Abstract: In a method of manufacturing a semiconductor device, the semiconductor device includes a non-volatile memory formed in a memory cell area and a ring structure area surrounding the memory cell area. In the method, a protrusion of a substrate is formed in the ring structure area. The protrusion protrudes from an isolation insulating layer. A high-k dielectric film is formed, thereby covering the protrusion and the isolation insulating layer. A poly silicon film is formed over the high-k dielectric film. The poly silicon film and the high-k dielectric film are patterned. Insulating layers are formed over the patterned poly silicon film and high-k dielectric film, thereby sealing the patterned high-k dielectric film.

Abstract: An integrated circuit device includes a substrate, a first isolation feature, a memory cell, and a semiconductor device. The substrate has a cell region, a peripheral region, and a transition region between the cell region and the peripheral region. The first isolation feature is in the transition region. The substrate includes a protrusion portion between a first portion and a second portion of the first isolation feature, the second portion is between the first portion and the cell region, and a top surface of the first portion of the first isolation feature has a first part and a second part lower than the first part, and the second part is between the first part and the second portion of the first isolation feature. The memory cell is over the cell region of the substrate. The semiconductor device is over the peripheral region of the substrate.

Abstract: A mouse and a gaming system are respectively provided. The gaming system includes a mouse and an intermediate application program. The mouse includes an operation module, a solid-state disk (SSD), and a processing module. The processing module is connected to an electronic device. When the electronic device runs a game, the processing module records an operation signal generated by an operation of a user in the SSD. The processing module can store settings made by the user to the game and to the mouse in the SSD. When the game is ended in the electronic device, the processing module stores a game result information in the SSD. When the electronic device runs the same game and the same mouse is used to play the same game, the user can read the settings in the SSD to quickly perform the same settings on the game and the mouse.

Abstract: An integrated circuit device includes a substrate, a first isolation feature, a memory cell, and a semiconductor device. The substrate has a cell region, a peripheral region, and a transition region between the cell region and the peripheral region. The first isolation feature is in the transition region. The substrate includes a protrusion portion between a first portion and a second portion of the first isolation feature, the second portion is between the first portion and the cell region, and a top surface of the first portion of the first isolation feature has a first part and a second part lower than the first part, and the second part is between the first part and the second portion of the first isolation feature. The memory cell is over the cell region of the substrate. The semiconductor device is over the peripheral region of the substrate.

Abstract: In a method of manufacturing a semiconductor device, the semiconductor device includes a non-volatile memory formed in a memory cell area and a ring structure area surrounding the memory cell area. In the method, a protrusion of a substrate is formed in the ring structure area. The protrusion protrudes from an isolation insulating layer. A high-k dielectric film is formed, thereby covering the protrusion and the isolation insulating layer. A poly silicon film is formed over the high-k dielectric film. The poly silicon film and the high-k dielectric film are patterned. Insulating layers are formed over the patterned poly silicon film and high-k dielectric film, thereby sealing the patterned high-k dielectric film.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a first isolation feature in a peripheral region of a substrate; recessing the cell region of the substrate after forming the first isolation feature; forming a second isolation feature in a cell region of the substrate after recessing the cell region of the substrate; forming a plurality of control gates over the cell region of the substrate; and forming a gate stack over the peripheral region of the substrate.

Abstract: In a method of manufacturing a semiconductor device, the semiconductor device includes a non-volatile memory formed in a memory cell area and a ring structure area surrounding the memory cell area. In the method, a protrusion of a substrate is formed in the ring structure area. The protrusion protrudes from an isolation insulating layer. A high-k dielectric film is formed, thereby covering the protrusion and the isolation insulating layer. A poly silicon film is formed over the high-k dielectric film. The poly silicon film and the high-k dielectric film are patterned. Insulating layers are formed over the patterned poly silicon film and high-k dielectric film, thereby sealing the patterned high-k dielectric film.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a first isolation feature in a peripheral region of a substrate; recessing the cell region of the substrate after forming the first isolation feature; forming a second isolation feature in a cell region of the substrate after recessing the cell region of the substrate; forming a plurality of control gates over the cell region of the substrate; and forming a gate stack over the peripheral region of the substrate.

Abstract: A massage device is disclosed that is made by converting an existing breast pump using a massage adapter ring that allows for the easy conversion to and from a massage device to breast pump.

Abstract: An integrated circuit includes a substrate, a first isolation feature, and a plurality of memory cells. The substrate has a cell region, a peripheral region, and a transition region between the cell region and the peripheral region. A top surface of the cell region is lower than a top surface of the peripheral region, and the substrate includes at least one protrusion portion in the transition region. The first isolation feature is in the transition region and covers the protrusion portion of the substrate. The memory cells are over the cell region of the substrate.

Abstract: A card reader device which consumes almost no power until a user's access card is presented includes a power source module, a wireless tag reader, a switch module, and a sensor. The switch module can electrically connect and disconnect to the power source module and the wireless tag reader. The sensor can detect a change in a magnetic field caused by proximity of the access card. When the card reader device is not in use, the switch module is turned off, and the power source module does not provide power to the wireless tag reader. When the change in the magnetic field is detected by the sensor, a signal from the sensor turns on the switch module, and the power source module provides power to the wireless tag reader. A related access system employing the card reader device is also disclosed.

Abstract: In a method of manufacturing a semiconductor device, the semiconductor device includes a non-volatile memory formed in a memory cell area and a ring structure area surrounding the memory cell area. In the method, a protrusion of a substrate is formed in the ring structure area. The protrusion protrudes from an isolation insulating layer. A high-k dielectric film is formed, thereby covering the protrusion and the isolation insulating layer. A poly silicon film is formed over the high-k dielectric film. The poly silicon film and the high-k dielectric film are patterned. Insulating layers are formed over the patterned poly silicon film and high-k dielectric film, thereby sealing the patterned high-k dielectric film.

Abstract: A plug device for plugging in at least two optical modules is provided, wherein the plug device is disposed in a housing and includes a first circuit board, a first connecting module, and a movable module. The first connecting module includes a plurality of electrical connectors, and the movable module includes a plate, at least one frame, and at least one joining member. The electrical connectors are disposed on the first circuit board. The frame is connected to the plate and has a plurality of accommodating portions. The optical modules can be respectively accommodated in the accommodating portions. The plate can be affixed to or separated from the housing by the joining member.

Abstract: In a method of manufacturing a semiconductor device, the semiconductor device includes a non-volatile memory formed in a memory cell area and a ring structure area surrounding the memory cell area. In the method, a protrusion of a substrate is formed in the ring structure area. The protrusion protrudes from an isolation insulating layer. A high-k dielectric film is formed, thereby covering the protrusion and the isolation insulating layer. A poly silicon film is formed over the high-k dielectric film. The poly silicon film and the high-k dielectric film are patterned. Insulating layers are formed over the patterned poly silicon film and high-k dielectric film, thereby sealing the patterned high-k dielectric film.

Abstract: A plug device for plugging in at least two optical modules is provided, wherein the plug device is disposed in a housing and includes a first circuit board, a first connecting module, and a movable module. The first connecting module includes a plurality of electrical connectors, and the movable module includes a plate, at least one frame, and at least one joining member. The electrical connectors are disposed on the first circuit board. The frame is connected to the plate and has a plurality of accommodating portions. The optical modules can be respectively accommodated in the accommodating portions. The plate can be affixed to or separated from the housing by the joining member.

Abstract: A method for manufacturing high purity sulfuric acid is provided. A mixed solution subsequently undergoes a first preheating step, a second preheating step, a distilling step and an evaporating step to remove peroxide, water, oxygen and insoluble impurities, so as to obtain the first gas containing sulfur trioxide, sulfuric acid and hydrogen oxide. And then, the sulfur trioxide is absorbed by a sulfuric acid solution, thereby forming the high purity sulfuric acid.

Abstract: A multifunctional headphone cable includes: a connecting line, two ends thereof respectively having an audio connection portion configured with a noise receiving microphone; a controller, configured on the connecting line and including a control circuit, the control circuit being configured with an active noise cancelling (ANC) module in connection with the noise receiving microphone, the control circuit being configured with a hearing amplifier adapted to amplify audio signals, memory module, wireless communication module and wireless charging module; and a power supply unit, configured on the connecting line and in connection with the control circuit.

Abstract: An integrated circuit includes a substrate, a first isolation feature, and a plurality of memory cells. The substrate has a cell region, a peripheral region, and a transition region between the cell region and the peripheral region. A top surface of the cell region is lower than a top surface of the peripheral region, and the substrate includes at least one protrusion portion in the transition region. The first isolation feature is in the transition region and covers the protrusion portion of the substrate. The memory cells are over the cell region of the substrate.