Patents by Inventor Wen Cheng

Wen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10734227
    Abstract: A four-layer photoresist and method of forming the same are disclosed. In an embodiment, a method includes forming a semiconductor fin; depositing a target layer on the semiconductor fin; depositing a BARC layer on the target layer; depositing a first mask layer over the BARC layer, the first mask layer being deposited using a plasma process with an RF power of less than 50 W; depositing a second mask layer over the first mask layer using a plasma process with an RF power of less than 500 W; depositing a photoresist layer over the second mask layer; patterning the photoresist layer, the second mask layer, the first mask layer, and the BARC layer to form a first mask; and selectively removing the target layer from a first portion of the semiconductor fin using the first mask, the target layer remaining on a second portion of the semiconductor fin.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: August 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Dong-Sheng Li, Chia-Hui Lin, Kai Hung Cheng, Yao-Hsu Sun, Wen-Cheng Wu, Bo-Cyuan Lu, Sung-En Lin, Tai-Chun Huang
  • Publication number: 20200245402
    Abstract: The disclosure is directed to an RLC SDU transmission method, and an IAB node using the same method. In as aspect, the RLC SDU transmission method is used by a first IAB node and includes: receiving a control signal from an IAB donor node; identifying a stray RLC SDU destined for the UE, associated with a sequence number, and not acknowledged by the second IAB node in response to receiving the control signal; and transmitting an RLC PDU to the second IAB node to inform the second IAB node of the stray RLC SDU.
    Type: Application
    Filed: December 23, 2019
    Publication date: July 30, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-Yuan Chiu, Ching-Wen Cheng
  • Publication number: 20200245223
    Abstract: A packet routing method is provided according to an embodiment. The method includes: updating a first routing configuration configured to a source node and a second routing configuration configured to a target node in response to a handover of a user equipment (UE) from the source node to the target node; receiving a first packet with a first header reflecting a result of the handover; and transmitting the first packet with the first header according to at least one of the updated first routing configuration and the updated second routing configuration.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 30, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Ching-Wen Cheng, Chun-Yuan Chiu
  • Patent number: 10727319
    Abstract: Stress memorization techniques (SMTs) for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes forming a capping layer over a fin structure; forming an amorphous region within the fin structure while the capping layer is disposed over the fin structure; and performing an annealing process to recrystallize the amorphous region. The capping layer enables the fin structure to retain stress effects induced by forming the amorphous region and/or performing the annealing process.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: July 28, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Wen-Cheng Lo, Sun-Jay Chang
  • Publication number: 20200231431
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a plurality of vias, a signal transmitting portion, a heater and a sensing material. The plurality of vias penetrates the substrate, wherein each of the plurality of vias includes a conductive or semiconductive portion surrounded by an oxide layer. The signal transmitting portion is disposed in the substrate, wherein adjacent vias of the plurality of vias surrounds the signal transmitting portion. The heater is electrically connected to the signal transmitting portion, and the sensing material is disposed over the heater and electrically connected to the substrate. A method of manufacturing a semiconductor structure is also provided.
    Type: Application
    Filed: April 8, 2020
    Publication date: July 23, 2020
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin
  • Publication number: 20200228760
    Abstract: A smart motion detection device with a determining method includes a memory, a processor, and a sensor array coupled to the memory and the processor. An image captured by the sensor array is processed by the processor. The sensor array is adapted to pre-store the image into the memory when the processor is operated in the sleep mode, and the pre-stored image is transmitted to the processor when the processor is operated in the wakeup mode. The sensor array includes a comparator adapted to generate an alarm signal for switching the processor from the sleep mode to the wakeup mode in accordance with a comparison result of the pre-stored image. The determining method includes the processor analyzing images captured by the sensor array when the sensor array is activated to capture the images, and the processor analyzing images pre-stored inside the memory when the sensor array is not activated.
    Type: Application
    Filed: March 30, 2020
    Publication date: July 16, 2020
    Inventors: Wen-Cheng Yen, Wen-Han Yao
  • Patent number: 10715924
    Abstract: A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: July 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Chun Yin Tsai
  • Patent number: 10714157
    Abstract: A non-volatile memory and a reset method thereof are provided. The reset method includes: performing a first reset operation on a plurality of memory cells; recording a plurality of first verifying currents respectively corresponding to a plurality of first failure memory cells; performing a second reset operation on the first failure memory cells, and verifying second failure memory cells to obtain a plurality of second verifying currents; setting a first voltage modify flag according to a plurality of first ratios between the first verifying currents and the respectively corresponding second verifying currents; and adjusting a reset voltage for performing the first reset operation and the second reset operation according to the first voltage modify flag.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 14, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Che Lin, He-Hsuan Chao, Ping-Kun Wang, Seow Fong Lim, Ngatik Cheung, Chia-Wen Cheng
  • Patent number: 10710871
    Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: July 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng
  • Publication number: 20200216661
    Abstract: A white polyester film, having a specific weight of 0.6-1.2, being a three-layered structure containing two outer layers (A) having a combined thickness taking up 2% to 30% of an overall thickness of the film and a middle layer (B), and having air-bubble cells in both the outer layers (A) and the middle layer (B), has the outer layers (A) formed from a polyester resin and inorganic particles; and has the middle layer (B) having a heat distortion temperature above 120° C. and a melt flow index (MI) of 0.2-1 g/10 min (at 230° C., with a load of 2.16 kg) via crosslinking modified with 0.1-3 PHR of phrperoxide, and inorganic particles.
    Type: Application
    Filed: January 3, 2019
    Publication date: July 9, 2020
    Inventors: Te-Chao LIAO, Wen-Cheng YANG, Chun-Che TSAO, Chia-Yen HSIAO, Chih-Feng WANG
  • Publication number: 20200220019
    Abstract: A fin field effect transistor (FinFET) device structure and method for forming FinFET device structure are provided. The FinFET structure includes a substrate and a fin structure extending above the substrate. The FinFET structure includes an epitaxial structure formed on the fin structure, and the epitaxial structure has a first height. The FinFET structure also includes fin sidewall spacers formed adjacent to the epitaxial structure. The sidewall spacers have a second height and the first height is greater than the second height, and the fin sidewall spacers are configured to control a volume and the first height of the epitaxial structure.
    Type: Application
    Filed: March 18, 2020
    Publication date: July 9, 2020
    Inventors: Zhe-Hao Zhang, Tung-Wen Cheng, Chang-Yin Chen, Che-Cheng Chang, Yung-Jung Chang
  • Patent number: 10705749
    Abstract: A method for performing access control in a memory device, the associated memory device and the controller thereof are provided. The method includes: according to at least one predetermined arrangement pattern, writing a plurality of sets of symbols into a plurality of storage regions of a memory as a plurality of redundant array of independent disks (RAID) groups, respectively; and utilizing a RAID engine circuit in the memory device to perform a plurality of operations related to data protection, such as: determining a series of reading patterns corresponding to the predetermined arrangement pattern; according to a reading pattern of the series of reading patterns, reading a plurality of symbols from each RAID group of the RAID groups; and performing exclusive-OR (XOR) operations on the symbols to convert the symbols into at least one XOR result, for performing data protection.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: July 7, 2020
    Assignee: Silicon Motion, Inc.
    Inventor: Chiao-Wen Cheng
  • Patent number: 10702494
    Abstract: The present invention is related to a method for cancer treatment comprising a step of administering to a subject in need thereof a therapeutically effective amount of a pharmaceutical composition comprising ferrous amino acid chelate and a pharmaceutically acceptable carrier. By means of amino acid chelating to ferrous and maintaining chelating state through the stomach, the pharmaceutical composition in accordance with the present invention would not cause any weight variation, and is suitable for inhibiting or treating cancer.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: July 7, 2020
    Assignee: Profeat Biotechnology Co., Ltd.
    Inventors: Tsun-Yuan Lin, Mu-Kuei Chen, Tsang-Tse Chen, Chai-Hui Fu, Hsun-Jin Jan, Wen-Cheng Chiu
  • Patent number: 10709027
    Abstract: A circuit board module for being assembled to a case is provided. The circuit board module includes an electronic connector and a circuit board. The electronic connector is fixed to the circuit board. The circuit board has at least one first slot. The at least one first slot is configured for a fixing element to pass through and for the circuit board to be assembled to a case. The size of the at least one first slot allows the fixing element to move in a direction parallel to a surface of the circuit board in the at least one first slot. An electronic device having the circuit board module is also provided.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: July 7, 2020
    Assignee: PEGATRON CORPORATION
    Inventors: Wen-Hsien Tsao, Ho-Ching Huang, Wen-Cheng Tsai
  • Publication number: 20200208909
    Abstract: A liquid cooler comprises a hot liquid container, a cold liquid container, a cooling sleeve, a heat exchanger and a plurality of connecting pipes. The hot liquid container communicates with the cooling sleeve through the connecting pipes. The cooling sleeve has a double-layer structure, the inner pipe of which is used for transporting a hot liquid and the outer pipe thereof is used for transporting cooling water. The cooling water cools the hot liquid in the inner pipe once forming a cold liquid, and the cold liquid passes through the connecting pipes to reach the cold liquid container. The heat exchanger cools the cold liquid for a second time forming an ice liquid. After the two-stage cooling, the hot liquid is made into an ice liquid beverage of required temperature avoiding the bitterness and rancidity of high-temperature liquid beverages.
    Type: Application
    Filed: November 25, 2019
    Publication date: July 2, 2020
    Inventor: Wen-Cheng Chang
  • Publication number: 20200213701
    Abstract: An integrated microphone device is provided. The integrated microphone device includes a substrate, a plate, and a membrane. The substrate includes an aperture allowing acoustic pressure to pass through. The plate is disposed on a side of the substrate. The membrane is disposed between the substrate and the plate and movable relative to the plate as acoustic pressure strikes the membrane. The membrane includes a vent valve having an open area that is variable in response to a change in acoustic pressure.
    Type: Application
    Filed: March 10, 2020
    Publication date: July 2, 2020
    Inventors: Chun-Wen CHENG, Chia-Hua CHU, Chun-Yin TSAI, Tzu-Heng WU, Wen-Cheng KUO
  • Patent number: 10701583
    Abstract: A method of service level traffic differentiation at a radio access network, a wireless network system and a radio access network (RAN) access node are provided. The method of service level traffic differentiation at the radio access network includes the following steps: A core network transmits a data flow information including a flow ID to a RAN access node via a user plane packet. The RAN access node sets up a data connection to a user equipment according to the data flow information.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: June 30, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Wen Cheng, Hung-Chen Chen, Fang-Ching Ren
  • Patent number: 10699119
    Abstract: Methods and systems for detecting objects from aerial imagery are disclosed. The method includes obtaining an image of an area, obtaining a plurality of regional aerial images from the image of the area, classifying the plurality of regional aerial images as a first class or a second class by a classifier, wherein: the first class indicates a regional aerial image contains a target object, the second class indicates a regional aerial image does not contain a target object, and the classifier is trained by first and second training data, wherein the first training data include first training images containing target objects, and the second training data include second training images containing target objects obtained by adjusting at least one of brightness, contrast, color saturation, resolution, or a rotation angle of the first training images; and recognizing a target object in a regional aerial image in the first class.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: June 30, 2020
    Assignee: GEOSAT AEROSPACE & TECHNOLOGY
    Inventors: Cheng-Fang Lo, Zih-Siou Chen, Chang-Rong Ko, Chun-Yi Wu, Ya-Wen Cheng, Kuang-Yu Chen, Hsiu-Hsien Wen, Te-Che Lin, Ting-Jung Chang
  • Publication number: 20200203842
    Abstract: Examples of an integrated slot antenna are described. The integrated slot antenna comprises a first slot, a second slot and a separating member. The first slot is an open-ended slot and is coupled to a first antenna member to form a first slot antenna. The first slot antenna operates in a first predetermined range of frequencies. The second slot is a close-ended slot and is separated from the first slot by the separating member.
    Type: Application
    Filed: April 18, 2017
    Publication date: June 25, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Juhung Chen, Leo Gerten, Po Chao Chen, Hung-Wen Cheng
  • Publication number: 20200203829
    Abstract: The invention discloses a radio frequency (RF) matching device for a tire pressure sensor, which includes a system control unit, a RF control unit, a RF matching unit, and a multi-frequency antenna in order, wherein the RF matching unit includes a resonance portion, a filtering portion, and a matching portion in order, wherein the resonance unit is connected to the RF control unit to be adjusted to the required initial frequency and cut-off frequency of various frequency bands; the filter unit is connected between the resonance unit and the matching unit to suppress and eliminate noise and unwanted frequency-doubling signals; the matching unit allows the maximum power of the multi-frequency RF signal to be transferred to the multi-frequency antenna, so that the multi-frequency antenna can transmit multiple RF signals of different frequencies.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 25, 2020
    Inventor: CHIA-WEN CHENG