Abstract: Embodiments are disclosed of a fluid delivery and distribution apparatus. The apparatus includes an energy-generating fluid distributor with a hot manifold including a hot chamber fluidly coupled to one or more fluid return inlets and a distributor return outlet, a cold manifold including a cold chamber fluidly coupled to a distributor supply inlet and one or more fluid supply outlets, and one or more thermoelectric devices sandwiched between the hot manifold and the cold manifold so that the thermoelectric device is in thermal contact with the hot chamber and in thermal contact with the cold chamber. The outlet of a main supply line is fluidly coupled to the distributor supply inlet, and the main supply line has a pump fluidly coupled therein that is electrically coupled to the thermoelectric device. The outlet of a main return line is fluidly coupled to the distributor return outlet.

Abstract: In one embodiment, an electronic device cooling package includes an enclosure to house an electronics package, the enclosure including at least one panel with an integrated conducting plate exposed to both an inner surface of the at least one panel and an outer surface of the at least one panel. The electronic device cooling package further includes a mounting mechanism attached to the enclosure to detachably couple a cooling device to the outer surface of the at least one panel of the enclosure. Different electronics packaged within the cooling package includes different co-design of the cooling package and cooling devices.

Abstract: A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.

Abstract: Embodiments are disclosed of a fluid distributor and systems with the fluid distributor. The fluid distributor includes a fluid supply conduit having a main supply inlet and a main supply outlet and a fluid return conduit having a main return inlet and a main return outlet. A thermoelectric assembly is sandwiched between the supply conduit and the return conduit. The thermoelectric assembly including a thermoelectric device sandwiched between a pair of thermally conductive layers, with one thermally conductive layer in thermal contact with the supply conduit and the other thermally conductive layer in thermal contact with the return conduit.

Abstract: Methods, systems, and devices for electronic rack level testing and/or verification are disclosed. The disclosed systems may provide for automated testing of electronic racks that may include fluid recirculation systems. To provide for automated testing, a test unit of a system may automatically and without manual intervention circulate coolant to an electronic rack under test. The testing unit may also pressurize the electronic rack. The testing unit may further depressurize the electronic rack to provide for efficient delivering, deployment commissioning, and reduce the likelihood of coolant circulation issues occurring when initially deployed. A testing server of the system may also provide for load testing and thermal cycling of the electronic rack in an automated manner.

Abstract: A data center and a data center cluster have plurality of immersion cooling systems and a plurality of coolant units that provide two-phase coolant to one or more of the plurality of immersion cooling systems. Each coolant unit dispatches and manages two-phase coolant to two or more of the plurality of immersion cooling systems. The coolant units can fill or empty an immersion tank of an immersion cooling system, and can empty or fill a coolant tank in the coolant unit. A single-phase cooling fluid cools the vapor phase of the two-phase coolant in each immersion cooling system. The coolant units are modular, with a common interface to other coolant units and to immersion cooling systems to create a scalable cooling system and data center.

Abstract: The cooling system for a data center includes an information technology (IT) container, secondary condensing system, and a coolant distribution unit. In particular, an IT container includes a liquid region to store cooling liquid, a vapor region to receive vapor evaporated from the cooling liquid, and a primary condenser disposed within the vapor region to condense the vapor. For example, the external cooling air or cooling liquid is controlled to be delivered to condensers. Further, a secondary condenser is coupled to the IT container via a vapor line to receive at least a portion of the vapor from the vapor region of the IT container and to condense the portion of the vapor. Furthermore, a coolant distribution unit is coupled to the IT container and the secondary condenser to store and to distribute the cooling liquid to the IT container.

Abstract: A coolant management unit for providing liquid cooling for backup battery unit (BBU) modules of an electronic rack includes a BBU return manifold, a BBU supply manifold, a balance loop, and a power bus. For example, a BBU supply manifold having a rack supply connector to receive cooling fluid from a rack supply manifold and a BBU supply connector to be connected to one of the BBU modules to distribute the cooling fluid. A BBU return manifold to be coupled to a rack return manifold, wherein the BBU return manifold is to receive vapor from the BBU modules. A balance loop connected to each of the BBU modules to establish a fluid connection amongst the BBU modules, such that a level of the cooling fluid in each of the BBU modules remains similar.

Abstract: In one embodiment, a liquid cooling system includes a coolant distribution device including a first set of fluid connectors to receive a cooling liquid and a second set of fluid connectors to distribute coolant to a cooling device and a cooling device coupled to the coolant distribution device. The cooling device includes an elongated chassis, a cooling plate integrated, contained, and/or prefabricated within the elongated chassis of the cooling device, and a fluid distribution channel integrated within the elongated chassis to provide cooling liquid to the cooling plate. The cooling device further includes fluid connectors to receive the cooling liquid from a coolant distribution device and a blocking channel disposed between the cooling plate and the fluid connectors, the blocking channel to mate with a blocking plate of the coolant distribution device.

Abstract: According to one embodiment, an Information Technology (IT) power system for a data center. The system includes a utility power source, an IT cluster that includes a several pieces of IT equipment. The cluster is coupled to the source and is configured to draw power from the source and provide the drawn power to the pieces of IT equipment. The system also includes a photovoltaic (PV) system that includes a PV panel that is arranged to convert solar radiation into direct current (DC) power. It also may include a voltage sensor and a controller that are configured to decouple the cluster from the source and to couple the cluster to the PV system such that the cluster draws the DC power directly from the PV panel when the output voltage of the PV panel sensed by the voltage sensor exceeds a threshold value.

Abstract: A fluid deployment unit includes an expandable container containing mixed fluids in a gaseous region and a liquid region, where the expandable container includes a gas-out port, a liquid-out port, a gas-in port, and a liquid-in port. The fluid deployment unit includes a first three-way valve having a first port coupled to the liquid-out port, a second port coupled to the gas-out port, and a third port matable to an inlet of an electronic rack. The fluid deployment unit includes a second three-way valve having a first port matable to an input port of a liquid-to-liquid exchange unit of a testing assistant unit, a second port coupled to the gas-in port, and a third port matable to an outlet of the electronic rack, where the liquid-in port of the expandable container is matable to an output port of the liquid-to-liquid exchange unit.

Abstract: A fluid distribution apparatus for servers mounted onto a rack. The apparatus includes one or more pairs of distribution units that are rotationally symmetric and are attached to each other to form the pair. Each of the distribution units includes a main supply port and main return port that are connected to the rack's fluid manifolds. Each of the distribution units also includes plurality of supply and return connectors that connect to the servers. A pump in each of the distribution units delivers fluid from the rack's fluid manifolds to the servers for cooling. Each server is connected to fluid ports on both distribution units, so as to provide full redundancy. A controller receives signals form the servers and sends operation signals to the pumps to control the fluid delivery for cooling the servers.

Abstract: A fluid distribution system is incorporated into a server chassis. Connector plates have fluid connectors designed to connect with fluid cooling receptacles on server boards. A linkage system can be manually manipulated to translate the connector plates so as to engage the electronics boards and connect the fluid connectors to the receptacle. A pair of main connectors connect to the rack's fluid manifold to circulate cooling fluid to cool devices mounted onto the server boards. A locking mechanism can be included to mechanically lock the chassis to the rack to prevent accidental dismount of the chassis from the rack. Also, an anchor mechanism may be provided to apply counter force when engaging the connector plates with the server boards so as to prevent accidental dismount of the server board by the moving connector plate.

Abstract: According to one embodiment, a cooling assembly includes a cooling plate to be attached to an electronic device and a bidirectional connector for circulating cooling fluid to the cooling plate. The bidirectional connector includes a first tubing structure having a first fluid channel therein to supply the cooling fluid flowing in a first direction to the cooling plate, a second tubing structure that encloses the first tubing structure therein. The first tubing structure is positioned spaced apart from the second tubing structure to form a second fluid channel between an outer surface of the first tubing structure and an inner surface of the second tubing structure. The second fluid channel is configured to receive the cooling fluid returned from the cooling plate. The first and second fluid channels are configured to operate a supply and a return fluid streams in opposite directions, respectively.

Abstract: According to one embodiment, a connector module, including a first bidirectional connector and a second bidirectional connector to fluidly interconnect between a cooling module of a server chassis and a rack manifold of an electronic rack; and a middle section positioned and connected between the first bidirectional connector and the second bidirectional connector. The middle section includes a side wall that separates the first bidirectional connector and the second bidirectional connector, and a side gate disposed on the side wall to place the first bidirectional connector and second bidirectional connector in fluid communication while in a first position and to fluidly isolate the first bidirectional connector from the second bidirectional connector while in a second position. The side gate is adapted to actuate to the first position when a fluid pressure differential between the first bidirectional connector and the second bidirectional connector exceeds a predetermined threshold.

Abstract: A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with phase change liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the two phase liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. An air mover generates pressure differential within the containment passageway to direct the vapor towards the condenser.

Abstract: According to one embodiment, a data center air cooling system includes a first information technology (IT) room and a second IT room, each with electronic racks with one or more pieces of IT equipment. The system includes an air cooling unit that provides cooling air into an air chamber, which supplies the cooling air to the first IT room. The system includes an air duct system that supplies the cooling air from the air chamber to the second IT room and returns warmed air from the first IT room and the second IT room to the air cooling unit. The system includes several louvers that are each arranged to open and close independently and in different combinational modes to create several airflow management modes for cooling pieces of IT equipment in the first IT room, in the second IT room, or a combination thereof.

Abstract: According to one embodiment, a cooling system includes a primary condenser, a primary supply line and a primary return line that couples the primary condenser to a cold plate that is arranged to be used for electronics cooling to create a primary heat-transfer loop in which the condenser supplies liquid coolant to the cold plate and receives vapor produced by the cold plate, a secondary condenser, a secondary supply line that couples the secondary condenser to the primary supply line, a secondary return line that couples the secondary condenser to the primary return line, and a primary valve that is coupled to the secondary return line, where, in response to vapor pressure exceeding a pressure threshold, the valve at least partially opens to create a secondary heat-transfer loop in which the secondary condenser condense vapor back into liquid coolant that is supplied to the primary supply line.

Abstract: A server chassis for a server rack can include a connector assembly. The connector assembly can include a first pair of connectors to fluidly connect to one or more cold plates that are thermally coupled to one or more electronic server components, and a second pair of connectors, to fluidly connect to a supply line and return line of the server rack. The connector assembly may further include a mobile plate upon which the second pair of connectors are attached to. The mobile plate may be attached as part of the connector assembly and movable to and from a direction that connects or disconnects the second pair of connectors to the supply line and the return line of the server rack.

Abstract: Immersion cooling system for electronics. The electronics are immersed in immersion tank filled with immersion liquid. A universal supply utilizes a supply panel to fill cooled liquid into the tank. Localized supply utilizes a manifold to deliver cooled liquid to specific devices within the tank. Cooled liquid is delivered via connection of the manifold and the flexible hoses to cooling plates mounted onto the devices. Each of the cooling plates has a cavity for passing cooled liquid, a supply inlet connected to one of the flexible hoses, and an outlet hole releasing the liquid into the tank. The cooled liquid is supplied to the universal supply from a main cooler. The cooled liquid is supplied to the manifold from the main cooler or from a secondary cooler. The immersion tank has a single recirculation outlet to return liquid mixed from both the universal supply and the localized supply.