Patents by Inventor Tsung Yu

Tsung Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240102315
    Abstract: A lock case with an anti-pick function is mounted on a door. The lock case includes a latch for retaining the door in a closed position. When the door is closed, an anti-pick latch of the lock case is in a retracted position to pivot an anti-pick member of the lock case to an anti-pick position, such that the latch cannot be picked to the latching position. When the door is not closed or a connecting member of the lock case is operated to actuate the latch, the latch can move to the latching position.
    Type: Application
    Filed: October 17, 2022
    Publication date: March 28, 2024
    Inventor: Tsung-Yu Huang
  • Patent number: 11939664
    Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Chun Hsieh, Tsung-Yu Tsai, Hsing-Yuan Huang, Chih-Chang Wu, Szu-Hua Wu, Chin-Szu Lee
  • Publication number: 20240096941
    Abstract: A semiconductor structure includes a substrate with a first surface and a second surface opposite to the first surface, a first and a second shallow trench isolations disposed in the substrate and on the second surface, a deep trench isolation structure in the substrate and coupled to the first shallow trench isolation, a first dielectric layer disposed on the first surface and coupled to the deep trench isolation structure, a second dielectric layer disposed over the first dielectric layer and coupled to the deep trench isolation structure, a third dielectric layer comprising a horizontal portion disposed over the second dielectric layer and a vertical portion coupled to the horizontal portion, and a through substrate via structure penetrating the substrate from the first surface to the second surface and penetrating the second shallow trench isolation.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 21, 2024
    Inventors: SHIH-JUNG TU, PO-WEI LIU, TSUNG-YU YANG, YUN-CHI WU, CHIEN HUNG LIU
  • Publication number: 20240088093
    Abstract: In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Wensen Hung, Tsung-Yu Chen, Wen-Hsin Wei, Hsien-Pin Hu
  • Publication number: 20240087989
    Abstract: A semiconductor arrangement includes a first dielectric feature passing through a semiconductive layer and a first dielectric layer over a substrate. The semiconductor arrangement includes a conductive feature passing through the semiconductive layer and the first dielectric layer and electrically coupled to the substrate. The conductive feature is adjacent the first dielectric feature and electrically isolated from the semiconductive layer by the first dielectric feature.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Josh LIN, Chung-Jen HUANG, Yun-Chi WU, Tsung-Yu YANG
  • Publication number: 20240088125
    Abstract: Devices and methods of manufacture for a deep trench layout area-saving semiconductor structure for use with bipolar-CMOS-DMOS (BCD) devices. A semiconductor device may comprise a first BCD device formed within a first perimeter of a first BCD layout area, and a deep trench isolation structure defining the first perimeter of the first BCD layout area, in which the deep trench isolation structure may comprise a first rounded corner that may define a first corner of the first BCD layout area. A semiconductor device may comprise, a substrate, BCD device formed on the substrate, and a deep trench isolation structure laterally surrounding the BCD device. The deep trench isolation structure, with respect to a top-down view, may comprise vertical portions, horizontal portions, a “T”-shaped intersection connecting at least one vertical portion and at least one horizontal portion, and a cross-shaped intersection connecting two vertical portions and two horizontal portions.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Tsung-Yu YANG, Po-Wei LIU
  • Patent number: 11929293
    Abstract: A semiconductor package includes a substrate, a package structure, and a lid structure. The package structure is disposed on the substrate. The lid structure is disposed over substrate, wherein the lid structure includes a main body covering and surrounding the package structure and a plurality of rib portions protruded from the main body and extended toward the package structure.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Shu Lin, Wensen Hung, Tsung-Yu Chen
  • Patent number: 11923310
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei
  • Publication number: 20240070302
    Abstract: Collaborative sessions in which access to added virtual content is selectively made available to participants/users. A participant (the host) creates a new session and invites participants to join. The invited participants receive an invitation to join the session. The session creator (i.e., the host) and other approved participants can access the contents of a session. The session identifies a new participant when they join the session, and concurrently notifies the other participants in the session that a new participant is waiting for permission to access the added virtual content. The host or approved participants can set up the new participant with permissions for accessing added virtual content.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
  • Publication number: 20240070301
    Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, a participant (the host) creates a new session and invites participants to join. The session creator (i.e., the host) and other approved participants can access the contents of a session (e.g., which may be recorded using an application such as lens cloud feature; available from Snap Inc. of Santa Monica, California). A timestamp is associated with each received virtual content, and the users are provided with a timelapse of the collaborative object as a function of the timestamps.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
  • Publication number: 20240070243
    Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, authentication of the collaborative object is performed by all of the users to complete the collaborative session. Each user authenticates the collaborative object, such as using a stamping gesture on a user interface of a client device or in an augmented reality session. User specific data is recorded with the stamping gesture to authenticate the collaborative object and the associated virtual content. In an example, user specific data may include device information, participant profile information, or biometric signal information. Biometric signal information, such as a fingerprint from a mobile device or a heart rate received from a connected smart device can be used to provide an authenticating signature to the seal.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
  • Publication number: 20240070299
    Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, a processor provides users with access to a collaborative object using respective physically remote devices, and associates virtual content received from the users with the collaborative object during a collaboration period. The processor maintains a timer including a countdown indicative of when the collaboration period ends for associating virtual content with the collaborative object. The processor provides the users with access to the collaborative object with associated virtual content at the end of the collaboration period.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
  • Publication number: 20240071020
    Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object with an associated material and added virtual content is provided to users. In one example of the collaborative session, a user selects the associated material of the collaborative object. Physical characteristics are assigned to the collaborative object as a function of the associated material to be perceived by the participants when the collaborative object is manipulated. In one example, the material associated to the collaborative object is metal, wherein the interaction between the users and the collaborative object generates a response of the collaborative object that is indicative of the physical properties of metal, such as inertial, acoustic, and malleability.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
  • Publication number: 20240070300
    Abstract: Collaborative sessions in which access to added virtual content is selectively made available to participants/users by a collaborative system. The system receives a request from a user to join a session, and associates a timestamp with the user corresponding to receipt of the request.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
  • Publication number: 20240069643
    Abstract: A collaborative session (e.g., a virtual time capsule) in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, a user interacts with the collaborative object using hand gestures. The virtual content associated with the collaborative object can be accessed with an opening hand gesture and the virtual content can be hidden with a closing hand gesture. The hand gestures are detected by cameras of a client device used by the user. The collaborative object can be moved and manipulated using a pointing gesture, wherein the position of the collaborate object can be confirmed to a new position by titling the client device of the user.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
  • Publication number: 20240070298
    Abstract: Collaborative sessions in which access to added virtual content is selectively made available to participants/users. A participant (the host) creates a new session and invites participants to join. The invited participants receive an invitation to join the session. The session creator (i.e., the host) and other approved participants can access the contents of a session. The session identifies a new participant when they join the session, and concurrently notifies the other participants in the session that a new participant is waiting for permission to access the added virtual content. The host or approved participants can set up the new participant with permissions for accessing added virtual content.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
  • Publication number: 20240069642
    Abstract: Collaborative sessions in which access to a collaborative object and added virtual content is selectively provided to participants/users. In one example of the collaborative session, a participant crops media content by use of a hand gesture to produce an image segment that can be associated to the collaborative object. The hand gesture resembles a pair of scissors and the camera and processor of the client device track a path of the hand gesture to identify an object within a displayed image to create virtual content of the identified object. The virtual content created by the hand gesture is then associated to the collaborative object.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Youjean Cho, Chen Ji, Fannie Liu, Andrés Monroy-Hernández, Tsung-Yu Tsai, Rajan Vaish
  • Patent number: 11916939
    Abstract: An abnormal traffic detection method is provided according to an embodiment of the disclosure. The method includes: obtaining network traffic data of a target device; sampling the network traffic data by a sampling window with a time length to obtain sampling data; generating, according to the sampling data, an image which presents a traffic feature of the network traffic data corresponding to the time length; and analyzing the image to generate evaluation information corresponding to an abnormal traffic. In addition, an abnormal traffic detection device is also provided according to an embodiment of the disclosure to improve a detection ability and/or an analysis ability for the abnormal traffic and/or a malware.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: February 27, 2024
    Assignee: Acer Cyber Security Incorporated
    Inventors: Ming-Kung Sun, Tsung-Yu Ho, Zong-Cyuan Jhang, Chiung-Ying Huang
  • Publication number: 20240055361
    Abstract: A method for forming alignment keys of a semiconductor structure includes: forming an oxide pad layer and a passivation layer on a substrate; forming a patterned photoresist layer on the passivation layer, and using the patterned photoresist layer as a mask to remove part of the oxide pad layer and passivation layer and expose the substrate surface in the medium voltage and alignment mark regions; forming oxide portions on the exposed substrate surface, and the oxide portions extending into the first depth of the substrate; forming deep doped wells in the low voltage and medium voltage regions; thinning the oxide portions; forming high-voltage doped wells in the high voltage and alignment mark regions; performing an etching process on the high voltage and alignment mark regions to form a second trench, as an alignment key, having a second depth greater than the first depth in the alignment mark region.
    Type: Application
    Filed: September 26, 2022
    Publication date: February 15, 2024
    Inventors: TSUNG-YU YANG, Shin-Hung Li, Shan-shi Huang, Ruei Jhe Tsao, Che-Hua Chang, YUAN YU CHUNG
  • Patent number: 11894425
    Abstract: A method of forming a semiconductor arrangement includes forming a gate dielectric layer over a semiconductor layer. A gate electrode layer is formed over the gate dielectric layer. A first gate mask is formed over the gate electrode layer. The gate electrode layer is etched using the first gate mask as an etch template to form a first gate electrode. A first dopant is implanted into the semiconductor layer using the first gate mask and the first gate electrode as an implantation template to form a first doped region in the semiconductor layer.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: February 6, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yun-Chi Wu, Tsung-Yu Yang, Cheng-Bo Shu, Chien Hung Liu