Abstract: In some examples, a memory device generates and exposes parity/difference information to a test system to reduce overall test time. The parity/difference information may be generated based on parity bits read from the memory device and parity bits produced from data bits stored in the memory device. In some cases, the parity/difference information may be compared to an expected parity/difference to determine a number of correctable errors which occurred during testing, while the data bits may be compared to expected data to determine a number of uncorrectable errors which occurred during testing.

Abstract: A technique for detecting tampering attempts directed at a memory device includes setting each of a plurality of detection memory cells to an initial predetermined state, where corresponding portions of the plurality of detection memory cells are included in each of the arrays of data storage memory cells on the memory device. A plurality of corresponding reference bits on the memory device permanently store information representative of the initial predetermined state of each of the detection memory elements. When a tamper detection check is performed, a comparison between the reference bits and the current state of the detection memory cells is used to determine whether any of the detection memory cells have changed state from their initial predetermined states. Based on the comparison, a tamper detect indication is flagged if a threshold level of change is determined.

Abstract: A memory device is configured to identify a set of bit cells to be changed from a first state to a second state. In some examples, the memory device may apply a first voltage to the set of bit cells to change a least a first portion of the set of bit cells to the second state. In some cases, the memory device may also identify a second portion of the bit cells that remained in the first state following the application of the first voltage. In these cases, the memory device may apply a second voltage having a greater magnitude, duration, or both to the second portion of the set of bit cells in order to set the second portion of bit cells to the second state.

Abstract: In some examples, a memory device is configured to receive a precharge command and an activate command. The memory device performs a first series of events related to the precharge command in response to receiving the precharge command and a second series of events related to the activate command in response to receiving the activate command. The memory device delays the start of the second series of events until the first series of events completes.

Abstract: In some examples, a memory device is configured with non-volatile memory array(s) having one or more associated volatile memory arrays. The memory device may include a non-destructive write mode configured to prevent access to the non-volatile memory array(s) during an initiation or calibration sequence performed by the memory device or an electronic device associated with the memory device to calibrate read and write access timing associated with the memory device.

Abstract: A cell bias control circuit maximizes the performance of devices in the read/write path of memory cells (magnetic tunnel junction device+transistor) without exceeding leakage current or reliability limits by automatically adjusting multiple control inputs of the read/write path at the memory array according to predefined profiles over supply voltage, temperature, and process corner variations by applying any specific reference parameter profiles to the memory array.

Abstract: In some examples, a memory device is configured to load multiple pages of an internal page size into a cache in response to receiving an activate command and to write multiple pages of the internal page size into a memory array in response to receiving a precharge command. In some implementations, the memory array is arranged to store multiple pages of the internal page size in a single physical row.

Abstract: A memory device includes memory arrays configured to store pages of data organized into multiple ECC words. The memory device also includes at least one input/output pad for each ECC word associated with a page, such that a first level of error correction may be performed by the memory device on each of the ECC words associated with a page and a second level of error correction is performed on the data output by each of the input/output pads during a particular period of time.

Abstract: A memory system and memory controller for interleaving volatile and non-volatile memory accesses are described. In the memory system, the memory controller is coupled to the volatile and non-volatile memories using a shared address bus. Activate latencies for the volatile and non-volatile memories are different, and registers are included on the memory controller for storing latency values. Additional registers on the memory controller store precharge latencies for the memories as well as page size for the non-volatile memory. A memory access sequencer on the memory controller asserts appropriate chip select signals to the memories to initiate operations therein.

Abstract: In some examples, a memory device may be configured to store data in either an original or an inverted state based at least in part on whether the majority of bits are set to a high state or a low state. For instance, the memory device may be configured to set each bit in the memory array to a low state when the data is read. The memory device may then be configured to store the data in the original state when a majority of the bits to be written to the array are in the low state and in the inverted state when the majority of the bits to be written to the array are in the high state.

Abstract: In some examples, a memory device may be configured to store data in either an original or an inverted state based at least in part on a state associated with one or more shorted bit cells. For instance, the memory device may be configured to identify a shorted bit cell within a memory array and to store the data in the memory array, such that a state of the data bit stored in the shorted bit cell matches the state associated with the shorted bit cell.

Abstract: A spin-torque magnetoresistive memory includes array read circuits and array write circuits coupled to an array of magnetic bits. The array read circuits sample magnetic bits in the array, apply a write current pulse to the magnetic bits to set them to a first logic state, resample the magnetic bits using an additional offset current, and compare the results of sampling and resampling to determine the bit state for each magnetic bit. For each of the magnetic bits in the page having the second logic state, the array write circuits initiate a write-back, wherein the write-back includes applying a second write current pulse having opposite polarity in comparison with the first write current pulse to set the magnetic bit to the second state. A read or write operation may be received after initiation of the write-back where the write-back can be aborted for a portion of the bits in the case of a write operation.

Abstract: Self-referenced reading of a memory cell in a memory includes first applying a read voltage across the memory cell to produce a sample voltage. After applying the read voltage, a write current is applied to the memory cell to write a first state to the memory cell. After applying the write current, the read voltage is reapplied across the memory cell. An offset current is also applied while the read voltage is reapplied, and the resulting evaluation voltage from reapplying the read voltage with the offset current is compared with the sample voltage to determine the state of the memory cell.

Abstract: Circuits and methods for driving generating multiple word line voltages used for writing to two-transistor two-magnetic tunnel junction (2T2MTJ) spin-torque magnetic random access memory (MRAM) cells. Some embodiments include auto-booting isolated word lines using common lines such as bit and source lines that are capacitively coupled to the word lines. Different memory architectures for 2T2MTJ memory arrays are also presented that include read/write circuits and word line drivers.

Abstract: A method includes destructively reading bits of a spin torque magnetic random access memory, using error correcting code (ECC) for error correction, and storing inverted or non-inverted data in data-store latches. When a subsequent write operation changes the state of data-store latches, parity calculation and majority detection of the bits are initiated. A majority bit detection and potential inversion of write data minimizes the number of write current pulses. A subsequent write operation received within a specified time or before an original write operation is commenced will cause the majority detection operation to abort.

Abstract: A method of applying a write current to a magnetic tunnel junction device minimizes sub-threshold leakage. NMOS- and PMOS-follower circuits are used in applying the write current, and bias signals for the follower circuits are isolated from global bias signals before the write current is applied.

Abstract: A spin-torque magnetoresistive memory includes array read circuits and array write circuits coupled to an array of magnetic bits. The array read circuits sample magnetic bits in the array, apply a write current pulse to the magnetic bits to set them to a first logic state, resample the magnetic bits using an additional offset current, and compare the results of sampling and resampling to determine the bit state for each magnetic bit. For each of the magnetic bits in the page having the second logic state, the array write circuits initiate a write-back, wherein the write-back includes applying a second write current pulse having opposite polarity in comparison with the first write current pulse to set the magnetic bit to the second state. A read or write operation may be received after initiation of the write-back where the write-back can be aborted for a portion of the bits in the case of a write operation.

Abstract: In response to a tamper-attempt indication, a memory device selectively disables one or more memory operations. Disabling can be accomplished by different techniques, including altering bias voltages associated with performing the memory operation, gating off a current needed for performing the memory operation, and limiting the needed current to a magnitude below the threshold magnitude required for the operation. After disabling the memory operation, a mock current can be generated. The mock current is intended to mimic the current normally expended during the memory operation when not disabled, thereby leading a user to believe that the device is continuing to operate normally even though the memory operation that is being attempted is not actually being performed.

Abstract: In one embodiment, an optical fiber cooling system includes a first cooling tube oriented substantially in parallel with and spaced apart from a second cooling tube such that an optical fiber pathway is positioned between the first cooling tube and the second cooling tube. The first cooling tube includes a plurality of cooling fluid outlets positioned along an axial length of the first cooling tube which are oriented to direct a flow of cooling fluid across the optical fiber pathway towards the second cooling tube. The second cooling tube includes a plurality of cooling fluid outlets positioned along an axial length of the second cooling tube which are oriented to direct a flow of cooling fluid across the optical fiber pathway towards the first cooling tube.

Abstract: In some examples, a nonvolatile storage element may be configured to store a state or value during a low power or powered down period of a circuit. For example, the nonvolatile storage element may include a bridge of resistive elements that have a resistive state that may be configured by applying voltages to multiple drive paths. A sense amplifier may be connected to the bridge in order to resolve a voltage differential associated with the bridge to ether power or ground and, thereby determine the state associated with on the nonvolatile storage element.