Abstract: Apparatuses and techniques are described for programming phase change memory cells while avoiding a clamp condition in transistors which are used for biasing a word line and bit line when the word line and bit line are unselected for a write operation. The transistors may be connected in parallel with the word line and bit line. During a write operation, a current source is connected to a selected word line and a voltage control circuit is connected to the selected bit line. The voltage control circuit can include a capacitor or a voltage driver, for example. The capacitor accumulates charge, or the voltage driver applies an increasing ramp voltage to the bit line, to increase the voltage of the bit line and word line during the write operation and to avoid the clamp condition.

Abstract: A bit line read voltage generator may operate in a high drive strength or current mode to drive a selected bit line voltage to a read selected bit line voltage at a high level, and then may switch to operating in a low drive strength or current mode. Doing so may control, such as by limiting, the amount of cell current if the selected memory cell turns on, reducing the likelihood of false writes. Also, a word line read voltage generator may operate in a high drive strength or current mode to ramp up a selected word line voltage level, and then may switch to operating in a low drive strength or current mode to shorten the time for a global selected word line voltage to decrease to below a trip level and/or to control an amount of the cell current when the selected memory cell turns on.

Abstract: The present disclosure generally relates to the fabrication of and methods for creating a reversible tri-state memory device which provides both forward and reverse write and read drive to a bi-directional RRAM cell, thus allowing writing in the forward and reverse directions. The memory device, however, utilizes a single transistor “on pitch” which fits between two metal lines traversing the array tile.

Abstract: The present disclosure generally relates to non-volatile memory arrays and memory devices in which a leakage current through an OTS is utilized to pre-charge a circuit of a memory chip. By running an additional wire on each side of a tile which is orthogonal to, above, or below the X and Y select wires, a high value resistance material, such as an OTS, may be deposited at the intersection. The OTS allows the word line or bit line to be selected without pulling excessive leakage to the select wire from the bias voltage, such as V/2. A thickness of the OTS is adjusted such that the Vt of the OTS is greater than V/2, with margin, and the OTS does not turn on when the OTS is selected. A resistance is created between the V/2 wire and the word line select wire or the bit line select wire.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for memory array addressing. An addressing circuit is configured to receive an address for an operation on an array of multiple memory regions. An address includes a row address and a column address both multiplexed into the address and received with an activate command for an operation. A row buffer for an array of multiple memory regions is configured to store data identified by multiplexed row and column addresses from the multiple memory regions. Data of an operation is selected from a row buffer based on a second address received with a subsequent command for the operation.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for memory maintenance operations. A non-volatile memory device comprises a non-volatile memory medium. A non-volatile memory device is configured to receive a refresh command from a controller over a bus. A non-volatile memory device is configured to perform one or more maintenance operations on a non-volatile memory medium during a predefined period of time after receiving a refresh command.

Abstract: The present disclosure generally relates to the fabrication of and methods for creating a reversible tri-state memory device which provides both forward and reverse write and read drive to a bi-directional RRAM cell, thus allowing writing in the forward and reverse directions. The memory device, however, utilizes a single transistor “on pitch” which fits between two metal lines traversing the array tile.

Abstract: The present disclosure generally relates to the fabrication of and methods for creating a reversible tri-state memory device which provides both forward and reverse write and read drive to a bi-directional RRAM cell, thus allowing writing in the forward and reverse directions. The memory device, however, utilizes a single transistor “on pitch” which fits between two metal lines traversing the array tile.

Abstract: The present disclosure generally relates to the fabrication of and methods for creating a reversible tri-state memory device which provides both forward and reverse write and read drive to a bi-directional RRAM cell, thus allowing writing in the forward and reverse directions. The memory device, however, utilizes a single transistor “on pitch” which fits between two metal lines traversing the array tile.

Abstract: The present disclosure generally relates to non-volatile memory arrays and memory devices in which a leakage current through an OTS is utilized to pre-charge a circuit of a memory chip. By running an additional wire on each side of a tile which is orthogonal to, above, or below the X and Y select wires, a high value resistance material, such as an OTS, may be deposited at the intersection. The OTS allows the word line or bit line to be selected without pulling excessive leakage to the select wire from the bias voltage, such as V/2. A thickness of the OTS is adjusted such that the Vt of the OTS is greater than V/2, with margin, and the OTS does not turn on when the OTS is selected. A resistance is created between the V/2 wire and the word line select wire or the bit line select wire.

Abstract: A method and system for generating a reference voltage are disclosed. The reference voltage is generated by generating a voltage VRIGHT using a first transistor and generating a voltage VBIAS using a second transistor. The gates of the two transistors are connected to a common node VREF, but the loads of the transistors have different resistances. At least one differential pair is used to detect a difference between voltages VRIGHT and VBIAS. VREF is forced to a value at which the source-drain currents in each of the transistors is equal. The transistors sued are NMOS transistors.

Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Abstract: In various embodiments, quench switches are utilized within a cross-point memory array to minimize parasitic coupling in lines proximate selected lines.

Abstract: A method and system for generating a reference voltage are disclosed. The reference voltage is generated by generating a voltage VRIGHT using a first transistor and generating a voltage VBIAS using a second transistor. The gates of the two transistors are connected to a common node VREF, but the loads of the transistors have different resistances. At least one differential pair is used to detect a difference between voltages VRIGHT and VBIAS. VREF is forced to a value at which the source-drain currents in each of the transistors is equal. The transistors sued are NMOS transistors.

Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Abstract: A memory includes an interface through which it provides access to memory cells, such as phase change memory cells. Such access permits circuitry located on a separate integrated circuit to provide access signals, including read and write signals suitable for binary or multi-level accesses.

Abstract: A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.