Patents by Inventor Wen Cheng

Wen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11014805
    Abstract: A method of making a semiconductor package includes bonding a carrier to a surface of the substrate, wherein the carrier is free of active devices, wherein the carrier includes a carrier bond pad on a surface of the carrier. The method further includes bonding a wafer bond pad of an active circuit wafer to the carrier bond pad, wherein the bonding of the wafer bond pad to the carrier bond pad comprises re-graining the wafer bond pad to form at least one grain boundary extending from the wafer bond pad to the carrier bond pad.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: May 25, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu
  • Publication number: 20210140619
    Abstract: A lighting device includes a wavelength conversion unit, a driving unit, and a light source. The wavelength conversion unit includes a main body and a fluorescent powder layer. The main body has a cylindrical outer surface. The fluorescent powder layer is disposed on the cylindrical outer surface. The driving unit is configured to drive the wavelength conversion unit to rotate around an axis. The cylindrical outer surface surrounds the axis. The light source is configured to emit light toward the fluorescent powder layer.
    Type: Application
    Filed: March 30, 2020
    Publication date: May 13, 2021
    Inventors: Jih-Chi LI, Wen-Cheng HUANG
  • Publication number: 20210144075
    Abstract: Presented herein is an exemplified system and method that provides visibility, for traffic analytics, into secured encapsulated packet (e.g., secure VXLAN-GPE packet, a secure metadata-GPE packet or other GPE standards). The exemplified system and method facilitate encryption of traffic in a granular manner that also facilitate the monitoring of said secure traffic in a fabric network in an end-to-end manner throughout the network. Such monitoring can be beneficially used for analytics, performance analysis, and network debugging/troubleshooting.
    Type: Application
    Filed: January 22, 2021
    Publication date: May 13, 2021
    Inventors: Atri Indiresan, Linda Tin-Wen Cheng, Melvin Tsai, Peter Geoffrey Jones, Da-Yuan Tung, David John Zacks
  • Publication number: 20210144343
    Abstract: A smart motion detection device with a determining method includes a memory, a processor, and a sensor array coupled to the memory and the processor. An image captured by the sensor array is processed by the processor. The sensor array is adapted to pre-store the image into the memory when the processor is operated in the sleep mode, and the pre-stored image is transmitted to the processor when the processor is operated in the wakeup mode. The sensor array includes a comparator adapted to generate an alarm signal for switching the processor from the sleep mode to the wakeup mode in accordance with a comparison result of the pre-stored image. The determining method includes the processor analyzing images captured by the sensor array when the sensor array is activated to capture the images, and the processor analyzing images pre-stored inside the memory when the sensor array is not activated.
    Type: Application
    Filed: January 18, 2021
    Publication date: May 13, 2021
    Inventors: Wen-Cheng Yen, Wen-Han Yao
  • Patent number: 11004845
    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of semiconductor fins, a gate stack and an epitaxy structure. The semiconductor fins are present on the semiconductor substrate. The semiconductor fins respectively include recesses therein. The gate stack is present on portions of the semiconductor fins that are adjacent to the recesses. The epitaxy structure is present across the recesses of the semiconductor fins. The epitaxy structure includes a plurality of corners and at least one groove present between the corners, and the groove has a curvature radius greater than that of at least one of the corners.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: May 11, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tung-Wen Cheng, Chih-Shan Chen, Mu-Tsang Lin
  • Patent number: 10999931
    Abstract: A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region. The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: May 4, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Chin-Cheng Kuo, Chia-Chun Yang, Wen-Cheng Huang
  • Publication number: 20210125720
    Abstract: In one embodiment, a computer-implemented method, comprising: receiving information from plural patients, the information from each of the plural patients comprising one or more items recorded over a predefined period of time; formatting the items for use in a machine learning algorithm, wherein the formatting comprises: associating each of the one or more items with a respective word; forming a sentence for each of the plural patients from the words; and transforming the sentences for the plural patients into a numerical matrix, wherein the matrix comprises one row per patient and one column per word, each word weighted by occurrence; training models according to the machine learning algorithm based on the formatted items of the plural patients; determining if a first patient should have a hierarchical condition category code by applying one or more formatted items of the first patient to the trained models; and providing a notification of any suspect hierarchical condition category codes based on the applic
    Type: Application
    Filed: March 7, 2018
    Publication date: April 29, 2021
    Inventors: Chih-Wen CHENG, Bryant MENN, Vincent EMANUELE
  • Publication number: 20210124584
    Abstract: A storage device, which is coupled to a host and a first register, includes a first mapping register, a shadow register, and a controller. The first mapping register is configured to store the first address of the first register. The shadow register includes a first shadow section mapped to a register section of the first register. The controller receives an initialization instruction generated by the host to write the first address into the first mapping register so that the first shadow section is mapped to the first register section.
    Type: Application
    Filed: May 11, 2020
    Publication date: April 29, 2021
    Inventors: Nai-Wen CHENG, Tzu-Lan SHEN
  • Patent number: 10989685
    Abstract: A method of sensing a biological sample includes introducing a fluid containing the biological sample through a first opening in a substrate. The method further includes passing the fluid from the first opening to a first cavity through at least one microfluidic channel. The method further includes repelling the biological sample from a first surface of the first cavity using a first surface modification layer. The method further includes attracting the biological sample to a sensing device using a plurality of modified surface patterns, wherein a first modified surface pattern of the plurality of modified surface patterns has different surface properties from a second modified surface pattern of the plurality of modified surface patterns. The method further includes outputting the fluid through a second opening in the substrate.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: April 27, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Shao Liu, Chun-Wen Cheng, Chun-Ren Cheng
  • Patent number: 10990203
    Abstract: In one example, touchpad assembly is disclosed, which may include a bottom cover, a horizontal elastic member flexibly positioned on the bottom cover, a balancing bar disposed on the bottom cover and substantially parallel to the horizontal elastic member, and a metal dome. The metal dome may include a first end fixedly connected to the bottom cover via a first fixture, and a second end to hold the horizontal elastic member and the balancing bar such that the balancing bar is flexibly engaged with the bottom cover. The balancing bar, the metal dome, and the horizontal elastic member may control a flexure of a touchpad when the touchpad is pressed.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: April 27, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hung-Ming Chen, Chao-Wen Cheng, Kuan-Ting Wu
  • Publication number: 20210117025
    Abstract: An electronic apparatus and an object information recognition method by using touch data thereof are provided. Touch sensing is performed in the case where no object touches a touch panel to obtain a specific background frame through the touch panel. A current touch sensing frame is obtained through the touch panel. Touch background data of a plurality of first frame cells in the specific background frame is respectively subtracted from touch raw data of a plurality of second frame cells in the current touch sensing frame to obtain a background removal frame including a plurality of cell values. The background removal frame is transformed into a touch sensing image. The touch sensing image is inputted to a trained neural network model to recognize object information of a touch object.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 22, 2021
    Applicant: Acer Incorporated
    Inventors: Chih-Wen Huang, Eric Choi, Wen-Cheng Hsu, Chao-Kuang Yang, Yen-Shuo Huang, Ling-Fan Tsao, Chueh-Pin Ko, Chih-Chiang Chen, Tai Ju
  • Publication number: 20210118742
    Abstract: In a method for manufacturing a semiconductor device, a fin structure is formed over a substrate, an isolation insulating layer is formed over the substrate such that an upper portion of the fin structure protrudes from the isolation insulating layer, a first dielectric layer is formed on the upper portion of the fin structure, a cover layer is formed on the first dielectric layer, the cover layer is partially removed from an upper part of the upper portion of the fin structure with the first dielectric layer, the first dielectric layer is removed from the upper part of the upper portion of the fin structure, a second dielectric layer is formed on the upper part of the upper portion of the fin structure, and a gate electrode is formed on the second dielectric layer and the first dielectric layer disposed on an lower part of the upper portion of the fin structure.
    Type: Application
    Filed: October 16, 2019
    Publication date: April 22, 2021
    Inventors: Jen-Chun CHOU, Tung-Wen CHENG
  • Publication number: 20210117041
    Abstract: An electronic apparatus and an object information recognition method by using touch data thereof are provided. A current touch sensing frame is obtained through a touch panel. The current touch sensing frame includes a plurality of frame cells respectively corresponding to a plurality of touch sensing units, and each of the frame cells has touch raw data. The frame cells include a target frame cell. A new cell value corresponding to the target frame cell is generated according to touch raw data of a plurality of adjacent frame cells adjacent to the target frame cell in the current touch sensing frame, so as to generate a transformation frame according to the new cell value. The transformation frame is transformed into a touch sensing image, and the touch sensing image is analyzed to recognize object information of a touch object.
    Type: Application
    Filed: March 20, 2020
    Publication date: April 22, 2021
    Applicant: Acer Incorporated
    Inventors: Chih-Wen Huang, Eric Choi, Wen-Cheng Hsu, Chao-Kuang Yang, Yen-Shuo Huang, Ling-Fan Tsao
  • Patent number: 10976607
    Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: April 13, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Wen-Cheng Huang, Ting-Sheng Chen, Chia-Chun Yang, Chin-Cheng Kuo
  • Patent number: 10978341
    Abstract: A method includes performing an implantation on a portion of a first layer to form an implanted region, and removing un-implanted portions of the first layer. The implanted region remains after the un-implanted portions of the first layer are removed. An etching is then performed on a second layer underlying the first layer, wherein the implanted region is used as a portion of a first etching mask in the etching. The implanted region is removed. A metal mask is etched using the second layer to form a patterned mask. An inter-layer dielectric is then etched to form a contact opening, wherein the patterned mask is used as a second etching mask.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: April 13, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Sun, Han-Ti Hsiaw, Yi-Wei Chiu, Kuan-Cheng Wang, Shin-Yeu Tsai, Jr-Yu Chen, Wen-Cheng Wu
  • Publication number: 20210103189
    Abstract: The invention is related to a back-light device. The back-light device comprises a reflection structure and a back-light plate. A plurality of light-emitting elements, disposed on the back-light plate, face a light-entering side of the reflection structure, and the emitted light of the light-emitting elements enters the light-entering side of the reflection structure and is reflected to a light-emitting side of the reflection structure by the reflection of the reflection structure for forming a back-light source emitted to a display panel.
    Type: Application
    Filed: June 26, 2019
    Publication date: April 8, 2021
    Inventors: CHUAN-PIN HSIUNG, SHUN WEN CHENG
  • Patent number: 10968097
    Abstract: Various embodiments of the present disclosure are directed towards a microphone including a support structure layer disposed between a particle filter and a microelectromechanical systems (MEMS) structure. A carrier substrate is disposed below the particle filter and has opposing sidewalls that define a carrier substrate opening. The MEMS structure overlies the carrier substrate and includes a diaphragm having opposing sidewalls that define a diaphragm opening overlying the carrier substrate opening. The particle filter is disposed between the carrier substrate and the MEMS structure. A plurality of filter openings extend through the particle filter. The support structure layer includes a support structure having one or more segments spaced laterally between the opposing sidewalls of the carrier substrate. The one or more segments of the support structure are spaced laterally between the plurality of filter openings.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: April 6, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Wen Cheng Kuo
  • Publication number: 20210096229
    Abstract: A target measurement device is provided. The target measurement device includes a fixing ring, a main body, and a transceiver. The fixing ring has a first surface. The main body is over the first surface of the fixing ring. The transceiver is coupled to the main body. The transceiver is at least movable between a center of the fixing ring to an edge of the fixing ring from a top view perspective. A method for measuring a target is also provided.
    Type: Application
    Filed: June 19, 2020
    Publication date: April 1, 2021
    Inventors: PRADIP GIRDHAR CHAUDHARI, CHE-HUI LEE, CHIH-CHENG WEI, WEN-CHENG YANG, CHYI-TSONG NI
  • Publication number: 20210098681
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a first piezoelectric layer, and a first dummy layer. The first piezoelectric layer is over the substrate, and the first piezoelectric layer has a first top surface. The first dummy layer is over the first piezoelectric layer, and the first dummy layer has a second top surface. And an average roughness of the first top surface is greater than an average roughness of the second top surface. A method for manufacturing the semiconductor structure is also provided.
    Type: Application
    Filed: March 13, 2020
    Publication date: April 1, 2021
    Inventors: CHUN-WEN CHENG, CHUN YIN TSAI, CHIA-HUA CHU
  • Patent number: 10964819
    Abstract: A fin field effect transistor (FinFET) device structure and method for forming the FinFET device structure are provided. The FinFET structure includes a substrate, and the substrate includes a core region and an I/O region. The FinFET structure includes a first etched fin structure formed in the core region, and a second etched fin structure formed in the I/O region. The FinFET structure further includes a plurality of gate stack structures formed over the first etched fin structure and the second etched fin structure, and a width of the first etched fin structure is smaller than a width of the second etched fin structure.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zhe-Hao Zhang, Tung-Wen Cheng, Che-Cheng Chang, Yung-Jung Chang