Abstract: An optical element includes one or more transparent prisms and a multilayer optical thin-film formed on the transparent prisms. The multilayer optical thin-film includes a transparent substrate and a multilayer optical thin-film formed on the transparent substrate. The multilayer optical thin-film includes a plurality of high refractive index layers having a refractive index of more than 2.1 and a plurality of medium refractive index layers. The medium refractive index layers have a refractive index of one of to 1.79 and 1.81 to 1.86. The medium refractive index layers and the high refractive index layers are laminated in alternating fashion.

Abstract: A color wheel includes a motor, a carrier, a number of color filter segments, a layer of adhesive, and an ultraviolet (UV) filter. The motor includes a rotor. The carrier is fixed to the rotor. The color filter segments are adhesively attached to the carrier. The ultraviolet filter is placed so that the adhesive is interposed between the UV filter and the carrier. The ultraviolet filter is substantially similar to the color filter segments in shape and size.

Abstract: A folding mirror includes a substrate and a dielectric multilayered film formed on a surface of the substrate. The dielectric multilayered film includes a first period layer with a structure represented by a formula (0.33 H 0.66 L 0.33H)n, a second period layer with a structure represented by a formula (2 HM)m, and a third period layer with a structure represented by a formula (0.95 L 1.9 H 0.95 L)N3, wherein, H represents a high refractive index layer, L represents a low refractive index layer, M represents a middle refractive index layer, H and L are set at ¼ lambda of a reference wavelength associated with the film, all of the N1, N2, and N3 represent the numbers of repetitions of the structures, enclosed by the corresponding parentheses, forming the first period layer, the second period layer, and the third period layer respectively.

Abstract: A folding mirror includes a substrate and a dielectric multilayered film formed on a surface of the substrate. The dielectric multilayered film includes a first period layer with a structure represented by a formula (0.58H1.16L0.58H)N1, a second period layer with a structure represented by a formula (0.8L1.6H0.8L)N2, and a third period layer with a structure represented by a formula (0.95L1.9H0.95L)N3, wherein, H represents a thickness of a high refractive index layer being set at ¼ of a reference wavelength associated with the film, and L represents a thickness of a low refractive index layer being set at ¼ of a reference wavelength associated with the film, all of the N1, N2, and N3 represent the numbers of repetitions of the structures, enclosed by the corresponding parentheses, forming the first period layer, the second period layer, and the third period layer respectively.

Abstract: A compensation plate used in a film coating device includes a main body defining a plurality of guiding holes, a plurality of moveable blades connected to the main body, and a plurality of connectors. Each of the plurality of moveable blades defines two through holes corresponding to one of the plurality of guiding holes. The plurality of connectors engage in the through holes and the guiding holes, fix each of the plurality of moveable blades to the main body when each of the plurality of connectors is fastened, and slide in each of the plurality of guiding holes with each of the moveable blades when each of the plurality of connectors releases.

Abstract: A single-chip surface mounted LED structure and a method for manufacturing the same, said LED structure mainly comprises an LED chip, a heat sink structure, two opposing electrodes, conducting wires and a supporting structure; said method comprises the steps of firstly cutting off a spare area other than said heat sink structure and two opposing electrodes from a metal material belt, forming a basic shape, forming said supporting structure in the region of said heat sink structure and two opposing electrodes using plastic injection molding, and then further cutting off the rest of said metal material belt to separate said heat sink structure and two opposing electrodes, and finally using chip-bonding and wire bonding to package sad LED structure and cutting off said packaged LED structure from said metal material belt.

Abstract: A multi-chip surface mounted LED structure and a method for manufacturing the same, said LED structure comprises a plurality of equivalent lighting units, each lighting unit comprises an LED chip, a heat sink structure, two opposing electrodes, said plurality of equivalent lighting units are mutually connected by a supporting structure; said method comprises the steps of firstly cutting a metal material belt to form a basic shape and using plastic injection molding to form said supporting structure, and then using chip bonding and wire bonding to connect said two opposing electrodes, and connecting adjacent lighting units in series/parallel, and finally cutting off a spare region of said metal material belt and packaging sad LED structure to form said multi-chip surface mounted LED structure; furthermore, a plurality of multi-chip surface mounted LED structures can be mutually connected in series/parallel by directly cutting said metal material belt to form a connection area thereon to enable conductivity bet

Abstract: A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower cover can be removed through the heat sink fins, achieving the effect of rapid removal of the heat energy.

Abstract: Disclosed is a LCD back light module structure comprising one or more than one LED arrayed along an electric conducting stick which being equipped with conductor blades on its surface. The conductor blade is used for connecting the conducting stick to a driving circuit. A blind hole is formed on the conducting stick and the light spot of the Led die is buried in the blind hold and the electric connection is extended from the light spot to the adjacent two conductor blades. After being completed connection for each LED die, the epoxy resin is infused around the blind hole to form a transparent lens. The high crowned configuration of the lens enables the LED to uniformly emit the light therefrom therefore each LED forms a uniformly brilliant lighting surface on the LCD back light module structure.

Abstract: The present invention discloses a backlight structure having embedded light emitting diodes (LEDs) and a fabrication method thereof. The backlight structure comprises a PCB having a plurality of arc-shaped pits and necessary circuitry implemented thereon; a nanometer-thick gold layer sputtered on surfaces of said PCB and said plurality of arc-shaped pits; and an LED die embedded in each one of said plurality of arc-shaped pits, wherein said LED die is fused and fixed to the center of said arc-shaped pit by high frequency wave; said LED die is covered with a phosphor molding compound made by mixing phosphor and silica gel; and each one of said plurality of arc-shaped pits and its neighboring portion of PCB is covered by a window layer formed by transparent silica gel.

Abstract: A process for trimming a photoresist layer during the fabrication of a gate electrode in a MOSFET is described. A bilayer stack with a top photoresist layer on a thicker organic underlayer is patternwise exposed with 193 nm or 157 nm radiation to form a feature having a width w1 in the top layer. A pattern transfer through the underlayer is performed with an anisotropic etch based on H2/N2 and SO2 chemistry. The feature formed in the bilayer stack is trimmed by 10 nm or more to a width w2 by a HBr/O2/Cl2 plasma etch. The pattern transfer through an underlying gate layer is performed with a third etch based on HBr/O2/Cl2 chemistry. The underlayer is stripped by an O2 ashing with no damage to the gate electrode. Excellent profile control of the gate electrode is achieved and a larger (w1?w2) is possible than in prior art methods.

Abstract: A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower cover can be removed through the heat sink fins, achieving the effect of rapid removal of the heat energy.

Abstract: A tapered prism illumination apparatus for LCD backlight consists of an LCD, a plurality of LEDs and a heat dissipation base. The plurality of LEDs consists of high power LEDs mounted in the back of the LCD, wherein each of the LEDs includes a light emitting point that is packaged exteriorly with a transparent covering body and, on the light emitting path of the LED, a tapered prism is disposed. In the periphery of the LED a thermally conducting substrate is disposed, while the heat dissipation base is mounted in the rear of the LEDs and has reflecting faces in the periphery of each of the LEDs. When light is generated at the light emitting point, it can be projected onto the tapered prism, by which it is bent by 90°, and then projected onto the LCD via the reflecting faces. The heat generated by the high power LEDs is conducted by the thermally conducting substrate to the heat dissipation base to be removed.

Abstract: A LED decorative lighting structure comprises a plurality of LEDS. Each LED has two electric conductor blades which being directly made by cutting down from a strip of the same material. Each of the two conductor blades is equipped with a terminal which further includes a holding strip and an electric conducting strip. The holding strip is for fixing an outer insulation sheath of a conductor by pressing on it; while the conducting strip is for fixing and making connection with the metallic stranded core wires of the conductor. The holding strips and the electric conducting strips in both conductor blades are disposed in different height with each other so as to avoid shortcircuiting by accidental contact. The plurality of LED constructed as such can be arranged in series/parallel connection thereby forming a desired configuration of the LED decorative lighting structure according to the present invention.

Abstract: Disclosed is a LCD back light module structure comprising one or more than one LED arrayed along an electric conducting stick which being equipped with conductor blades on its surface. The conductor blade is used for connecting the conducting stick to a driving circuit. A blind hole is formed on the conducting stick and the light spot of the Led die is buried in the blind hold and the electric connection is extended from the light spot to the adjacent two conductor blades. After being completed connection for each LED die, the epoxy resin is infused around the blind hole to form a transparent lens. The high crowned configuration of the lens enables the LED to uniformly emit the light therefrom therefore each LED forms a uniformly brilliant lighting surface on the LCD back light module structure.

Abstract: A semiconductor device with improved roll-off resistivity and reliability are provided. The semiconductor device includes a gate dielectric overlying a semiconductor substrate, a gate electrode overlying the gate dielectric, a gate silicide region on the gate electrode, a source/drain region adjacent the gate dielectric, and a source/drain silicide region on the source/drain region, wherein the source/drain silicide region and the gate silicide region have different metal compositions.

Abstract: The power efficiency of a transmitter is optimized through control of a selected aspect of the transmitter, for instance, a parameter of a power amplifier within the transmitter. The control of the aspect is based on a generated indication of desired average transmitted power. Based on this indication, a hardware path produces a first adjustment signal and a software path produces a second adjustment value, where the second adjustment value has been previously determined to correspond to the particular indication of desired average transmitted power through calibration. A difference between a first adjustment value, which is based on the first adjustment signal, and the second adjustment value is used to produce a correction signal, which is used to alter the first adjustment signal and produce a signal to control the selected aspect of the transmitter.

Abstract: An earthquake alarm clock includes a time display device for displaying time with a beeper and a detecting device. The time display device has a guiding member, along which a movable member runs. When an earthquake takes place, the movable member runs along the guiding member and hits the detecting device. The detecting device is electrically connected the beeper to command the beeper broadcasting an alarm when the detecting device is started.

Abstract: A method of forming a silicided gate on a substrate having active regions is provided. The method comprises forming silicide in the active regions and a portion of the gate, leaving a remaining portion of the gate unsilicided; forming a shielding layer over the active regions and gate after the forming step; forming a coating layer over portions of the shielding layer over the active regions; opening the shielding layer to expose the gate, wherein the coating layer protects the portions of the shielding layer over the active regions during the opening step; depositing a metal layer over the exposed gate; and annealing to cause the metal to react with the gate to silicidize at least a part of the remaining portion of the gate.

Abstract: A lighting and flashing Christmas tree structure apparatus employs a low power control circuit to control the flashing sequence of LED light strings, capable of randomly altering distribution of the light strings with free choice of colors. A plug-free magnetic power system supplies electrical power to a cuboidal body where each of the four sides thereon has an electrical power receptacle free for user selection. With a LED device controller, a magnificent blinking is emitting from the LED light source to delight Christmas atmosphere. The electrical power offered by the present invention is limited below 24 V, which is within the safety range of the electrical properties code for body contact, therefore being free of safety concerns.