Patents by Inventor Tianyi Gao

Tianyi Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11737237
    Abstract: A liquid cooling arrangement for peripheral board incorporates cooling plates on one side and resilient cushion on the opposite side and enclosing the peripheral board between the cooling plates and the cushion. The cushion exerts pressure on the backside of the peripheral board to ensure physical contact of the microchips and the cooling plates for good thermal conductance. Cooling hoses are connected to the cooling plates to circulate cooling liquid. An electrically insulating layer may be included between the backside of the peripheral board and the cushion. An extension frame may optionally be added onto the cooling frame to house the cooling houses and increase the variability of deployments.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: August 22, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11735948
    Abstract: A topology of bi-directional multi-output multi-function converter is designed in a BBU. The concept of bi-directional multi-function multi-output converter may be designed for the application of BBUs in a data center to provide multiple control functionalizes, such as battery discharging, battery charging, fan speed control, pump control, as well as providing power for multiple components/devices simultaneously. The proposed converter has two characteristics: bi-direction and multi-output. With the function of bi-direction, the battery discharging and charging can be accomplished with the same converter. With the function of multi-output, different rails of output voltages or power can be applied to different components or devices in BBU, such as fan, pump, control IC chip, sensors and etc.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: August 22, 2023
    Assignee: BAIDU USA LLC
    Inventors: Yuan Cao, Huawei Yang, Tianyi Gao
  • Patent number: 11737233
    Abstract: Methods, systems, and devices for distributing power in a computing environment such as a rack in data center are disclosed. The disclosed methods and systems may provide for a high degree of power distribution reliability in a liquid cooling rack. To provide for power distribution reliability, the power distribution components such as busbars and power clips may be segregated from other components such as cooling fluid distribution components. By segregating these components from one other, the magnitude of damage or impact such as short circuits due to leaked cooling fluid may be eliminated and prevented to a large extend.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: August 22, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11729953
    Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop having a heat exchanger coupled to the inlet port and the outlet port, and a buffer loop coupled to the inlet port and the outlet port. The main loop having a heat exchanger to receive fluid from the inlet port, to extract heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. In an embodiment, a cooling system includes a buffer loop, configured in parallel with the main loop, with a buffer unit to temporarily buffer at least a portion of the fluid, and a first pressure controllable valve, coupled to the main loop and the buffer loop, to selectively distribute at least a portion of the fluid to at least one of the main loop or the buffer loop based on a fluid pressure of the fluid.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: August 15, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11729949
    Abstract: In one embodiment, a cooling system comprises an information technology (IT) cluster layer with multiple immersion tanks, each immersion tanks including electronic components submerged in a two-phase liquid coolant; and a cooling capacity layer that includes a vapor subsystem, a liquid subsystem, and a condensing cooler. The system further includes a distribution layer that include vapor lines for transmitting vapor from each of the immersion tanks to the vapor subsystem, and liquid lines for distributing liquid from the liquid subsystem to each immersion tank in the IT cluster layer. The two subsystems operate independently to maintain proper fluid level in the immersion tanks efficiently.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: August 15, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11729946
    Abstract: According to one embodiment, a leak segregation system for a rack that includes a rack liquid manifold. The system includes at least one leak segregation structure that is mounted to the manifold, the structure having a top opening, a bottom that includes at least one opening, a back opening for receiving a manifold connector of the manifold, and a front opening for receiving a connector of an electronics component mounted within the rack, where the structure contains the manifold connector and at least partially contains the connector when the connectors are coupled together. The system also includes a leak detection structure that is positioned below the leak segregation structure and includes a leak detection sensor that is configured to detect a presence of liquid from the leak segregation structure.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: August 15, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11723176
    Abstract: The disclosed embodiments provide a cooling system with an auxiliary system that extends a main system. The auxiliary system includes a vapor container that receives vapor from the IT load, an auxiliary condenser that receives vapor from the vapor container via a compressor or a vapor valve, and condenses the vapor into liquid to be stored in a liquid container. The auxiliary system further includes a fluid pump on a cooling loop for cooling the auxiliary condenser, and a cooling controller that includes a machine learning model for regulating operations of the vapor valve, the fluid pump, and the first compressor based on a pre-created profile of the IT load and real-time information from at least one of many sources, including the vapor container and the liquid container. The auxiliary system includes multiple cooling tiers that can be partially trigger or completely trigger based on several indicators collected multiple sensors in the auxiliary system.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: August 8, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11716834
    Abstract: This disclosure is directed to, in one aspect, a thermal management system for a data center. The thermal management system can include an air to air heat exchanger operable in a dry mode and a wet mode. The thermal management system can also include a liquid to air heat exchanger. The liquid to air heat exchanger can have a coil that receives the cooling liquid, with the coil being positioned in communication with the air of the data center such that the cooling liquid can absorb heat therefrom. Still further, the thermal management system can include a direct expansion cooling loop with a condenser and an evaporator. The system further provides multiple combinational operating conditions among multiple cooling modes. Other aspects are described.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 1, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11716830
    Abstract: The cooling module comprises a main supply connector, a main return connector, an internal cooling loop, a plurality of cooling plates, a base layer and a lid. The base layer includes a plurality of supply sub-connectors and return sub-connectors and a plurality of cooling areas corresponding to a plurality of cooling plates. Each cooling plate has a supply connector, a return connector and a contacting area. The plurality of supply sub-connectors and return sub-connectors are connected with the internal cooling loop. Each cooling area is to contact with a contacting area of a corresponding cooling plate. Each supply sub-connector is to be connected to a supply connector of the corresponding cooling plate, and each return sub-connector is to be connected to a return connector of the corresponding cooling plate. The corresponding cooling plate is to be removably attached with the base layer and to be serviced independently.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: August 1, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11716835
    Abstract: A thermal management module includes a fluid system in fluid communication with a main cooling fluid source; a first cooling fluid manifold, and a second cooling fluid manifold. The first cooling fluid manifold is in fluid communication with the fluid system and provides a cooling fluid between the fluid system and a first server rack adjacent to the thermal management module. The second cooling fluid manifold is in fluid communication with the fluid system and provides the cooling fluid between the fluid system and a second server rack adjacent to the thermal management module. The manifold is in internal position when no rack liquid is needed adjacently, and it is extended to the adjacent rack once fluid distribution is needed from the rack.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: August 1, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Publication number: 20230240051
    Abstract: Embodiments are disclosed of an information technology (IT) cooling system. An IT container defines an internal volume and an immersion tank-which is adapted to submerge one or more servers in a two-phase immersion fluid and has a tank inlet fluidly coupled to a source of the two-phase immersion fluid. One or more cooling devices can be thermally coupled to a heat-generating component in a server, and each cooling device has a liquid inlet at or near its bottom and a vapor outlet at or near its top. A liquid distribution manifold below the cooling devices has a main liquid inlet and a plurality of liquid distribution outlets; at least one liquid distribution outlet is fluidly coupled to the liquid inlet of a cooling device. A vapor return above the one or more cooling devices has a plurality of vapor collection inlets and a main vapor outlet.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 27, 2023
    Inventor: Tianyi GAO
  • Publication number: 20230237636
    Abstract: A vision inspection system includes a vision inspection controller receiving images form an imaging device. The vision inspection controller includes a binary classification tool and a multi-classification tool. The vision inspection controller processes each of the images through the binary classification tool to detect for the defects to determine primary inspection results including a PASS result if no defects are detected and a FAIL result if defects are detected. The vision inspection controller processes each of the images associated with the FAIL result through the multi-classification tool to determine secondary inspection results including identification of a type of defect. The vision inspection system may include a display configured to display the primary and secondary inspection results to an operator.
    Type: Application
    Filed: February 24, 2022
    Publication date: July 27, 2023
    Inventors: Sonny O. Osunkwo, Lei Zhou, Roberto Francisco-Yi Lu, Dandan Zhang, Jiankun Zhou, Angel Alberto Slistan, Tianyi Gao
  • Publication number: 20230238611
    Abstract: A battery chassis for immersion cooling includes one or more groups of battery cells, an inlet, a condenser, and one or more fluid connectors disposed on the top of the chassis. For example, an inlet is disposed on a bottom of the chassis to receive two-phase cooling fluid from an immersion container, and the two-phase cooling fluid is to extract heat from the one or more battery cells and to transform from a liquid form into a vapor. A condenser is disposed on a top of the chassis to condense the vapor contained within the chassis of the two-phase fluid back into the liquid form. One or more fluid connectors disposed on the top of the chassis to connect the condenser with external cooling fluid via a liquid line, and the battery chassis is to be at least partially submerged in the two-phase cooling fluid of the immersion container.
    Type: Application
    Filed: January 26, 2022
    Publication date: July 27, 2023
    Inventor: TIANYI GAO
  • Patent number: 11711908
    Abstract: According to one embodiment, a rack cooling module for an electronics rack. The module includes a manifold section that has a supply manifold that is coupled to a supply manifold connector, the supply manifold is arranged to supply liquid coolant from a coolant source to supply manifold connectors, and a return manifold that is coupled to return manifold connectors, the return manifold is arranged to return liquid coolant from the return manifold connector to the coolant source. The module also includes a detection section that has a channel that extends vertically within the detection section and a leak detection sensor that is disposed within the channel, a pump that couples the channel to the return manifold, and a valve that couples the channel to the supply manifold.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: July 25, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11711910
    Abstract: A liquid cooling system can be installed to an information technology (IT) rack. The liquid cooling system can include a cooling assembly that has a cooling chassis and cold plates fixed at a bottom portion of the cooling chassis. Fluid lines are arranged in an interior of the cooling chassis to fluidly connect the cold plates to a supply line and a return line. The cooling chassis includes an outlet port that provides a path for a leaked fluid to flow out of the cooling chassis. The outlet port is inserted into an opening of a detection channel that has one or more fluid sensors within the detection channel. The floor of the cooling chassis may have a shape or other features to assist flow of leaked fluid towards the outlet port to assist in depositing the leaked fluid in the detection channel.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: July 25, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11700714
    Abstract: According to one embodiment, an immersion cooling system may include a container to receive one or more server blades, each having electronics, at least partially submerged within a two-phase coolant contained within the container. The immersion cooling system may also include a cover panel to cover the phase change area. This area may include a liquid region defined to contain the two-phase coolant therein, and a vapor region defined between the cover panel and a surface of the two-phase coolant. The cover panel includes a plurality of slots, covered with rotatable panels. At least one of the slots is configured to allow a server blade to be inserted into the liquid region and at least partially submerged into the two-phase coolant. The slots may be configured to allow a condensing unit to be inserted into the vapor region.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: July 11, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11700709
    Abstract: The disclosure provides a cooling device, for cooling devices that generate heat during their operation. The cooling device includes single phase cooling plates to be attached to the devices to dissipate a majority of the heat from the devices while a first coolant is circulated through the single phase cooling plates. The cooling device also includes a unified cooling plate. The plate is directly attached on top of the single phase cooling plates. The unified cooling plate dissipates a portion of the heat transferred from the single phase cooling plates to the unified cooling plate while a second coolant is circulated through the unified cooling plate and when the first coolant is insufficient to remove the portion of the heat from at least one of the single phase cooling plates. The cooling device may be used as part of an electronic rack, a data center, and in other environments.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: July 11, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Publication number: 20230217625
    Abstract: In one embodiment, an immersion cooling system includes a container to contain first coolant received from a first cooling source and server chassis at least partially submerged into the first coolant. Each server chassis includes an electronic device and a cooling plate attached thereon to extract at least a portion of heat generated by the electronic device. The cooling plate includes an inlet port to receive second coolant from a second cooling source, a coolant channel to distribute the second coolant, and an outlet port to return the second coolant back to the second cooling source. The cooling system further includes a return manifold to be coupled to the second cooling source, the return manifold having one or more manifold return connectors respectively coupled with the server chassis and to receive and return the second coolant from the server chassis back to the second cooling source.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Inventor: TIANYI GAO
  • Publication number: 20230217630
    Abstract: Embodiments are disclosed of an information technology (IT) cooling system. The system includes an IT container having an internal volume. Inside the internal volume there is an immersion fluid region adapted to submerge one or more servers in a two-phase immersion fluid. An immersion condenser is positioned above the immersion fluid region in the internal volume. The design includes a circulation condenser. The circulation condenser is fluidly coupled to a liquid distribution manifold and a vapor return manifold that are positioned in the internal volume above the immersion tank (i.e., the immersion fluid region) and are adapted to circulate a two-phase circulation fluid. The circulation condenser is also fluidly coupled to the immersion condenser, and an external cooling fluid is pumped from the circulation condenser to the immersion condenser. The distribution manifolds are adapted to be fluidly coupled to the server liquid cooling loops.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Inventor: Tianyi GAO
  • Patent number: 11696422
    Abstract: A two phase coolant immersion system includes a top section and an immersion section, where the top section and the immersion section are separated by one or more panels. The immersion section includes at least a number of server slots to receive a number of servers, where each of the servers is at least partially submerged within two phase liquid coolant within the immersion section, where, when the servers operate, the servers generate heat that is transferred to the two phase liquid coolant causing some of the two phase liquid coolant to turn into a vapor. The two phase coolant immersion system includes a condensing section interfaced with the immersion section, where the condensing section includes a vapor collection compartment to collect two phase liquid coolant in vapor phase and a liquid collection compartment situated beneath the vapor collection compartment. The one or more panels prevent vapor loss to the environment.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: July 4, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao