Abstract: A semiconductor device with improved roll-off resistivity and reliability are provided. The semiconductor device includes a gate dielectric overlying a semiconductor substrate, a gate electrode overlying the gate dielectric, a gate silicide region on the gate electrode, a source/drain region adjacent the gate dielectric, and a source/drain silicide region on the source/drain region, wherein the source/drain silicide region and the gate silicide region have different metal compositions.

Abstract: An electronic device housing includes a substrate, a film structure, and a protective film. The film structure includes an adhesive film, a film stack, and a protective film. The adhesive film is deposited onto the substrate. The film stack is deposited onto the adhesive film alternating dielectric films and metal films. The metal films are non-continuous with a total thickness of the metal films at a predetermined value. The protective film is deposited onto an upper film of the film stack.

Abstract: A power-saving electronic device for use with a computer motherboard in a “suspend to memory” state is disclosed. The power-saving electronic device enables compulsory interruption of power supply to a south bridge chip and a super input output (SIO) chip of the computer motherboard in the “suspend to memory” state, such as an S3 state of Advanced Configuration and Power Interface (ACPI), so as to save power. After a user presses a power switch, the power-saving electronic device enables the south bridge chip and SIO chip to be powered on by a standby power supplied thereto and enables the computer motherboard to remain capable of awakening and resuming from the S3 state.

Abstract: An electronic device housing includes a substrate, a film structure, and a protective film. The film structure includes an adhesive film, a film stack, and a protective film. The adhesive film is deposited onto the substrate. The film stack is deposited onto the adhesive film alternating dielectric films and metal films. The metal films are non-continuous with a total thickness of the metal films at a predetermined value. The protective film is deposited onto an upper film of the film stack.

Abstract: A monitoring system for a vehicle includes an image capture unit, a reflective film, and a projection unit. The vehicle includes a windshield. The image capture unit is configured for acquiring visual information of the vehicle. The reflective film is formed on a predetermined area of the windshield. The projection unit is configured for projecting the images onto the predetermined area.

Abstract: A color wheel for use in a projector includes a motor having a rotor, a carrier fixed to the rotor, and a color filter attached to the carrier. The color filter includes a substrate, a plurality of first film groups and a second film group formed on the substrate. Each first film group includes a high refraction index film and a low refraction index film that are stacked. The second film group includes a trititanium pentoxide film and a low refraction index film. The second film group is formed in the color filter with a position selected from a plurality of predetermined positions using a thin film design software.

Abstract: A projector includes a light source assembly, a digital micro-mirror device, and a projection lens. The light source assembly includes a lamp and a color wheel positioned for receiving light generated by the lamp. The color wheel includes a motor having a contacting portion, a filter, a light-blocker, and a light-isolating sheet. The filter is mounted on the contacting portion of the motor and includes a first area and a second area. Light beams used for forming an image only pass through the first area. The light-blocker is disposed on the filter opposite to the motor. The light-isolating sheet is disposed on the first area and positioned between the filter and the motor and configured for isolating the light beams arrived on the second area.

Abstract: An optical element includes one or more transparent prisms and a multilayer optical thin-film formed on the transparent prisms. The multilayer optical thin-film includes a transparent substrate and a multilayer optical thin-film formed on the transparent substrate. The multilayer optical thin-film includes a plurality of high refractive index layers having a refractive index of more than 2.1 and a plurality of medium refractive index layers. The medium refractive index layers have a refractive index of one of to 1.79 and 1.81 to 1.86. The medium refractive index layers and the high refractive index layers are laminated in alternating fashion.

Abstract: A color wheel includes a motor, a carrier, a number of color filter segments, a layer of adhesive, and an ultraviolet (UV) filter. The motor includes a rotor. The carrier is fixed to the rotor. The color filter segments are adhesively attached to the carrier. The ultraviolet filter is placed so that the adhesive is interposed between the UV filter and the carrier. The ultraviolet filter is substantially similar to the color filter segments in shape and size.

Abstract: A folding mirror includes a substrate and a dielectric multilayered film formed on a surface of the substrate. The dielectric multilayered film includes a first period layer with a structure represented by a formula (0.33 H 0.66 L 0.33H)n, a second period layer with a structure represented by a formula (2 HM)m, and a third period layer with a structure represented by a formula (0.95 L 1.9 H 0.95 L)N3, wherein, H represents a high refractive index layer, L represents a low refractive index layer, M represents a middle refractive index layer, H and L are set at ¼ lambda of a reference wavelength associated with the film, all of the N1, N2, and N3 represent the numbers of repetitions of the structures, enclosed by the corresponding parentheses, forming the first period layer, the second period layer, and the third period layer respectively.

Abstract: A folding mirror includes a substrate and a dielectric multilayered film formed on a surface of the substrate. The dielectric multilayered film includes a first period layer with a structure represented by a formula (0.58H1.16L0.58H)N1, a second period layer with a structure represented by a formula (0.8L1.6H0.8L)N2, and a third period layer with a structure represented by a formula (0.95L1.9H0.95L)N3, wherein, H represents a thickness of a high refractive index layer being set at ¼ of a reference wavelength associated with the film, and L represents a thickness of a low refractive index layer being set at ¼ of a reference wavelength associated with the film, all of the N1, N2, and N3 represent the numbers of repetitions of the structures, enclosed by the corresponding parentheses, forming the first period layer, the second period layer, and the third period layer respectively.

Abstract: A compensation plate used in a film coating device includes a main body defining a plurality of guiding holes, a plurality of moveable blades connected to the main body, and a plurality of connectors. Each of the plurality of moveable blades defines two through holes corresponding to one of the plurality of guiding holes. The plurality of connectors engage in the through holes and the guiding holes, fix each of the plurality of moveable blades to the main body when each of the plurality of connectors is fastened, and slide in each of the plurality of guiding holes with each of the moveable blades when each of the plurality of connectors releases.

Abstract: A multi-chip surface mounted LED structure and a method for manufacturing the same, said LED structure comprises a plurality of equivalent lighting units, each lighting unit comprises an LED chip, a heat sink structure, two opposing electrodes, said plurality of equivalent lighting units are mutually connected by a supporting structure; said method comprises the steps of firstly cutting a metal material belt to form a basic shape and using plastic injection molding to form said supporting structure, and then using chip bonding and wire bonding to connect said two opposing electrodes, and connecting adjacent lighting units in series/parallel, and finally cutting off a spare region of said metal material belt and packaging sad LED structure to form said multi-chip surface mounted LED structure; furthermore, a plurality of multi-chip surface mounted LED structures can be mutually connected in series/parallel by directly cutting said metal material belt to form a connection area thereon to enable conductivity bet

Abstract: A single-chip surface mounted LED structure and a method for manufacturing the same, said LED structure mainly comprises an LED chip, a heat sink structure, two opposing electrodes, conducting wires and a supporting structure; said method comprises the steps of firstly cutting off a spare area other than said heat sink structure and two opposing electrodes from a metal material belt, forming a basic shape, forming said supporting structure in the region of said heat sink structure and two opposing electrodes using plastic injection molding, and then further cutting off the rest of said metal material belt to separate said heat sink structure and two opposing electrodes, and finally using chip-bonding and wire bonding to package sad LED structure and cutting off said packaged LED structure from said metal material belt.

Abstract: A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower cover can be removed through the heat sink fins, achieving the effect of rapid removal of the heat energy.

Abstract: Disclosed is a LCD back light module structure comprising one or more than one LED arrayed along an electric conducting stick which being equipped with conductor blades on its surface. The conductor blade is used for connecting the conducting stick to a driving circuit. A blind hole is formed on the conducting stick and the light spot of the Led die is buried in the blind hold and the electric connection is extended from the light spot to the adjacent two conductor blades. After being completed connection for each LED die, the epoxy resin is infused around the blind hole to form a transparent lens. The high crowned configuration of the lens enables the LED to uniformly emit the light therefrom therefore each LED forms a uniformly brilliant lighting surface on the LCD back light module structure.

Abstract: The present invention discloses a backlight structure having embedded light emitting diodes (LEDs) and a fabrication method thereof. The backlight structure comprises a PCB having a plurality of arc-shaped pits and necessary circuitry implemented thereon; a nanometer-thick gold layer sputtered on surfaces of said PCB and said plurality of arc-shaped pits; and an LED die embedded in each one of said plurality of arc-shaped pits, wherein said LED die is fused and fixed to the center of said arc-shaped pit by high frequency wave; said LED die is covered with a phosphor molding compound made by mixing phosphor and silica gel; and each one of said plurality of arc-shaped pits and its neighboring portion of PCB is covered by a window layer formed by transparent silica gel.

Abstract: A process for trimming a photoresist layer during the fabrication of a gate electrode in a MOSFET is described. A bilayer stack with a top photoresist layer on a thicker organic underlayer is patternwise exposed with 193 nm or 157 nm radiation to form a feature having a width w1 in the top layer. A pattern transfer through the underlayer is performed with an anisotropic etch based on H2/N2 and SO2 chemistry. The feature formed in the bilayer stack is trimmed by 10 nm or more to a width w2 by a HBr/O2/Cl2 plasma etch. The pattern transfer through an underlying gate layer is performed with a third etch based on HBr/O2/Cl2 chemistry. The underlayer is stripped by an O2 ashing with no damage to the gate electrode. Excellent profile control of the gate electrode is achieved and a larger (w1?w2) is possible than in prior art methods.

Abstract: A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower cover can be removed through the heat sink fins, achieving the effect of rapid removal of the heat energy.

Abstract: A tapered prism illumination apparatus for LCD backlight consists of an LCD, a plurality of LEDs and a heat dissipation base. The plurality of LEDs consists of high power LEDs mounted in the back of the LCD, wherein each of the LEDs includes a light emitting point that is packaged exteriorly with a transparent covering body and, on the light emitting path of the LED, a tapered prism is disposed. In the periphery of the LED a thermally conducting substrate is disposed, while the heat dissipation base is mounted in the rear of the LEDs and has reflecting faces in the periphery of each of the LEDs. When light is generated at the light emitting point, it can be projected onto the tapered prism, by which it is bent by 90°, and then projected onto the LCD via the reflecting faces. The heat generated by the high power LEDs is conducted by the thermally conducting substrate to the heat dissipation base to be removed.