Abstract: A photographing lens system includes, in order from an object side to an image side along an optical path, a front lens group and a rear lens group. The front lens group includes four lens elements. The rear lens group includes four lens elements. A second lens element counted from the image side in the front lens group has negative refractive power. An image-side surface of a first lens element counted from the image side in the front lens group is convex in a paraxial region thereof. A second lens element counted from the object side in the rear lens group has negative refractive power. An object-side surface of a first lens element counted from the image side in the rear lens group is concave in a paraxial region thereof. At least one lens element in the rear lens group has at least one lens surface being aspheric.

Abstract: A high voltage device includes: a semiconductor layer, a well, a drift oxide region, a body region, a gate, a source, a drain, and a field plate. The well has a first conductivity type, and is formed in a semiconductor layer. The drift oxide region is formed on the semiconductor layer. The body region has a second conductivity type, and is formed in the semiconductor layer, wherein the body region and a drift region are connected in a channel direction. The gate is formed on the semiconductor layer. The source and the drain have the first conductivity type, and are formed in the semiconductor layer, wherein the source and the drain are in the body region and the well, respectively. The field plate is formed on and connected with the drift oxide region, wherein the field plate is electrically conductive and has a temperature coefficient (TC) not higher than 4 ohm/° C.

Abstract: A semiconductor structure includes a substrate, first fins extending from the substrate with a first fin pitch, and second fins extending from the substrate with a second fin pitch smaller than the first fin pitch. The semiconductor structure also includes first gate structures engaging the first fins with a first gate pitch and second gate structures engaging the second fins with a second gate pitch smaller than the first gate pitch. The semiconductor structure also includes first epitaxial semiconductor features partially embedded in the first fins and adjacent the first gate structures and second epitaxial semiconductor features partially embedded in the second fins and adjacent the second gate structures. A bottom surface of the first epitaxial semiconductor features is lower than a bottom surface of the second epitaxial semiconductor features.

Abstract: An imaging optical system lens assembly includes six lens elements, which is, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element has negative refractive power, the object-side surface of the first lens element is concave in a paraxial region thereof, the image-side surface of the first lens element is convex in a paraxial region thereof. The second lens element has positive refractive power, the object-side surface of the second lens element is convex in a paraxial region thereof, the image-side surface of the second lens element is concave in a paraxial region thereof. The fifth lens element has positive refractive power.

Abstract: The present invention provides a separator formed by hydrolysis of a resin film. The resin film comprises a non-hydrolyzable organic polymer; and a hydrolyzable organic polymer being hydrolyzable by treatment with at least one of an acid aqueous solution, an alkaline aqueous solution and pure water, wherein the content of the hydrolyzable organic polymer ranges from 10 parts by weight to 70 parts by weight relative to 100 parts by weight of the resin film. The separator of the present invention has good ion conductivity and thus, is extremely suitable for use in various types of batteries.

Abstract: The present disclosure discloses a servo motor and an encoder calibration method. The encoder calibration method includes: calculating a gain error, an offset error and a phase error, by an error calculation block, according to a first signal and a second signal output by an encoder; calculating at least one gain calibration parameter, at least one offset calibration parameter and at least one phase calibration parameter, by the error calibration block, according to the gain error, the offset error and the phase error; and calibrating sequentially, by the encoder, the gain, the offset and the phase of the first signal and the second signal according to the at least one gain calibration parameter, the at least one offset calibration parameter and the at least one phase calibration parameter, wherein performing at least one gain calibration and offset calibration after the phase calibration is completed.

Abstract: A semiconductor device includes first and second semiconductor fins extending from a substrate and a source/drain region epitaxially grown in recesses of the first and second semiconductor fins. A top surface of the source/drain region is higher than a surface level with top surfaces of the first and second semiconductor fins. The source/drain region includes a plurality of buffer layers. Respective layers of the plurality of buffer layers are embedded between respective layers of the source/drain region.

Abstract: A chip device is provided. The chip device includes a substrate, at least one chip, a sealing component, a heat-conducting medium, a barrier, and a heat dissipation device. The at least one chip is disposed over a first surface of the substrate and has a heat transfer surface. The sealing component covers the at least one chip and has a heat transfer area thermal contacting the heat transfer surface of the at least one chip. The heat-conducting medium is disposed over the heat transfer area of the sealing component. The barrier is disposed around and blocks the heat-conducting medium. The heat dissipation device is disposed over the heat transfer area of the sealing component and on the heat-conducting medium. The chip device can block the heat-conducting medium through the barrier to prevent the heat-conducting medium from overflowing or losing between the sealing component and the heat dissipation device.

Abstract: The present disclosure is drawn to covers for electronic, devices, methods of making the covers, and electronic devices, in one example, described herein Is a cover for an electronic device comprising: a substrate; a micro-arc oxidation layer applied on at least one surface of the substrate; and a dyeing layer on the micro-arc oxidation layer, wherein the dyeing layer comprises: from about 3 to about 10 wt% wafer based dyes based on the total weight of the dyeing layer; and from about 0.3 wt % to about 2 wt% surfactant based on the total weight of the dyeing layer.

Abstract: A semiconductor device structure and a formation method are provided. The method includes forming a sacrificial base layer over a substrate and forming a semiconductor stack over the sacrificial base layer. The semiconductor stack has multiple sacrificial layers and multiple semiconductor layers laid out alternately. The method also includes forming a gate stack to partially cover the sacrificial base layer, the semiconductor layers, and the sacrificial layers. The method further includes removing the sacrificial base layer to form a recess between the substrate and the semiconductor stack. In addition, the method includes forming a metal-containing dielectric structure to partially or completely fill the recess. The metal-containing dielectric structure has multiple sub-layers.

Abstract: A diode test module and method applicable to the diode test module are provided. A substrate having first conductivity type and an epitaxial layer having second conductivity type on the substrate are formed. A well region having first conductivity type is formed in the epitaxial layer. A first and second heavily doped region having second conductivity type are theoretically formed in the well and connected to a first and second I/O terminal, respectively. Isolation trench is formed there in between for electrical isolation. A monitor cell comprising a third and fourth heavily doped region is provided in a current conduction path between the first and second I/O terminal when inputting an operation voltage. By employing the monitor cell, the invention achieves to determine if the well region is missing by measuring whether a leakage current is generated without additional testing equipment and time for conventional capacitance measurements.

Abstract: A surface inspection system for foil article is disclosed. The surface inspection system comprises a box having a top long narrow opening and a bottom long narrow opening, a bridge interface, a first light source, a second light source, a first modular camera device having a first camera, and a second modular camera device having a second camera. In which, the first light source, the second light source, the first modular camera device, and the second modular camera device all accommodated in the box, and are coupled to a control box through the bridge interface. Particularly, this surface inspection system is allowed to be integrated in an automatic production line of a foil article like electro-forming aluminum foil (also called electronic aluminum foil), so as to achieve an in-line inspection of the surface morphology of the electro-forming aluminum foil.

Abstract: Batch semiconductor packaging structures with back-deposited shielding layer and manufacturing method are provided. A grid having multiple frames is glued on an adhesive substrate. Multiple semiconductor devices respectively align with corresponding frames and are stuck on the adhesive substrate. Then a metal layer covers the semiconductor devices and the grid. A distance between four peripheries of a bottom of each semiconductor device and the corresponding frame is smaller than a distance between the bottom and the adhesive substrate, so that the a portion of the metal layer extended to the peripheries of the bottom is effectively reduced during forming the metal layer. After the semiconductor devices are picked up, no metal scrap is remined thereon. Therefore, the adhesive substrate does not need to form openings in advance and is reusable. The grid is also reusable so the manufacturing cost of the present invention is decreased.

Abstract: An off-line uninterruptible power system and two line-interactive uninterruptible power systems are provided. The off-line uninterruptible power system and one of the line-interactive uninterruptible power systems additionally adopt a transformer for supplying an AC output, with lower voltage level than a rated output voltage, to at least one electrical device (especially those with resistive load characteristic). The other line-interactive uninterruptible power system controls its automatic voltage regulating circuit to supply an AC output, with lower voltage level than a rated output voltage, to at least one electrical device (especially those with resistive load characteristic).

Abstract: An optical photographing system includes seven lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The object-side surface of the sixth lens element is convex in a paraxial region thereof. At least one of the object-side surface and the image-side surface of at least one lens element of the optical photographing system has at least one inflection point.

Abstract: A defect inspection system is disclosed, and comprises a linear light source, N number of cameras, a display device, a tag reader, and a modular electronic device, in which the linear light source, the cameras and the modular electronic device are used for conducting a defect inspection of an article. On the other hand, the display device, the tag reader and the modular electronic device are adopted for conducting in production of at least one labeled example. Therefore, the modular electronic device is allowed to apply a machine learning process to an image classifier under using a training dataset containing the labeled examples, thereby producing at least one new defect recognition model or updating the existing defect recognition model.

Abstract: A structure of semiconductor device is provided, including a first circuit structure, formed on a first substrate. A first test pad is disposed on the first substrate. A second circuit structure is formed on a second substrate. A second test pad is disposed on the second substrate. A first bonding pad of the first circuit structure is bonded to a second bonding pad of the second circuit structure. One of the first test pad and the second test pad is an inner pad while another one of the first test pad and the second test pad is an outer pad, wherein the outer pad surrounds the inner pad.

Abstract: The disclosure provides a method for manufacturing a separator, comprising the steps of: providing a nonporous precursor substrate; coating a heat-resistant slurry on a surface of the nonporous precursor substrate to form a heat-resistant coating layer, wherein the heat-resistant slurry comprises a binder and a plurality of inorganic particles; and stretching the nonporous precursor substrate with the heat-resistant coating layer formed thereon to generate a separator comprising a porous substrate and a heat-resistant layer; wherein the heat-resistant layer is disposed on the surface of the porous substrate in the range of 10% to 90% of the total surface area of the porous substrate.

Abstract: A motor controlling system is disclosed. The motor controlling system is integrated in an apparatus having roll-to-roll mechanism, and comprises a linear light source, N number of cameras and a modular electronic device. When a roll of continuous web material is discharged by an unwinding unit of the roll-to-roll mechanism so as to be further transferred to an inspection unit, the cameras are controlled by the modular electronic device to capture a plurality of time-consecutive material image frames. Subsequently, the modular electronic device conducts a defection inspection for a segment of the continuous web material by applying an image process to the material image frames. As a result, in case of there being at least one defect found, the modular electronic device stops a plurality of motors of the apparatus from running, thereby making the segment of the continuous web material be positioned on an inspection platform.

Abstract: A chip carrier device includes a frame, a chip support and a limiter. The chip support is disposed on the frame, and includes a supporting film for chips to be adhered thereto. A peripheral portion of the supporting film is attached to a surrounding frame part of the frame. A crossing portion of the supporting film passes through a center of the supporting film, and interconnects two opposite points of the peripheral portion. The supporting film is formed with through holes. The limiter includes a limiting part that interconnects two opposite points of the surrounding frame part, that is positioned corresponding to the crossing portion, and that is positioned on one side of the supporting film where the chips are to be arranged.