Abstract: A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. An elliptical frame having an elliptical orbit, coupled to an elliptical plate having a connector channel, can be rotated about a rotation axis continuously or in fixed increments. The connector channel and elliptical orbit define a rotation path for the aligning the fluid connectors and the rotation axis defines the position of the fluid connectors on the rotation path. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold.

Abstract: A rack cooling system includes a primary cooling condenser and a secondary cooling condenser. The primary cooling condenser is positioned above servers of a server rack and the secondary cooling condenser is position above the primary cooling condenser. Each of the severs, the primary cooling condenser, and the secondary cooling condenser is connected to a liquid manifold via one of a plurality of liquid ports on the liquid manifold, and to the vapor manifold via one of a plurality of vapor ports on the vapor manifold. A cooling capacity of the rack cooling system can be extended by switching on a vapor flow between the secondary cooling condenser and the primary cooling condenser using a first valve on the vapor manifold. Further, a second valve on a primary cooling loop can be used to control cooling fluid flowing into the secondary cooling condenser after the first valve is trigged open.

Abstract: A holder for an electronic rack includes a pivot point and a first end of the holder having a first blind-mate connector to be coupled to a second blind-mate connector at a first engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack. The holder additionally includes a second end of the holder having a third blind-mate connector to be coupled to a fourth blind-mate connector at a second engagement interface. The third blind-mate connector and the fourth blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack.

Abstract: A multi-stage cascaded thermoelectrical cooler (TEC) package is used in conjunction with an air cooling system to control temperature of battery cells in a battery module such that the temperature differences stay within a predetermined range. Battery cells in the battery module are divided into one or more regular sections and one or more TEC enhancing sections. A regular section and a TEC enhancing section can use different types of battery cell holders to assemble the battery cells. TECs in the TEC package are integrated into each enhancing section, where each stage of the TEC package is attached to one or more battery cells in a different region of the enhancing section. A higher stage, which is more powerful in enhancing heat transfer and extracting heat from battery cells, is attached to one or more battery cells in a section closer to the air outlet. The TEC package is powered by a discharging convertor circuit of the battery module.

Abstract: Embodiments are disclosed of a rack cooling apparatus, more specially, a rack fluid control and management unit with a first pair of fluid lines including a first supply line and a first return line and a second pair of fluid lines including a second supply line and a second return line. The first supply line and the first return line are adapted to be coupled to a first rack manifold and the second supply line and the second return line are adapted to be coupled to a second rack manifold in the same rack as the first rack manifold. First and second bi-directional fluid lines fluidly couple the first supply line to the second supply line.

Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop, and a buffer loop. The main loop includes a heat exchanger coupled to the inlet port and the outlet port, and the heat exchanger is to receive fluid from the inlet port, to exchange heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. A buffer loop is coupled to the inlet port and the main loop. The second loop includes a buffer unit and a first valve to control the fluid to flow into the buffer unit for storage and to discharge the fluid from the buffer unit to follow into the main loop for heat exchange. The buffer unit comprises an air section to store air and a buffer section to store a portion of the fluid.

Abstract: A power delivery system for data center. Servers are divided into server clusters, and each server cluster is served by multiple power source with multiple inputs from a power supply module. Each power supply module includes a local bus and a local controller which controls connections on the local bus to deliver utility power to its assigned server cluster or backup power to any of the server clusters. Each of the power supply modules has a battery storage system with switchable connections to the local bus and to an inter-system bus, and a PV system with switchable connections to the local bus and to an inter-system bus. The battery storage system may be charged from the utility power or the PV system. The inter-system bus is connected to all of the server clusters, such that power flowing in the inter-system bus can be delivered and dispatched to power any server cluster.

Abstract: A leakage prevention system including a cold plate is proposed in the current application. In one embodiment, a cold plate comprises an inlet port to receive cooling fluid from an external cooling source; an outlet port to return the cooling fluid back to the external cooling source; a sealing notch integrated with a sealing pad included in an outside layer of the cold plate; a nanoparticle channel disposed inside the outside layer; the nanoparticle channel is filled with a plurality of nanoparticles; a cooling area disposed inside the nanoparticle channel; the cooling area is to receive the cooling fluid from the inlet port, to exchange heat generated by an electronic device attached to the cold plate and carried by the fluid, and to return the cooling fluid via the outlet port; the plurality of nanoparticles in cooling fluid is used to detect a leakage of the cooling fluid.

Abstract: A first battery of a battery system can include a thermoelectric component (TEC) that produces electric energy from thermal energy that the first battery generates. The TEC is used to charge a second battery of the battery system, while maintaining proper thermal conditions for the first battery. The battery system can be used to support information technology (IT) equipment by acting as backup power during a power outage, and/or to provide supplemental power under peak power conditions.

Abstract: A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. Alternatively, the blind mating adapter can be separable into two halves that can be positioned to align with, and blind mate to, the coolant distribution manifold. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold. The blind mating adapter unit functions as an intermediate layer for server and rack fluid mating.

Abstract: Described herein is a hybrid cooling device and a cooling method that use a combination of phase change cooling and air cooling. The hybrid cooling device includes a closed loop two phase system, one or more fans, and an assembly clamp. The two phase system further includes a cold plate, an integrated channel, and a radiator, and a pressure sensor. The cold plate can include phase change fluid for extracting heat from electronics on a printed circuit board sandwiched between the cold plate and the assembly clamp. The one or more fans can be used to create airflows for cooling both the cold plate and the radiator. The pressure sensor can be used to control the operation of the hybrid cooling device, which can be deployed in different system environments and server configurations.

Abstract: A cooling unit to deliver liquid cooling to one or more peripheral devices is disclosed. The cooling unit includes one or more first mounting structures, the one or more first mounting structures are mounted onto the cooling unit, where the one or more first mounting structures are movable along a first direction. The cooling unit includes one or more cooling devices mounted to the one or more first mounting structures, where each of the one or more cooling devices is coupled to the one or more liquid distribution channels to receive cooling liquid to cool one or more peripheral devices of a server system. The cooling unit includes one or more liquid distribution channels to distribute cooling liquid within the server system, between the server system and other server systems, and/or between the server system and a liquid distribution system of an electronic rack.

Abstract: A leak prevention system includes a liquid cooling device for a server. The liquid cooling device includes a fluid area configured to receive a cooling fluid. The leak prevention system also includes at least one pair of detection wires disposed within the liquid cooling device and at least partially surrounding the fluid area. The leak prevention system also includes a sensor connected to the detection wires and configured to detect when a cooling fluid contacts the detection wires.

Abstract: Embodiments disclose a server chassis of an electronic rack. The server chassis includes a tray to contain one or more information technology (IT) components. The server chassis is stackable in a stack on an electronic rack, and where each server chassis is divisible into a top section and the bottom section in one design. The bottom section of the server includes the tray. The top section of the server chassis includes: a secured panel, the secured panel being secured to the server chassis, one or more frames adjustably attached to the secured panel, and one or more cooling units attachable to the one or more frames. The one or more cooling units to interface with the one or more IT components to cool the one or more IT components, where the one or more frames are relocatable to a different position on the secured panel.

Abstract: A blind mating connection structure for servers is disclosed. On the server side, a connector module has fluid connectors to be blind mated to fluid connectors on rack manifolds in a server rack. The connector module is coupled to a sliding channel on the server. The connector module slides horizontally and vertically in response to movement of a positioning slider on the connector module. On the rack manifold side, a guiding module has an opening that receives the positioning slider when the server is installed in the server rack. The guiding module tapers down to a centering point midway between each rack manifold. As the server is slid into the server rack, the positioning slider follows the guiding module to the center point, moving the connector module into alignment with the fluid connectors on the rack manifold for blind mating.

Abstract: According to one embodiment, a thermal management system includes a thermoelectric cooling (TEC) element mounted on an information technology (IT) component, wherein the element draws a first power to cool the component; a load sensor to sense a second power that is drawn by the component to perform a first set of operations; a temperature sensor to sense a temperature of the component; and a controller to determine whether the second power drawn has changed based on the load sensor, wherein the component performs a second set of operations while drawing the second power, and in response to the changed second power, adjust the power supplied to the element and component based on the temperature and the power supplied to the component, such that the component continues to perform the second set of operations while drawing the adjusted power that is less than the power drawn before the adjustment.

Abstract: A cooling system comprises a board management controller (BMC), a thermoelectric cooling (TEC) controller, and a cooling distribution unit (CDU) controller. The BMC monitors a cooling system to obtain a first power value representing a power consumed by an electronic device, performs a lookup operation in a control lookup table based on the first power value, and determines a first thermoelectric cooling (TEC) current and a first pump speed based on the lookup operation. The TEC controller is to control a TEC device attached to the electronic device to cause the first TEC current to flow within the TEC device. The CDU controller is to configure a pump speed of a fluid pump of the CDU according to the first pump speed.

Abstract: A thermal management system includes an auxiliary thermal management unit, the auxiliary thermal management unit includes a vapor inlet line, a liquid outlet line, and a phase change unit. The phase change unit includes a condenser and a compressor. The auxiliary thermal management unit includes a vapor buffer unit coupled between the vapor inlet line and the phase change unit. The auxiliary thermal management unit includes a liquid buffer unit coupled between the liquid outlet line and the phase change unit, where the auxiliary thermal management unit is to form a double-buffered vapor-liquid loop between the vapor inlet line and the liquid outlet line, where the vapor inlet line is coupled to a rack vapor return of an electronic rack to receive vapor and the liquid outlet line is coupled to a rack liquid supply of the electronic rack to supply cooling liquid.

Abstract: Embodiments are disclosed of a power delivery module that includes a power delivery board rotatable between a first orientation and a second orientation about a first axis that is normal to the power delivery board, and rotatable power clip module. Two pairs of electrical contacts are on the board: a first pair, one positive and one negative, and a second pair of electrical contacts, one positive and one negative. The two pairs of contacts are spaced apart from each other on the same side of the board. The rotatable power clip module is coupled to the power delivery board and includes a pair of contacts pads to engage with, and electrically couple to, the first or the second pairs of contacts. A power clip is electrically coupled to each contact pad.

Abstract: Disclosed are designs to facilitate blind-mating of fluid connectors on servers and on racks that house the servers. The design includes two plates. A first plate has a connector channel to guide the connectors of the server through the first plate and spring structures to apply a force to push the connectors of the server toward the center of the connector channel. A second plate has positioning holes around its perimeter for mounting the connectors of the server using the force of the spring structures. The first plate is rotatable around a rotation axis to align the connectors of the server with the connectors of the rack. The second plate may have an elastic layer that is compressed to change a width of the second plate by inserting the second plate to the rack to automatically align the connectors of the server and of the rack in the horizontal direction.