Patents by Inventor Van H. Le

Van H. Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200212186
    Abstract: Embodiments related to transistors and integrated circuits having aluminum indium phosphide subfins and germanium channels, systems incorporating such transistors, and methods for forming them are discussed.
    Type: Application
    Filed: September 11, 2015
    Publication date: July 2, 2020
    Applicant: Intel Corporation
    Inventors: Matthew V. Metz, Willy Rachmady, Harold W. Kennel, Van H. Le, Benjamin Chu-Kung, Jack T. Kavalieros, Gilbert Dewey
  • Publication number: 20200202918
    Abstract: Disclosed herein are thyristors and related devices and techniques. In some embodiments, an integrated circuit (IC) device may include a metal portion and a thyristor on the metal portion. The thyristor may include a stack of alternating p-type and n-type material layers, and the stack may be on the metal portion.
    Type: Application
    Filed: September 14, 2017
    Publication date: June 25, 2020
    Applicant: Intel Corporation
    Inventors: Van H. Le, Abhishek A. Sharma, Ravi Pillarisetty
  • Publication number: 20200203593
    Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a substrate and a quantum well stack disposed on the substrate. The quantum well stack may include a quantum well layer and a back gate, and the back gate may be disposed between the quantum well layer and the substrate.
    Type: Application
    Filed: June 9, 2016
    Publication date: June 25, 2020
    Applicant: Intel Corporation
    Inventors: Jeanette M. Roberts, Ravi Pillarisetty, David J. Michalak, Zachary R. Yoscovits, James S. Clarke, Van H. Le
  • Patent number: 10693008
    Abstract: An apparatus including a semiconductor body including a channel region and junction regions disposed on opposite sides of the channel region, the semiconductor body including a first material including a first band gap; and a plurality of nanowires including a second material including a second band gap different than the first band gap, the plurality of nanowires disposed in separate planes extending through the first material so that the first material surrounds each of the plurality of nanowires; and a gate stack disposed on the channel region. A method including forming a plurality of nanowires in separate planes above a substrate, each of the plurality of nanowires including a material including a first band gap; individually forming a cladding material around each of the plurality of nanowires, the cladding material including a second band gap; coalescing the cladding material; and disposing a gate stack on the cladding material.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: June 23, 2020
    Assignee: Intel Corporation
    Inventors: Niloy Mukherjee, Marko Radosavljevic, Jack T. Kavalieros, Ravi Pillarisetty, Niti Goel, Van H. Le, Gilbert Dewey, Benjamin Chu-Kung
  • Publication number: 20200194434
    Abstract: Embodiments herein describe techniques for a semiconductor device including a substrate oriented in a horizontal direction, and a memory cell including a transistor and a capacitor above the substrate. The transistor includes a gate electrode oriented in a vertical direction substantially orthogonal to the horizontal direction, and a channel layer oriented in the vertical direction, around the gate electrode and separated by a gate dielectric layer from the gate electrode. The capacitor is within an inter-level dielectric layer above the substrate. The capacitor includes a first plate coupled with a second portion of the channel layer of the transistor, and a second plate separated from the first plate by a capacitor dielectric layer. The first plate of the capacitor is also a source electrode of the transistor. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 18, 2020
    Inventors: Juan G. ALZATE VINASCO, Abhishek A. SHARMA, Fatih HAMZAOGLU, Bernhard SELL, Pei-Hua WANG, Van H. LE, Jack T. KAVALIEROS, Tahir GHANI, Chieh-Jen KU, Travis W. LAJOIE, Umut ARSLAN
  • Publication number: 20200185504
    Abstract: An embodiment includes an apparatus comprising: a substrate; a thin film transistor (TFT) comprising: source, drain, and gate contacts; a semiconductor material, comprising a channel, between the substrate and the gate contact; a gate dielectric layer between the gate contact and the channel; and an additional layer between the channel and the substrate; wherein (a)(i) the channel includes carriers selected from the group consisting of hole carriers or electron carriers, (a)(ii) the additional layer includes an insulator material that includes charged particles having a polarity equal to a polarity of the carriers. Other embodiments are described herein.
    Type: Application
    Filed: September 27, 2017
    Publication date: June 11, 2020
    Inventors: Abhishek A. Sharma, Van H. Le, Jack T. Kavalieros, Tahir Ghani, Gilbert Dewey, Shriram Shivaraman, Sean T. Ma, Benjamin Chu-Kung
  • Publication number: 20200185457
    Abstract: Disclosed herein are selector devices and related devices and techniques. In some embodiments, a selector device may include a first electrode, a second electrode, and a selector material between the first electrode and the second electrode. The selector material may include a dielectric material and a conductive dopant.
    Type: Application
    Filed: August 29, 2017
    Publication date: June 11, 2020
    Applicant: Intel Corporation
    Inventors: Abhishek A. Sharma, Ravi Pillarisetty, Van H. Le, Gilbert W. Dewey, Willy Rachmady
  • Publication number: 20200168634
    Abstract: Described herein are apparatuses, systems, and methods associated with a voltage regulator circuit that includes one or more thin-film transistors (TFTs). The TFTs may be formed in the back-end of an integrated circuit. Additionally, the TFTs may include one or more unique features, such as a channel layer treated with a gas or plasma, and/or a gate oxide layer that is thicker than in prior TFTs. The one or more TFTs of the voltage regulator circuit may improve the operation of the voltage regulator circuit and free up front-end substrate area for other devices. Other embodiments may be described and claimed.
    Type: Application
    Filed: September 29, 2017
    Publication date: May 28, 2020
    Inventors: Abhishek A. SHARMA, Van H. LE, Seung Hoon SUNG, Ravi PILLARISETTY, Marko RADOSAVLJEVIC
  • Patent number: 10665688
    Abstract: An apparatus including a substrate; a transistor device on the substrate including a channel and a source and a drain disposed between the channel; a source contact coupled to the source and a drain contact coupled to the drain; and the source and drain each including a composition including a concentration of germanium at an interface with the channel that is greater than a concentration of germanium at a junction with the source contact. A method including defining an area on a substrate for a transistor device; forming a source and a drain each including an interface with the channel; and forming a contact to one of the source and the drain, wherein a composition of each of the source and the drain includes a concentration of germanium at an interface with the channel that is greater than a concentration at a junction with the contact.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: May 26, 2020
    Assignee: Intel Corporation
    Inventors: Willy Rachmady, Matthew V. Metz, Benjamin Chu-Kung, Van H. Le, Gilbert Dewey, Ashish Agrawal, Jack T. Kavalieros
  • Publication number: 20200152635
    Abstract: Embodiments herein describe techniques for a semiconductor device including a TFT having a gate electrode with a gate length determined by a spacer. Embodiments may include a gate electrode above a substrate, a channel layer above the gate electrode, and a source electrode, a drain electrode, and a spacer above the channel layer. The drain electrode may be separated from the source electrode by the spacer. The drain electrode and the source electrode may have different widths or include different materials. Furthermore, the spacer may overlap with the gate electrode, hence the gate length of the gate electrode may be determined by the spacer width. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 31, 2017
    Publication date: May 14, 2020
    Inventors: ABHISHEK A. SHARMA, VAN H. LE, GILBERT DEWEY, SHRIRAM SHIVARAMAN, YIH WANG, TAHIR GHANI, JACK T. KAVALIEROS
  • Patent number: 10644123
    Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing a high mobility low contact resistance semiconducting oxide in metal contact vias for thin film transistors.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: May 5, 2020
    Assignee: Intel Corporation
    Inventors: Gilbert Dewey, Van H. Le, Rafael Rios, Jack T. Kavalieros, Shriram Shivaraman
  • Patent number: 10644111
    Abstract: An embodiment includes a device comprising: a substrate; a dielectric layer on the substrate and including a trench; a first portion of the trench including a first material that comprises at least one of a group III-V material and a group IV material; and a second portion of the trench, located between the first portion and the substrate, which includes a second material and an upper region and a lower region; wherein: (a)(i) the second material in the upper region has fewer defects than the second material in the lower region, and (a)(ii) the first material is strained. Other embodiments are described herein.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: May 5, 2020
    Assignee: Intel Corporation
    Inventors: Benjamin Chu-Kung, Van H. Le, Ashish Agrawal, Jack T. Kavalieros, Matthew V. Metz, Seung Hoon Sung, Rafael Rios, Gilbert Dewey
  • Publication number: 20200135700
    Abstract: An apparatus is formed. The apparatus includes a stack of semiconductor chips. The stack of semiconductor chips includes a logic chip and a memory stack, wherein, the logic chip includes at least one of a GPU and CPU. The apparatus also includes a semiconductor chip substrate. The stack of semiconductor chips are mounted on the semiconductor chip substrate. At least one other logic chip is mounted on the semiconductor chip substrate. The semiconductor chip substrate includes wiring to interconnect the stack of semiconductor chips to the at least one other logic chip.
    Type: Application
    Filed: December 26, 2019
    Publication date: April 30, 2020
    Inventors: Abhishek SHARMA, Hui Jae YOO, Van H. LE, Huseyin Ekin SUMBUL, Phil KNAG, Gregory K. CHEN, Ram KRISHNAMURTHY
  • Publication number: 20200127142
    Abstract: Thin film core-shell fin and nanowire transistors are described. In an example, an integrated circuit structure includes a fin on an insulator layer above a substrate. The fin has a top and sidewalls. The fin is composed of a first semiconducting oxide material. A second semiconducting oxide material is on the top and sidewalls of the fin. A gate electrode is over a first portion of the second semiconducting oxide material on the top and sidewalls of the fin. A first conductive contact is adjacent the first side of the gate electrode, the first conductive contact over a second portion of the second semiconducting oxide material on the top and sidewalls of the fin. A second conductive contact is adjacent the second side of the gate electrode, the second conductive contact over a third portion of the second semiconducting oxide material on the top and sidewalls of the fin.
    Type: Application
    Filed: June 20, 2017
    Publication date: April 23, 2020
    Inventors: Gilbert DEWEY, Van H. LE, Abhishek A. SHARMA, Shriram SHIVARAMAN, Ravi PILLARISETTY, Tahir GHANI, Jack T. KAVALIEROS
  • Publication number: 20200119169
    Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a base; a fin extending away from the base, wherein the fin includes a quantum well layer; and one or more gates disposed on the fin. In some such embodiments, the one or more gates may include first, second, and third gates. Spacers may be disposed on the sides of the first and second gates, such that a first spacer is disposed on a side of the first gate proximate to the second gate, and a second spacer, physically separate from the first spacer, is disposed on a side of the second gate proximate to the first gate. The third gate may be disposed on the fin between the first and second gates and extend between the first and second spacers.
    Type: Application
    Filed: June 8, 2016
    Publication date: April 16, 2020
    Applicant: Intel Corporation
    Inventors: Ravi Pillarisetty, Jeanette M. Roberts, David J. Michalak, Van H. Le, Zachary R. Yoscovits, James S. Clarke
  • Publication number: 20200105833
    Abstract: A DIMA semiconductor structure is disclosed. The DIMA semiconductor structure includes a frontend including a semiconductor substrate, a transistor switch of a memory cell coupled to the semiconductor substrate and a computation circuit on the periphery of the frontend coupled to the semiconductor substrate. Additionally, the DIMA includes a backend that includes an RRAM component of the memory cell that is coupled to the transistor switch.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Jack T. KAVALIEROS, Ian A. YOUNG, Ram KRISHNAMURTHY, Ravi PILLARISETTY, Sasikanth MANIPATRUNI, Gregory CHEN, Hui Jae YOO, Van H. LE, Abhishek SHARMA, Raghavan KUMAR, Huichu LIU, Phil KNAG, Huseyin SUMBUL
  • Publication number: 20200105892
    Abstract: Embodiments herein describe techniques for a thin-film transistor (TFT). The transistor includes a source electrode oriented in a horizontal direction, and a channel layer in contact with a portion of the source electrode and oriented in a vertical direction substantially orthogonal to the horizontal direction. A gate dielectric layer conformingly covers a top surface of the source electrode and surfaces of the channel layer. A gate electrode conformingly covers a portion of the gate dielectric layer. A drain electrode is above the channel layer, oriented in the horizontal direction. A current path is to include a current portion from the source electrode along a gated region of the channel layer under the gate electrode in the vertical direction, and a current portion along an ungated region of the channel layer in the horizontal direction from the gate electrode to the drain electrode. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Nazila HARATIPOUR, Tahir GHANI, Jack T. KAVALIEROS, Gilbert DEWEY, Benjamin CHU-KUNG, Seung Hoon SUNG, Van H. LE, Shriram SHIVARAMAN, Abhishek SHARMA
  • Publication number: 20200098880
    Abstract: Embodiments herein describe techniques for a thin-film transistor (TFT) above a substrate. The transistor includes a gate electrode above the substrate, and a channel layer above the substrate, separated from the gate electrode by a gate dielectric layer. The transistor further includes a contact electrode above the channel layer and in contact with a contact area of the channel layer. The contact area has a thickness determined based on a Schottky barrier height of a Schottky barrier formed at an interface between the contact electrode and the contact area, a doping concentration of the contact area, and a contact resistance at the interface between the contact electrode and the contact area. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 26, 2018
    Publication date: March 26, 2020
    Inventors: Abhishek SHARMA, Cory WEBER, Van H. LE, Sean MA
  • Publication number: 20200098930
    Abstract: Embodiments herein describe techniques for a thin-film transistor (TFT), which may include a substrate oriented in a horizontal direction and a transistor above the substrate. The transistor includes a gate electrode above the substrate, a gate dielectric layer around the gate electrode, and a channel layer around the gate dielectric layer, all oriented in a vertical direction substantially orthogonal to the horizontal direction. Furthermore, a source electrode or a drain electrode is above or below the channel layer, separated from the gate electrode, and in contact with a portion of the channel layer. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 26, 2020
    Inventors: Van H. LE, Tahi GHANI, Jack T. KAVALIEROS, Gilbert DEWEY, Matthew METZ, Miriam RESHOTKO, Benjamin CHU-KUNG, Shriram SHIVARAMAN, Abhishek SHARMA, NAZILA HARATIPOUR
  • Publication number: 20200098874
    Abstract: Embodiments herein describe techniques for an integrated circuit that includes a substrate, a semiconductor device on the substrate, and a contact stack above the substrate and coupled to the semiconductor device. The contact stack includes a contact metal layer, and a semiconducting oxide layer adjacent to the contact metal layer. The semiconducting oxide layer includes a semiconducting oxide material, while the contact metal layer includes a metal with a sufficient Schottky-barrier height to induce an interfacial electric field between the semiconducting oxide layer and the contact metal layer to reject interstitial hydrogen from entering the semiconductor device through the contact stack. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 26, 2020
    Inventors: Justin WEBER, Harold KENNEL, Abhishek SHARMA, Christopher JEZEWSKI, Matthew V. METZ, Tahir GHANI, Jack T. KAVALIEROS, Benjamin CHU-KUNG, Van H. LE, Arnab SEN GUPTA