Abstract: A method of forming a semiconductor device structure is provided. The method includes forming a masking structure with first openings over a semiconductor substrate and correspondingly forming metal layers in the first openings. The method also includes recessing the masking structure to form second openings between the metal layers and forming a sacrificial layer surrounded by a first liner in each of the second openings. In addition, after forming a second liner over the sacrificial layer in each of the second openings, the method includes removing the sacrificial layer in each of the second openings to form a plurality of air gaps therefrom.

Abstract: The disclosure provides a projection device, an actuator device thereof, and a projection method adapted for the actuator device. The projection method includes disposing an optical element in a frame body, and disposing a driving assembly between a base and the frame body; controlling the driving assembly to drive the frame body by a signal so that the optical element reciprocally swings relative to the base based on a first, a second, and a third moving shaft. The signal includes a first driving signal corresponding to the first moving shaft, a second driving signal corresponding to the second moving shaft, and a third driving signal corresponding to the third moving shaft. The first and the second driving signal have a first frequency; the third driving signal has a second frequency different from the first frequency. The phase difference between the first and the second driving signal is not equal to zero.

Abstract: A gas chromatography device for peak focusing of one or more target analytes is provided that include a chromatographic column with an inlet and an outlet. A stationary phase is deposited inside the chromatographic column and has a positive thickness gradient. The stationary phase extends from the inlet to the outlet and has a first thickness at the inlet of the chromatographic column and a second thickness at the outlet of the chromatographic column. The second thickness is at least about 10% greater than the first thickness. Methods of peak focusing in a gas chromatography device, method of verifying peak focusing in a gas chromatography device and creating a gas chromatography device having a chromatographic column with a positive thickness gradient are also provided.

Abstract: An actuator, a projection device, and a projection method are provided. The projection method includes the following. A first optical element is disposed in a first frame body. At least one first driving assembly is disposed between a first base and the first frame body. A second optical element is disposed in a second frame body. At least one second driving assembly is disposed between a second base and the second frame body. The first driving assembly is controlled by a first signal to drive the first frame body, such that the first optical element reciprocally swing relative to the first base based on a first actuating axis and a second actuating axis. The second driving assembly is controlled by a second signal to drive the second frame body, such that the second optical element reciprocally swing relative to the second base based on a third actuating axis.

Abstract: The present disclosure relates to an integrated chip comprising a substrate. A first conductive wire is over the substrate. A second conductive wire is over the substrate and is adjacent to the first conductive wire. A first dielectric cap is laterally between the first conductive wire and the second conductive wire. The first dielectric cap laterally separates the first conductive wire from the second conductive wire. The first dielectric cap includes a first dielectric material. A first cavity is directly below the first dielectric cap and is laterally between the first conductive wire and the second conductive wire. The first cavity is defined by one or more surfaces of the first dielectric cap.

Abstract: An actuator device, a projection device including the actuator device, and a projection method applicable to the actuator device, are provided. The actuator device includes a base, a frame, an optical element, and at least one driving assembly. The projection method includes the following steps. The frame is disposed in the base, the optical element is disposed in the frame, and the at least one driving assembly is disposed between the base and the frame. The at least one driving assembly is controlled to drive the frame through a first signal, so that the optical element swings reciprocally relative to the base based on a first swing angle, a second swing angle, and a third swing angle of a first actuating shaft.

Abstract: A device includes a fin extending from a substrate; a gate stack over and along sidewalls of the fin; a gate spacer along a sidewall of the gate stack; an epitaxial source/drain region in the fin and adjacent the gate spacer, the epitaxial source/drain region including a first epitaxial layer on the fin, the first epitaxial layer including silicon and arsenic; and a second epitaxial layer on the first epitaxial layer, the second epitaxial layer including silicon and phosphorus, the first epitaxial layer separating the second epitaxial layer from the fin; and a contact plug on the second epitaxial layer.

Abstract: The present disclosure relates to an integrated chip including a substrate. A first conductive wire is within a first dielectric layer that is over the substrate. A first etch-stop layer is over the first dielectric layer. A second etch-stop layer is over the first etch-stop layer. A conductive via is within a second dielectric layer that is over the second etch-stop layer. The conductive via extends through the second etch-stop layer and along the first etch-stop layer to the first conductive wire. A first lower surface of the second etch-stop layer is on a top surface of the first etch-stop layer. A second lower surface of the second etch-stop layer is on a top surface of the first conductive wire.

Abstract: Some embodiments of the present disclosure relate to a semiconductor structure including a first conductive wire disposed over a substrate. A dielectric liner is arranged along sidewalls and an upper surface of the first conductive wire and is laterally surrounded by a first dielectric layer. The dielectric liner and the first dielectric layer are different materials. A conductive via is disposed within a second dielectric layer over the first conductive wire. The conductive via has a first lower surface disposed over the first dielectric layer and a second lower surface below the first lower surface and over the first conductive wire.

Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a lower conductive structure arranged over a substrate. An etch stop layer is arranged over the lower conductive structure, and a first interconnect dielectric layer is arranged over the etch stop layer. The integrated chip further includes an interconnect via that extends through the first interconnect dielectric layer and the etch stop layer to directly contact the lower conductive structure. A protective layer surrounds outermost sidewalls of the interconnect via.

Abstract: Disclosed is a method for short-term traffic risk prediction of road sections by using roadside observation data.

Abstract: An optical lens system includes, in order from a magnified side to a minified side, a first lens group of positive refractive power and a second lens group of positive refractive power. The first lens group includes a first lens and a second lens, and the second lens group includes a third lens and a fourth lens. One of the third lens and the fourth lens includes one aspheric surface, and each of the lenses in the optical lens system is a singlet lens. The optical lens satisfies a condition of TE(?=400)>94%, where TE(?=400) denotes an overall transmittance of all of the lenses in the optical lens system measured at a wavelength of 400 nm.

Abstract: An unmanned ground vehicle (UGV) includes one or more motors configured to drive one or more wheels of the UGV, a memory storing instructions, and a processor coupled to the one or more motors and the memory. The processor is configured to execute the instructions to cause the UGV to determine location information of a movable target; calculate a direction and a speed for the unmanned ground vehicle based on the determined location information; and drive the one or more motors to move the unmanned ground vehicle in the calculated direction at the calculated speed to follow the movable target when the movable target moves.

Abstract: A method of cutting fins includes the following steps. A photomask including a snake-shape pattern is provided. A photoresist layer is formed over fins on a substrate. A photoresist pattern in the photoresist layer corresponding to the snake-shape pattern is formed by exposing and developing. The fins are cut by transferring the photoresist pattern and etching cut parts of the fins.

Abstract: A memory device includes a bottom electrode, a tunneling junction disposed over the bottom electrode, and a top electrode disposed over the tunneling junction. The top electrode includes a first top electrode layer and a second top electrode layer above the first top electrode layer. The first and second top electrode layers include different material compositions. The first top electrode layer is thinner than the tunneling junction, and the second top electrode layer is thicker than the tunneling junction.

Abstract: An actuator including a frame body, a base, a first drive assembly, a second drive assembly, and an optical element is provided. The frame body includes the first frame portion and the second frame portion. The base surrounds the frame body. The first drive assembly is disposed between the base and the first frame portion. The second drive assembly is disposed between the base and the second frame portion. When the actuator is set to a first mode, a phase difference between the first drive assembly and the second drive assembly is substantially 0 degrees, and the optical element exhibits a first actuation mode relative to the base. Alternatively, when the actuator is set to the second mode, the phase difference between the first drive assembly and the second drive assembly is substantially 90 degrees, and the optical element exhibits a second actuation mode relative to the base.

Abstract: An optical device including a holder and a light transmissive plate is provided. The holder includes a first frame and a second frame connected to each other, and the first frame is located inside the second frame. A light transmissive plate is disposed inside the first frame and has a surface. The first frame has at least one inner surface and includes at least one surface supporting part, and the surface supporting part extends along a direction from the inner surface of the first frame to the center of the first frame, and the surface of the light transmissive plate is at least partially supported by the surface supporting part of the first frame. The surface supporting part is non-continuously distributed along the inner surface of the first frame. The disclosure further provides a projector including the optical device.

Abstract: An optical element adjusting mechanism is provided, including a frame, a carrier, and an optical element. The frame includes a plurality of first positioning portions. The carrier includes a hollow body, a first axial portion connected to the hollow body, and a plurality of second positioning portions connected to the hollow body. The hollow body is connected to the frame through the first axial portion. The plurality of second positioning portions are disposed corresponding to the plurality of first positioning portions. The optical element is fixed on the hollow body. The plurality of second positioning portions are fixed to the plurality of first positioning portions through a plurality of adhesives. An optical element adjusting system and a projection device are also proposed. The optical element adjusting mechanism, the optical element adjusting system, and the projection device quickly, easily, and accurately adjust a rotation angle of the optical element.

Abstract: The invention provides an optical module and a projection apparatus. The optical module includes a base, a first frame, an optical element, and at least one first driving assembly. The first frame is disposed in the base and includes a first body and a pair of first shaft portions, the first shaft portion extending outward from the first body, and the first body including a pair of first inner folded edges. The optical element is disposed between the pair of first inner folded edges. The first driving assembly and the optical element abut against two opposite sides of one of the first inner folded edges, respectively, and the first driving assembly is configured to drive the first body to swing relative to the base by taking the first shaft portion as a rotating shaft.