Abstract: A thin film depositing apparatus and a thin film deposition method using the apparatus. The thin film depositing apparatus includes a chamber configured to have a substrate mounted therein, an ejection unit configured to move in the chamber and to eject a deposition vapor to the substrate, and a source supply unit configured to supply a source of the deposition vapor to the ejection unit.

Abstract: A printed circuit board, a semiconductor package, and a method of producing the same are provided. The printed circuit board (PCB) includes an insulating layer and a circuit layer including metal pads exposed on a side surface and a lower surface of the insulating layer.

Abstract: A display device is disclosed. In one aspect, the display device includes a substrate, a barrier layer formed over the substrate, and an emission layer formed over the barrier layer. The display device also includes a stress-absorbing layer contacting one of the substrate, the barrier layer, and the emission layer. The stress-absorbing layer has a structural density configured to partially vary based on an applied voltage.

Abstract: A method of manufacturing a capacitor for a semiconductor device includes forming a lower electrode, forming a dielectric layer on the lower electrode, forming a first upper electrode on the dielectric layer, adsorbing an organic silicon source onto a surface of the first upper electrode, and forming a second upper electrode on the first upper electrode onto which the organic silicon source is adsorbed. Related devices and fabrication methods are also discussed.

Abstract: A flexible organic light-emitting diode display and a method of manufacturing the same are disclosed. In one aspect, the display includes a substrate formed of a first material including a metal and an OLED formed over the substrate.

Abstract: A flexible display panel and a method of manufacturing the same are disclosed. In one aspect, the flexible display panel includes a flexible substrate configured to display an image. The display also includes a first layer formed over a first surface of the flexible substrate and configured to compress horizontally with a compressive strain force. The display further includes an adhesive interposed between the flexible substrate and the first layer.

Abstract: A method of manufacturing a flexible display device, the method including forming a sacrificial layer on a carrier substrate such that the sacrificial layer includes a hydrogen trap material and amorphous silicon; forming a support layer and a thin film transistor on the sacrificial layer; and separating the support layer from the carrier substrate by irradiating a laser to the sacrificial layer.

Abstract: A display panel includes a thin film transistor substrate and a display layer disposed on the thin film transistor substrate and having a display. The thin film transistor substrate may include a base substrate, a stress relief layer disposed on the base substrate and including at least one stress relief pattern, and a driver layer disposed on the stress relief layer and including at least one thin film transistor coupled to the display.

Abstract: The present disclosure relates to a parallel linkage-type working apparatus for construction equipment in which a parallel lever and a parallel link operate to prevent a working tool from bending inward so that, even if the working tool is raised, a tilting phenomenon in which the working tool is inclined inward may be prevented, and an amount of change in posture of the working tool at each height may be reduced. Also, the parallel linkage-type working apparatus is capable of increasing excavation ability or power with a posture on the ground surface by supplying a larger amount of hydraulic fluid at one time when working hydraulic pressure is supplied to each cylinder head, in comparison with a case in which working hydraulic pressure is supplied to a cylinder rod.

Abstract: Provided is a method of analyzing binding efficiency of adhesive nanoparticles. The method includes (a) injecting a solution containing nanoparticles into a first chamber slide, (b) evaporating only the solution from the first chamber slide into which the solution containing the nanoparticles is injected, and measuring a saturation temperature using a thermal imager while radiating light from a light source, (c) injecting cells into a second chamber slide, (d) injecting a solution containing nanoparticles into the second chamber slide in which the cells are cultured, (e) removing nanoparticles which are not bound to the cells from the second chamber slide into which the cells and the nanoparticles are injected, and (f) evaporating only the solution from the second chamber slide from which the nanoparticles are removed, and measuring a saturation temperature using a thermal image while radiating light from the light source.

Abstract: Provided is an antenna module package including a substrate, a wireless card payment antenna structure mounted on the substrate and including a first antenna chip and wireless card payment matching elements electrically connected to the first antenna chip, a near field communication (NFC) antenna structure mounted on the substrate, sharing the first antenna chip, and including an extended NFC antenna loop and NFC matching elements electrically connected to the first antenna chip, and a wireless charging antenna structure mounted on the substrate and including a second antenna chip, and an extended wireless charging antenna loop and wireless charging matching elements electrically connected to the second antenna chip.

Abstract: A method of manufacturing a flexible display device, the method including forming a sacrificial layer on a carrier substrate such that the sacrificial layer includes a hydrogen trap material and amorphous silicon; forming a support layer and a thin film transistor on the sacrificial layer; and separating the support layer from the carrier substrate by irradiating a laser to the sacrificial layer.

Abstract: A deposition apparatus is configured to form a deposition layer on a substrate. The deposition apparatus includes a deposition source configured to face a first side of the substrate and to spray one or more depositing materials toward the substrate, a cooling stage configured to support a second side of the substrate that is opposite from the first side of the substrate, and a hardening unit configured to harden the one or more depositing materials sprayed from the deposition source and that have reached the substrate. A method of forming a thin film deposition layer on a substrate by using a deposition apparatus is also provided. The method includes spraying one or more depositing materials toward the substrate by using a deposition source of the deposition apparatus while the substrate is on a cooling stage of the deposition apparatus.

Abstract: Disclosed is an electronic device capable of near field communication (NFC) and of achieving high integration, size reduction, and good sensitivity. The electronic device includes an antenna chip provided inside a battery protection circuit package of a battery pack and having embedded an NFC antenna therein, and an extended antenna loop electrically connected to the antenna chip and provided outside the battery protection circuit package.

Abstract: A substrate transfer unit includes a rotation body, an arm member, and first and second blades. The arm member is on the rotation body, and the first and second blades are on the arm member. The arm member includes a first arm including a lower link on the rotation body and an upper link connected on one side of the lower link and a second arm including a first portion and a second portion. The first portion has a first pivot on the other side of the upper link and is connected with the first blade at a first height from the first pivot. The second portion is connected with the first portion and with the second blade at a second height, higher than the first height, from the first pivot.

Abstract: A deposition apparatus is configured to form a deposition layer on a substrate. The deposition apparatus includes a deposition source configured to face a first side of the substrate and to spray one or more depositing materials toward the substrate, a cooling stage configured to support a second side of the substrate that is opposite from the first side of the substrate, and a hardening unit configured to harden the one or more depositing materials sprayed from the deposition source and that have reached the substrate. A method of forming a thin film deposition layer on a substrate by using a deposition apparatus is also provided. The method includes spraying one or more depositing materials toward the substrate by using a deposition source of the deposition apparatus while the substrate is on a cooling stage of the deposition apparatus.

Abstract: Disclosed is a battery protection circuit package capable of ensuring stability of a battery, the package including a substrate having a plurality of external connection terminals and a plurality of internal connection terminals, and a protection integrated chip (IC), one or more field effect transistors (FETs), and one or more passive devices provided on the substrate, wherein the protection IC includes a separate IC structure capable of forcibly blocking discharge or charge of the battery bare cell by switching off the FETs when an electrical signal is input through one of the external connection terminals.

Abstract: A method for sensing proximity by an electronic device is provided. The method includes confirming a phase difference regarding a corresponding subject of an image acquired through a lens of the electronic device by operating a phase-difference autofocus sensor and determining that the corresponding subject is proximate to the electronic device when the confirmed phase difference is larger than a designated first reference value.

Abstract: A plasmonic all-optical switch includes a graphene layer, a first dielectric layer located on the graphene layer, a nano-antenna located on the first dielectric layer, and a second dielectric layer located on the nano-antenna. An incident beam is propagated by means of a surface plasmon wave generated at an interface between the graphene layer and the first dielectric layer. Further, localized surface plasmon resonance is selectively generated at an interface between the nano-antenna and the second dielectric layer by means of a pump beam incident to the nano-antenna to decrease an intensity of the incident beam. The plasmonic all-optical switch may operate at an ultrahigh speed just with a small light energy without any electric method, greatly reduce power consumption of an IT device by applying to an all-optical transistor or the like, and increase a processing rate.

Abstract: A method of manufacturing a capacitor for a semiconductor device includes forming a lower electrode, forming a dielectric layer on the lower electrode, forming a first upper electrode on the dielectric layer, adsorbing an organic silicon source onto a surface of the first upper electrode, and forming a second upper electrode on the first upper electrode onto which the organic silicon source is adsorbed. Related devices and fabrication methods are also discussed.