Abstract: An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment, the IT equipment is configured to provide IT services and is at least partially submerged within a first phase change liquid within the immersion tank, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the first phase change liquid thereby causing at least some of the first phase change liquid to turn into vapor phase. The cooling system includes a condenser unit having a second phase change liquid circulating at the condenser unit. The condenser unit includes a vacuum port, a sealing valve at the vacuum port. The cooling system includes a heat exchange core, coupling within the immersion tank connecting with the condenser unit to carry heat from the first phase change liquid to the second phase change liquid.

Abstract: Disclosed are liquid cooling devices for high power density electronics. The liquid cooling devices may include multiple integrated cooling channels for cooling the electronics in various configurations of the cooling channels and fluid distribution paths. A fluid input port and a fluid output port are connected to the supply and return loops of an external cooling source to distribute cooling liquid to the electronics and to return the liquid. The fluid input port may be connected to an inlet channel that distributes the cooling liquid to multiple inlets of the multiple integrated channels. The fluid output port may be connected to an outlet channel that provides a converging channel for the fluid existing from the multiple integrated channels. The multiple cooling fins and channels, inlet channel, outlet channel, fluid inlet port, and fluid outlet port may be integrated into multiple frames that are stacked to assemble the liquid cooling device.

Abstract: A distribution chassis comprises a supporting frame, one or more main connector, and a node distribution unit having one or more node connectors, where the distribution chassis corresponds to a server chassis and connected to a rack distribution unit, where the server chassis includes one or more server nodes, each server node represents a package associated with one or more electronics, where the distribution chassis is disposed above the server chassis to distribute cooling liquid to the one or more server nodes of the server chassis, where the node distribution unit is disposed to be movable along the supporting frame from a first position to a second position, and where the one or more node connectors of the node distribution unit are connected with one or more fluid connecters of a corresponding node when the node distribution unit is in the second position.

Abstract: A cooling plate for cooling high power density electronics has an internal cavity and an opening for fluid exchange with the cavity. A mounting structure is positioned within the opening. A coaxial port is attached to the mounting structure, the coaxial port having a center conduit and a ring conduit surrounding the central conduit such that rotational axis of the center conduit coincides with rotational axis of the ring conduit. A single coaxial port can serve to deliver cooling liquid to the cooling plate and return warmed fluid from the cooling plate. The coaxial port center conduit connected with a fluid distribution panel. Fluid distribution is regulated by the panel before it exits the port through the ring conduit.

Abstract: A thermal management module includes a fluid system in fluid communication with a main cooling fluid source; a first cooling fluid manifold, and a second cooling fluid manifold. The first cooling fluid manifold is in fluid communication with the fluid system and provides a cooling fluid between the fluid system and a first server rack adjacent to the thermal management module. The second cooling fluid manifold is in fluid communication with the fluid system and provides the cooling fluid between the fluid system and a second server rack adjacent to the thermal management module. The manifold is in internal position when no rack liquid is needed adjacently, and it is extended to the adjacent rack once fluid distribution is needed from the rack.

Abstract: Methods, systems, and devices for managing coolant in data centers are disclosed. Coolant may be used in data centers to regulate the temperatures of computing devices. The disclosed methods and system may provide for containment of vapor and condensation of the vapor into coolant. The coolant may be used as part of a two phase cooling system to cool the computing devices. The vapor may be generated when the coolant removes heat from computing devices during operation while at least partially submerged in the coolant. A mobile condenser is used for condensing the vapor within the containment.

Abstract: The cooling module comprises a main supply connector, a main return connector, an internal cooling loop, a plurality of cooling plates, a base layer and a lid. The base layer includes a plurality of supply sub-connectors and return sub-connectors and a plurality of cooling areas corresponding to a plurality of cooling plates. Each cooling plate has a supply connector, a return connector and a contacting area. The plurality of supply sub-connectors and return sub-connectors are connected with the internal cooling loop. Each cooling area is to contact with a contacting area of a corresponding cooling plate. Each supply sub-connector is to be connected to a supply connector of the corresponding cooling plate, and each return sub-connector is to be connected to a return connector of the corresponding cooling plate. The corresponding cooling plate is to be removably attached with the base layer and to be serviced independently.

Abstract: Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.

Abstract: A leak detection system for a server rack can include a detection channel that has a top region and a bottom region. The detection channel includes one or more openings at the top region. Each opening is to receive an outlet port of a server chassis installed in the IT rack. A cover for each of the one or more openings is arranged over the one or more openings when the outlet port is not present in the one or more openings and moves to allow entrance of the outlet port when the outlet port is inserted into the one or more openings. A fluid sensor for each of the one or more openings is arranged within the detection channel to detect a fluid that is deposited from the outlet port. Each fluid sensor is positioned within the detection channel to optimally detect presence of the fluid.

Abstract: Embodiments are disclosed of a fluid distribution apparatus. The fluid distribution apparatus includes a hot manifold including a hot chamber fluidly coupled to one or more fluid return inlets and a main fluid return outlet, and a cold manifold including a cold chamber fluidly coupled to a main fluid supply inlet and one or more fluid supply outlets. A thermoelectric device is sandwiched between the hot manifold and the cold manifold so that the thermoelectric device is in thermal contact with the hot chamber and in thermal contact with the cold chamber. The apparatus is connected to either a server energy storage unit or a rack mounted energy unit through dedicated busbar.

Abstract: Embodiments are disclosed of a fluid connection module. The module includes a holder coupled to a connector having an axis, and the holder is translatable in both directions of the axis so that the holder and the connector can translate between an engaged and disengaged positions. The holder is biased toward the disengaged position. A switching unit adjacent to the holder includes an electric motor. A blade is coupled to the electric motor and is rotatable through a range of angular positions. The blade has a contact surface that contacts a bearing surface of the holder in a first subrange of angular positions and stops contacting the bearing surface in a second subrange of angular positions. When the contact surface is in contact with the bearing surface, the holder is in its engaged position. An elastic torque member is coupled to the motor and the blade and biases the blade to an angular position in the second subrange.

Abstract: A coolant management unit includes a server supply manifold, a server return manifold, a power distribution, and a controller. A server supply manifold is to receive cooling fluid from a cooling fluid source. The server supply manifold is to distribute the cooling fluid to server blades. The server return manifold is to receive vapor from the one or more server blades. The cooling fluid is two-phase cooling fluid to extract heat from one or more servers and to evaporate into the vapor into the server return manifold, and the vapor is transmitted to an external condenser via the rack return manifold to be condensed back to a liquid form. A power distribution bus is configured to distribute power to the one or more servers. A controller is configured to control a fluid pump coupled to the server supply manifold based on one or more signals received from different sensors.

Abstract: Electronic rack and data center thermal management systems are disclosed. An electronic rack system includes a heat exchange system and the electronic rack having a plurality of servers containing heat-generating components. The heat exchange system includes a filter and a pump to circulate filtered cooling fluid to the electronic rack, via an internal cooling loop. An external cooling loop provides a backup cooling fluid supply to the electronic rack to function as a redundant system for the heat exchange system. The external cooling loop includes an external cooling fluid pump and filter, and is coupled to the internal cooling fluid supply via a valve. The cooling fluid in the internal cooling fluid loop, and its associated filter, are of a higher quality than the cooling fluid and filter of the external cooling fluid loop. In one embodiment, the external cooling loop filter is a high quality filtration system.

Abstract: A liquid cooling system can be installed to an information technology (IT) rack. The liquid cooling system can include a cooling assembly that has a cooling chassis and cold plates fixed at a bottom portion of the cooling chassis. Fluid lines are arranged in an interior of the cooling chassis to fluidly connect the cold plates to a supply line and a return line. The cooling chassis includes an outlet port that provides a path for a leaked fluid to flow out of the cooling chassis. The outlet port is inserted into an opening of a detection channel that has one or more fluid sensors within the detection channel. The floor of the cooling chassis may have a shape or other features to assist flow of leaked fluid towards the outlet port to assist in depositing the leaked fluid in the detection channel.

Abstract: A source module includes a server fluid distribution unit and a busbar unit, as well as connectors. In an embodiment, a server fluid distribution unit to be coupled to a rack fluid distribution unit and the one or more server blades for deploying one or more servers. In an embodiment, a busbar unit to be coupled with an alternating current (AC) power distribution unit and the one or more server blades. In an embodiment, the source module is to be coupled to the rack fluid distribution unit to distribute cooling fluid received from a cooling fluid source to the one or more server blades of corresponding server chassis and to extract heat from the one or more servers.

Abstract: Methods, systems, and devices for designing and implementing cooling fluid distribution in a computing environment such as a data center as disclosed. The disclosed design may reduce the impact cooling fluid leaks may have on the computing environment and other rack based systems. The disclosed methods and systems may include structures for containing cooling fluid leaks and detecting cooling fluid leaks. The structures may be movable between positions in which connectors for forming fluid connections are exposed and positions in which the connectors are contained. Containing and detecting cooling fluid leaks may allow for proactive action prior to significant damage to the computing environment.

Abstract: According to one embodiment, a leak segregation system for a rack that includes a rack liquid manifold. The system includes at least one leak segregation structure that is mounted to the manifold, the structure having a top opening, a bottom that includes at least one opening, a back opening for receiving a manifold connector of the manifold, and a front opening for receiving a connector of an electronics component mounted within the rack, where the structure contains the manifold connector and at least partially contains the connector when the connectors are coupled together. The system also includes a leak detection structure that is positioned below the leak segregation structure and includes a leak detection sensor that is configured to detect a presence of liquid from the leak segregation structure.

Abstract: According to one embodiment, an immersion cooling system may include a container to receive one or more server blades, each having electronics, at least partially submerged within a two-phase coolant contained within the container. The immersion cooling system may also include a cover panel to cover the phase change area. This area may include a liquid region defined to contain the two-phase coolant therein, and a vapor region defined between the cover panel and a surface of the two-phase coolant. The cover panel includes a plurality of slots, covered with rotatable panels. At least one of the slots is configured to allow a server blade to be inserted into the liquid region and at least partially submerged into the two-phase coolant. The slots may be configured to allow a condensing unit to be inserted into the vapor region.

Abstract: A leak detection system fora server rack can include a detection channel that has a top region and a bottom region. The detection channel includes one or more openings at the top region. Each opening is to receive an outlet port of a server chassis installed in the IT rack. A cover for each of the one or more openings is arranged over the one or more openings when the outlet port is not present in the one or more openings and moves to allow entrance of the outlet port when the outlet port is inserted into the one or more openings. A fluid sensor for each of the one or more openings is arranged within the detection channel to detect a fluid that is deposited from the outlet port. Each fluid sensor is positioned within the detection channel to optimally detect presence of the fluid.

Abstract: According to one embodiment, a system for a rack includes an equipment module for coupling to a rack module. The rack module includes a pair of main connectors for coupling to a coolant source and a pair of manifold connectors, and includes a vertical leak detection channel that has a leak detection cable. Positioned between the main connectors and the manifold connectors is a structure that at least partially contains the main connectors and has a liquid path to the channel. The equipment module includes a chassis that has a pair of connectors and a conducting path. The chassis also has an opening for receiving the manifold connectors for coupling to the connectors, and another opening, the conducting path extends from an interior of the chassis to the other opening and is arranged to guide liquid out of the opening and into the channel while both modules are coupled together.