chung, Hyunduk Kim, Yong-Joon Park, Deokha Woo
  • Patent number: 10194543
    Abstract: An expandable display device includes: a housing including a fixing portion; a pair of sliding portions provided at respective sides of the fixing portion, each of the sliding portions being configured to be drawn out from the housing along a first direction such that a distance from the respective sliding portion to the fixing portion is changed; and a panel unit including: a fixing display unit on the fixing portion; and a pair of expanding display units on the pair of sliding portions and having a variable exposing area; a flexible display panel including a plurality of pixels and having a screen at a first side thereof; and a support panel attached to a second side of the flexible display panel facing the first side, the support panel including a plurality of slits extending in a second direction crossing the first direction.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: January 29, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae An Seo, Sun Ho Kim, Sung Hoon Kim, Jung Hun Lee, Jin Hwan Choi
  • Publication number: 20180342452
    Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.
    Type: Application
    Filed: July 18, 2018
    Publication date: November 29, 2018
    Inventors: Sun Ho KIM, Ji Hoon KIM, Ha Young AHN, Shang Hoon SEO, Seung Yeop KOOK, Sung Won JEONG
  • Patent number: 10128179
    Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 13, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
  • Publication number: 20180308916
    Abstract: A display device includes a substrate including a pixel region and a peripheral region. The display device also includes a plurality of pixels provided in the pixel region for displaying an image. The display device also includes a light emitting element provided in each pixel for emitting light. The display device includes a first transistor provided in each pixel for driving the light emitting element, and a second transistor connected to the first transistor. The display device includes an insulating layer disposed between a second semiconductor layer of the second transistor and the substrate; and a crack blocking layer disposed between the insulating layer and the second semiconductor layer of the second transistor. A first semiconductor layer of the first transistor and the second semiconductor layer of the second transistor are provided in layers different from each other.
    Type: Application
    Filed: March 20, 2018
    Publication date: October 25, 2018
    Inventors: Sun Ho Kim, Ju Chan Park, Young Gug Seol, Sun Hee Lee
  • Publication number: 20180305809
    Abstract: A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.
    Type: Application
    Filed: June 29, 2018
    Publication date: October 25, 2018
    Inventors: Sun-Ho Kim, Myung-Soo Huh, Jeong-Ho Yi, Cheol-Rae Jo, Hyun-Woo Joo, Yong-Suk Lee
  • Patent number: 10081862
    Abstract: A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: September 25, 2018
    Assignee: Samsung Dispaly Co., Ltd.
    Inventors: Sun-Ho Kim, Myung-Soo Huh, Jeong-Ho Yi, Cheol-Rae Jo, Hyun-Woo Joo, Yong-Suk Lee
  • Patent number: 10040192
    Abstract: A substrate transfer unit includes a rotation body, an arm member, and first and second blades. The arm member is on the rotation body, and the first and second blades are on the arm member. The arm member includes a first arm including a lower link on the rotation body and an upper link connected on one side of the lower link and a second arm including a first portion and a second portion. The first portion has a first pivot on the other side of the upper link and is connected with the first blade at a first height from the first pivot. The second portion is connected with the first portion and with the second blade at a second height, higher than the first height, from the first pivot.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: August 7, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seok Heo, Sun Ho Kim, Chaemook Lim, JaeChul Hwang
  • Patent number: 10013023
    Abstract: An electronic device and a method for disassembling the electronic device are provided. The electronic device includes a housing including at least one of a first plate or a second plate, when the housing includes the first plate and the second plate, the second plate faces in an opposite direction to the first plate, a substrate disposed between the first and second plates in substantially parallel with the first and second plates, a first attachment layer disposed between the first plate and the substrate, and a second attachment layer disposed between the second plate and the substrate. When the first and second attachment layers are seen from above the first plate, the first and second attachment layers overlap with each other at least partially, and one of the first and second attachment layer includes at least one tear line extended at least partially across the one attachment layer.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: July 3, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun-Ho Kim, Chul-Hyung Yang, Ji-Woo Lee
  • Patent number: 9966563
    Abstract: A display device is disclosed. In one aspect, the display device includes a substrate, a barrier layer formed over the substrate, and an emission layer formed over the barrier layer. The display device also includes a stress-absorbing layer contacting one of the substrate, the barrier layer, and the emission layer. The stress-absorbing layer has a structural density configured to partially vary based on an applied voltage.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: May 8, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Bo Ik Park, Sun Ho Kim, Young Gug Seol, Jin Hwan Choi
  • Publication number: 20180102072
    Abstract: A flexible display panel of an expandable display device includes a first side with a display unit, and a second side opposite to the first side. A bending guide includes an external guide that faces part of the first side and has a first curved side, and an internal guide that faces part of the second side and has a second curved side. A slider that slides on the bending guide is attached to one end portion of the flexible display panel. A radius of the first curved side is greater than a radius of the second curved side. When the slider moves toward the bending guide, the first side contacts the first curved side and is bent by the first curved side, and when the slider moves away from the bending guide, the second side contacts the second curved side and is bent by the second curved side.
    Type: Application
    Filed: October 4, 2017
    Publication date: April 12, 2018
    Inventors: JUNG HUN LEE, Sun Ho Kim, Young-Seok Seo, Tae An Seo, Jin Hwan Choi