Abstract: A server liquid cooling fluid cutoff system including a server connector module, a leaking sensor, and an electromagnet device is proposed in the current application. In one embodiment, a server connector module is to be mounted on a server chassis, and the server connector module has at least a pair of server blind mating connectors capable of being engaged with or disengaged from at least a pair of rack blind mating connectors of a rack manifold of the electronic rack coupled to an external cooling fluid source. In an embodiment, a leaking sensor is configured to detect leakage of the cooling fluid within the server chassis. In an embodiment, an electromagnet device is coupled to the server connector module and the leaking sensor. In an embodiment, an elastic structure is coupled to the connector module for pushing the connector away.

Abstract: An electronic rack includes one or more servers, where each server is contained within a respective server container, and each server is at least partially submerged in two-phase liquid coolant, where, while the server generates heat that is transferred to the two phase liquid coolant thereby causing some of the two phase liquid coolant to turn into a vapor. The electronic rack includes a condenser container and condensing coils mounted at a top portion of the electronic rack to condense the vapor into the two-phase liquid coolant. The electronic rack includes a vapor manifold along a length of the electronic rack, the vapor manifold coupling the condenser container to a respective server, where the vapor manifold carries the vapor from the servers to the condensing coils. The electronic rack includes a first return line coupled to the condenser container, to return the two-phase liquid coolant to a coolant unit.

Abstract: Embodiments are disclosed of an apparatus including a utility section adapted to be positioned in a server chassis and coupled to an electronics section in the server chassis. The utility section includes a power board, a fluid handling module, a fan module electrically coupled to the power board, or both the fluid handling module and the fan module. An external power interface is adapted to electrically couple the power board to a rack power source and an internal power interface is adapted to electrically coupled the power board to one or more servers in an electronic section within the chassis. An external fluid interface is adapted to fluidly couple the fluid handling module to a rack fluid recirculation loops, and an internal fluid interface is adapted to fluidly couple the fluid handling module to a server fluid inlet and a server fluid outlet of each of the one or more electronics sections.

Abstract: A cooling plate includes an inlet port to receive two-phase fluid, a base plate to be attached to server electronics for cooling, a number of heat spreading structures disposed and spaced apart on the base plate to extend a heat exchange area from the base plate, and a number of fluid channels disposed on the base plate, where each of the fluid channels is situated between a pair of adjacent heat spreading structures. Each of the fluid channels include a channel inlet to receive at least a portion of the two-phase fluid from the inlet port, a channel outlet to allow the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel, and one or more intermediate outlets disposed between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to exit in vapor or liquid form.

Abstract: A two-phase fluid management system, may include a sealed container and a mobile condenser that moves within the sealed container. The sealed container may include a plurality of input ports, each to receive a two-phase fluid as vapor from a respective one of a plurality of IT enclosures and a plurality of output ports, each to return the two-phase fluid as liquid to the respective one of the plurality of IT enclosures. The mobile condenser may be coupled to or include an actuator to move the mobile condenser to a respective one of a plurality of positions within the sealed container. An air intake and air outlet of the mobile condenser may form a sealed connection with a pair of condenser ports when the mobile condenser moves to the respective one of the plurality of positions.

Abstract: Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. An apparatus to provide cooling for an electronic rack of a data center comprises a plurality of lines. A main chassis is coupled to the plurality of lines. The main chassis is configured to be integrated on the electronic rack. An extension chassis is coupled to the main chassis. The extension chassis is configured to move relative to the main chassis. A plurality of connection ports are coupled to the extension chassis to provide connections between the electronic rack and one or more external sources. The plurality of connection ports are configured to move relative to the plurality of lines that are at fixed locations on the electronic rack.

Abstract: A connector assembly may include a plate to be attached to a server chassis of an electronic rack; a connection module; and a moveable alignment module having a guiding structure and configured to be coupled to the plate via the connection module. The moveable alignment module may house one or more fluid blind mate connectors that fluidly connect to one or more cold plates that are thermally coupled to one or more electronic server components of the server chassis. The connection module may enable the moveable alignment module to be moveable when the guiding structure engages a distribution manifold of the electronic rack to align and couple the one or more fluid blind mate connectors to either at least one of a supply line connector or a return line connector of the distribution manifold, thereby enabling fluid communication between the server chassis and the distribution manifold.

Abstract: A connector assembly may include a distribution frame having an adjusting channel; and one or more distribution modules disposed and slidably moveable along the adjusting channel. Each of the one or more distribution modules may include an inlet connector to receive cooling liquid from a cooling liquid loop, a fluid blind mate connector to-connect the cooling liquid loop to one or more cold plates of a server chassis, and a guiding element having a guiding structure and configured to house the fluid blind mate connector. When the he guiding element contacts with the server chassis, the guiding element causes the corresponding distribution module to move slightly to align the fluid blind mate connector with a server connector of the server chassis, such that the fluid blind mate connector connects with the server connector to distribute the cooling liquid to the server chassis.

Abstract: A rack with two-phase loop recirculation includes a supply manifold, a return manifold, and a separator. For example, a supply manifold is configured to receive two-phase cooling fluid from a cooling fluid source to distribute the two-phase cooling fluid to one or more server chassis. The two-phase cooling fluid is to extract heat from the one or more electronic devices and to transform into two-phase mixing fluid having at least a portion of the two-phase fluid transformed into vapor. A return manifold is configured to receive the two-phase mixing fluid from one or more loops associated with one or more electronic devices of the server chassis. A separator disposed on the return manifold is configured to separate the vapor of the two-phase mixing fluid and to divert first remaining two-phase cooling fluid of the two-phase mixing fluid directly back to the supply manifold through a return loop.

Abstract: A cooling plate includes a fluid inlet port, a cooling enclosure, and an inlet channel coupled between the fluid inlet port and the cooling enclosure to channel a two-phase fluid entering from the inlet port to the cooling enclosure. The cooling enclosure includes a number of heat spreading structures coupled to an inner surface of the cooling enclosure to form spacings, where the two-phase fluid in contact with the heat spreading structures causes portions of the two-phase fluid to change into a vapor phase. The cooling plate includes an extended vapor channel coupled to the cooling enclosure to collect the two-phase fluid in vapor phase. The cooling plate includes a vapor outlet port coupled to the extended vapor channel for the two-phase fluid in vapor phase to exit the vapor outlet port, where the cooling plate is submersible in an immersion tank containing a single-phase immersion fluid.

Abstract: A cooling system comprises a board management controller (BMC), a thermoelectric cooling (TEC) controller, and a cooling distribution unit (CDU) controller. The BMC monitors a cooling system to obtain a first power value representing a power consumed by an electronic device, performs a lookup operation in a control lookup table based on the first power value, and determines a first thermoelectric cooling (TEC) current and a first pump speed based on the lookup operation. The TEC controller is to control a TEC device attached to the electronic device to cause the first TEC current to flow within the TEC device. The CDU controller is to configure a pump speed of a fluid pump of the CDU according to the first pump speed.

Abstract: In one embodiment, an apparatus for mounting a power module to a server chassis includes a first rail member attachable to a server chassis and a second rail member mountable to the first rail member. The second rail member includes several mounting points. The apparatus further includes a power distribution board (PDB) coupled to the second rail member at one of the mounting points. The PDB connects power from a power bus of an electronic rack to a server included in the server chassis populated on the rack. The PDB includes one or more power conversion devices to regulate power to the one or more electronic devices of the server and a set of power clips to attach the PDB to a power bus of an electronic rack. The coupling of the PDB and the rails enable connections to different electronic racks.

Abstract: Systems, apparatuses and methods to provide a hybrid cooling for servers of a data center are described. A cooling plate comprises an inlet port to receive a coolant from a coolant source. The coolant is a two-phase coolant that transforms from a liquid state into vapor when being attached to an electronic device to extract heat from the electronic device. The cooling plate comprises an outlet port to output at least a portion of the coolant back to the coolant source. The cooling plate comprises a vapor port to output the vapor generated from the coolant to a condenser that is configured to condense the vapor back to the liquid state.

Abstract: An information technology (IT) enclosure may have a hybrid architecture. Such an enclosure may include an immersion tank that holds a single-phase coolant fluid. One or more servers may be immersed in the tank. The server chassis may have electronics that are thermally coupled to a two-phase fluid via a thermosiphon loop. The server chassis includes a condensing unit forming the thermosiphon loop and the condensing unit is submerged in the single phase fluid.

Abstract: A blind mating connection structure for servers is disclosed. On the server side, a connector module has fluid connectors to be blind mated to fluid connectors on rack manifolds in a server rack. The connector module is coupled to a sliding channel on the server. The connector module slides horizontally and vertically in response to movement of a positioning slider on the connector module. On the rack manifold side, a guiding module has an opening that receives the positioning slider when the server is installed in the server rack. The guiding module tapers down to a centering point midway between each rack manifold. As the server is slid into the server rack, the positioning slider follows the guiding module to the center point, moving the connector module into alignment with the fluid connectors on the rack manifold for blind mating.

Abstract: An information technology (IT) equipment cooling system includes a coolant unit to be coupled to an electronic rack, the coolant unit to supply a two phase liquid coolant to one or more IT equipment cooling sets mounted within on an electronic rack. Each of the one or more IT equipment cooling sets includes an IT unit having one or more pieces of IT equipment configured to provide IT services and is at least partially submerged within the two phase liquid coolant, where, while the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the two phase liquid coolant thereby causing at least some of the two phase liquid coolant to turn into vapor phase. The IT equipment cooling set includes an IT condensing unit having a condenser positioned above the IT unit and the condenser is to condense the vapor back into liquid state.

Abstract: An information technology (IT) enclosure may have a hybrid architecture. Such an enclosure may include an immersion tank that holds a single-phase coolant fluid. One or more servers may be immersed in the tank. The server chassis may have electronics that are thermally coupled to a two-phase fluid via a thermosiphon loop. The server chassis includes a condensing unit forming the thermosiphon loop and the condensing unit is submerged in the single phase fluid.

Abstract: A rack cooling system includes a primary cooling condenser and a secondary cooling condenser. The primary cooling condenser is positioned above servers of a server rack and the secondary cooling condenser is position above the primary cooling condenser. Each of the severs, the primary cooling condenser, and the secondary cooling condenser is connected to a liquid manifold via one of a plurality of liquid ports on the liquid manifold, and to the vapor manifold via one of a plurality of vapor ports on the vapor manifold. A cooling capacity of the rack cooling system can be extended by switching on a vapor flow between the secondary cooling condenser and the primary cooling condenser using a first valve on the vapor manifold. Further, a second valve on a primary cooling loop can be used to control cooling fluid flowing into the secondary cooling condenser after the first valve is trigged open.

Abstract: A server includes a chassis; a base panel fixedly coupled to the chassis; a movable panel coupled to the base panel; and a locking member fixedly coupled to the movable panel. The movable panel is movable relative to the base panel in a moving direction between an unlocked position where the locking member is configured to be disengaged with a locking panel of an electronic rack, and a locked position where the locking member is configured to be engaged with the locking panel of the electronic rack.

Abstract: Embodiments are disclosed of an information technology (IT) rack. The IT rack includes an equipment enclosure with a front, a rear, and one or more partitions, each partition adapted to receive one or more pieces of liquid-cooled information technology (IT) equipment. One or more cooling doors are positioned on the back of the equipment enclosure, each having therein a heat exchanger, the heat exchanger that is fluidly coupled to at least one of the one or more pieces of liquid-cooled IT equipment forming liquid cooling loops. Each of the one or more cooling doors is movable between a first position where the cooling door extends across the back of at least one partition so that air from the interior of the at least one partition flows through the cooling door, and a second position where air from outside the equipment enclosure flows through the cooling door. Fans are used in the middle section of rack or between two enclosures for assisting airflow management.