Patents by Inventor Tien Chiu

Tien Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF PRODUCING ANODE MATERIAL AND THE ANODE MATERIALS THEREOF
    Publication number: 20130167913
    Abstract: The present invention provides a method of producing anode material, and the steps are as follows: TiO2 and NaOH are in the hydrothermal reaction to generate a fibered precursor; acid pickling the fibered precursor to generate a fibered sodium hydroxo titanate (H2Ti3O7.5H2O); disposing the fibered sodium hydroxo titanate on a membrane to dry, and thus to generate a flexible sodium hydroxo titanate membrane; and the flexible sodium hydroxotitanate membrane is reacted with NH3 flow to generate a titanium oxynitride membrane.
    Type: Application
    Filed: July 16, 2012
    Publication date: July 4, 2013
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Chi-Young LEE, Hsiao-Ping Liu, Hsin-Tien Chiu, Yen-Ju Wei
  • Harmonics generation apparatus and method thereof
    Patent number: 8416965
    Abstract: A harmonic generating apparatus and the method are provided, which are used to enhance the quality of the bass audio signals. The method includes the steps of: providing a frequency signal having a present level and a preceding level; comparing the present level with the preceding level to generate a compared result; and generating the plurality of harmonics based on the compared result.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: April 9, 2013
    Assignee: Realtek Semiconductor Corp.
    Inventor: Tien-Chiu Hung
  • CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS
    Publication number: 20130015589
    Abstract: A multi-die semiconductor device is disclosed. The device may include one or more first-sized die on a substrate and one or more second-sized die affixed over the one or more first-sized die. The second-sized die may have a larger footprint than the first-sized die. An internal molding compound may be provided on the substrate having a footprint the same size as the second-sized die. The second-sized die may be supported on the internal molding compound. Thereafter, the first and second-sized die and the internal molding compound may be encapsulated in an external molding compound.
    Type: Application
    Filed: July 14, 2011
    Publication date: January 17, 2013
    Inventors: Chih-Chin Liao, Chin-Tien Chiu, Cheeman Yu, Suresh Kumar Upadhyayula, Wen Cheng Li, Zhong Lu
  • Turbine rotor wheel
    Patent number: 8348599
    Abstract: A rotor wheel is provided and includes a body having first and second opposing faces and portions recessed from a plane of the first face to define therein an annular groove and a plurality of tributary grooves, the annular groove being receptive of fluid from an external source and formed to direct the fluid to flow along an annular flow path, and the plurality of tributary grooves being receptive of the fluid from the annular groove and respectively formed to direct the fluid to flow sequentially along radial and axial tributary flow paths while preventing inter-tributary groove fluid communication.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: January 8, 2013
    Assignee: General Electric Company
    Inventors: Ya-Tien Chiu, Venkata Siva Chaluvadi, Matthew Ryan Ferslew
  • EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
    Publication number: 20120279651
    Abstract: A system and method are disclosed for applying a die attach epoxy to substrates on a panel of substrates. The system includes a window clamp having one or more windows through which the epoxy may be applied onto the substrate panel. The size and shape of the one or more windows correspond to the size and shape of the area on the substrate to receive the die attach epoxy. Once the die attach epoxy is sprayed onto the substrate through the windows of the window clamp, the die may be affixed to the substrate and the epoxy cured in one or more curing steps. The system may further include a clean-up follower for cleaning epoxy off of the window clamp, and a window cleaning mechanism for cleaning epoxy off of the sidewalls of the windows of the window clamp.
    Type: Application
    Filed: May 5, 2011
    Publication date: November 8, 2012
    Inventors: Wei Gu, Zhong Lu, Shrikar Bhagath, Chin-Tien Chiu, Hem Takiar, XiangYang Liu
  • Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas
    Publication number: 20120273968
    Abstract: A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
    Type: Application
    Filed: July 9, 2012
    Publication date: November 1, 2012
    Inventors: Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar
  • GLOB TOP SEMICONDUCTOR PACKAGE
    Publication number: 20120193802
    Abstract: A semiconductor package is disclosed including a substrate, a solder mask layer, one or more semiconductor die mounted to the solder mask layer and electrically coupled to the substrate, and a glob top cover over the semiconductor die. The solder mask further includes a dam protruding above surrounding areas of the solder mask layer and a cavity recessed into the solder mask layer for limiting flow of the glob top cover when the glob top material is applied.
    Type: Application
    Filed: February 1, 2011
    Publication date: August 2, 2012
    Inventors: Chin-Tien Chiu, Chih-Chin Liao, Peng Fu
  • Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
    Patent number: 8232145
    Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: July 31, 2012
    Assignee: SanDisk Technologies Inc.
    Inventors: Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Hem Takiar, Jack Chang Chien, Ning Liu
  • Printed circuit board with coextensive electrical connectors and contact pad areas
    Patent number: 8217522
    Abstract: A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: July 10, 2012
    Assignee: SanDisk Technologies Inc.
    Inventors: Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar
  • Semiconductor die having a redistribution layer
    Patent number: 8212360
    Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: July 3, 2012
    Assignee: SanDisk Technologies Inc.
    Inventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu, Hem Takiar
  • HIDDEN PLATING TRACES
    Publication number: 20120164828
    Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.
    Type: Application
    Filed: March 2, 2012
    Publication date: June 28, 2012
    Inventors: Hem Takiar, Cheeman Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao
  • PRE-TREATMENT OF MEMORY CARDS FOR BINDING GLUE AND OTHER CURABLE FLUIDS
    Publication number: 20120146247
    Abstract: A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of a curable fluid such as glue or ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface.
    Type: Application
    Filed: June 8, 2011
    Publication date: June 14, 2012
    Inventors: Itzhak Pomerantz, Shiv Kumar, Robert Miller, Chin-Tien Chiu, Peng Fu, Cheeman Yu, Hem Takiar, Chih Chiang Tung, Kaiyou Qian, Rahav Yairi
  • PRE-TREATMENT OF MEMORY CARDS FOR INK JET PRINTING
    Publication number: 20120081860
    Abstract: A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface.
    Type: Application
    Filed: October 4, 2010
    Publication date: April 5, 2012
    Inventors: Itzhak Pomerantz, Shiv Kumar, Robert Miller, Chin-Tien Chiu, Peng Fu, Cheeman Yu, Hem Takiar, Chih Chiang Tung, Kaiyou Qian
  • SEALING ASSEMBLY FOR USE IN TURBOMACHINES AND METHOD OF ASSEMBLING SAME
    Publication number: 20120076642
    Abstract: A method of assembling a sealing assembly for a turbomachine is provided. The method includes positioning at least one sealing element that includes a substantially tortuous flow path defined therein within at least one channel defined in a rotatable element of the turbomachine. The sealing element is extended circumferentially about the rotatable element such that the sealing element extends into a cavity defined between the rotatable element and a stationary element. This facilitates substantially reducing flow leakage from an upstream region of the cavity to a downstream region of the cavity.
    Type: Application
    Filed: September 23, 2010
    Publication date: March 29, 2012
    Inventors: Ya-Tien Chiu, James Royce Howes
  • Hidden plating traces
    Patent number: 8129272
    Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: March 6, 2012
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Cheeman Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao
  • TURBINE ROTOR WHEEL
    Publication number: 20110236190
    Abstract: A rotor wheel is provided and includes a body having first and second opposing faces and portions recessed from a plane of the first face to define therein an annular groove and a plurality of tributary grooves, the annular groove being receptive of fluid from an external source and formed to direct the fluid to flow along an annular flow path, and the plurality of tributary grooves being receptive of the fluid from the annular groove and respectively formed to direct the fluid to flow sequentially along radial and axial tributary flow paths while preventing inter-tributary groove fluid communication.
    Type: Application
    Filed: March 26, 2010
    Publication date: September 29, 2011
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Ya-Tien Chiu, Venkata Siva Chaluvadi, Matthew Ryan Ferslew
  • SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER
    Publication number: 20110210446
    Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.
    Type: Application
    Filed: May 9, 2011
    Publication date: September 1, 2011
    Inventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu, Hem Takiar
  • SYSTEMS AND APPARATUS RELATING TO COMPRESSOR OPERATION IN TURBINE ENGINES
    Publication number: 20110158797
    Abstract: A compressor of a turbine engine, the compressor including stator blades with shrouds, the shrouds being surrounded, at least in part, by rotating structure and forming a shroud cavity therebetween, the compressor including: a plurality of tangential flow inducers disposed within the shroud cavity; wherein each tangential flow inducer comprises a surface disposed on the rotating structure that is configured such that, when rotated, induces a tangential directional component to and/or increases the velocity of a flow of leakage exiting the shroud cavity.
    Type: Application
    Filed: December 31, 2009
    Publication date: June 30, 2011
    Inventors: Ya-Tien Chiu, Venkata S.P. Chaluvadi, Peter S. King
  • APPARATUS, METHOD AND SYSTEM FOR GENERATING THRESHOLD FOR UTTERANCE VERIFICATION
    Publication number: 20110161084
    Abstract: Apparatus, method and system for generating a threshold for utterance verification are introduced herein. When a processing object is determined, a recommendation threshold is generated according to an expected utterance verification result. In addition, extra collection of corpuses or training models is not necessary for the utterance verification introduced here. The processing unit can be a recognition object or an utterance verification object. In the apparatus, method and system for generating a threshold for utterance verification, at least one of the processing objects is received and then a speech unit sequence is generated therefrom. One or more values corresponding to each of the speech unit of the speech unit sequence are obtained accordingly, and then a recommendation threshold is generated based on an expected utterance verification result.
    Type: Application
    Filed: June 24, 2010
    Publication date: June 30, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Hsien Lin, Sen-Chia Chang, Chi-Tien Chiu
  • Padless substrate for surface mounted components
    Patent number: 7967184
    Abstract: A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: June 28, 2011
    Assignee: SanDisk Corporation
    Inventors: Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Chin-Tien Chiu, Jack Chang Chien, Shrikar Bhagath, Cheemen Yu, Hem Takiar