Patents by Inventor Wen Cheng

Wen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190306633
    Abstract: A micro electro mechanical system (MEMS) microphone includes a first membrane, a second membrane, a third membrane disposed between the first membrane and the second membrane, a first cavity disposed between the first membrane and the third membrane and surrounded by a first wall, a second cavity disposed between the second membrane and the third membrane and surrounded by a second wall, and one or more first supports disposed in the first cavity and connecting the first membrane and the third membrane.
    Type: Application
    Filed: October 29, 2018
    Publication date: October 3, 2019
    Inventors: Chen Hsiung YANG, Chun-Wen CHENG, Chia-Hua CHU, En-Chan CHEN
  • Publication number: 20190299803
    Abstract: A vehicle includes a battery connecting module and a processor. The battery connecting module is configured to couple to at least one rechargeable battery. The processor is configured to: determine whether the battery module is coupled to a charging device; in response to the battery module being coupled to the charging device, transmit a permission request to a server; and in response to receiving a charging permission corresponding to the permission request from the server, allow the at least one rechargeable battery to be charged by the charging device.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 3, 2019
    Inventors: Hsun-Wen Cheng, Yu-Chang Chien, Jia-Yang Wu
  • Publication number: 20190302867
    Abstract: The present disclosure is applicable to the technical field of loudspeaker and provides a method and apparatus for reducing continuous-wakeup delay of Bluetooth loudspeaker and a Bluetooth loudspeaker. The method for reducing continuous-wakeup delay of Bluetooth loudspeaker includes: resetting a wakeup flag bit to wait for a next wakeup when receiving a stop-recording instruction which is sent by a terminal equipment through a Bluetooth serial port communication protocol; and executing a wakeup-interruption operation again after a preset wakeup keyword is received. According to the present disclosure, time delay under a continuous-wakeup mode can be greatly reduced and a response speed of continuous-wakeup can be improved.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 3, 2019
    Applicant: SHENZHEN GRANDSUN ELECTRONIC CO., LTD.
    Inventors: Wen CHENG, Haiquan WU, Dayong TANG, Enqin ZHANG, Lei CAO, Ruiwen SHI
  • Patent number: 10429341
    Abstract: A method for testing a partially fabricated bio-sensor device wafer includes aligning the partially fabricated bio-sensor device wafer on a wafer stage of a wafer-level bio-sensor processing tool. The method further includes mounting an integrated electro-microfluidic probe card to a device area on the partially fabricated bio-sensor device wafer, wherein the electro-microfluidic probe card has a first major surface. The method further includes electrically connecting one or more electronic probe tips disposed on the first major surface of the integrated electro-microfluidic probe card to conductive areas of the device area. The method further includes flowing a test fluid from a fluid supply to the integrated electro-microfluidic probe card. The method further includes electrically measuring via the one or more electronic probe tips a first electrical property of one or more bio-FETs of the device area based on the test fluid flow.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: October 1, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Shao Liu, Fei-Lung Lai, Chun-Ren Cheng, Chun-Wen Cheng
  • Patent number: 10425251
    Abstract: Disclosed are a method and a system of device-to-device tunnel establishment between small cells, applied to a wireless backhaul management device, a first small cell and a second small cell. The method comprises: matching the first small cell and the second small cell according to a first discovery response and a second discovery response; submitting a match report; replying with a match report response; conducting a D2D connection authentication procedure between the second small cell and the first small cell; wirelessly connecting the second small cell and the first small cell, conducting a connection test and submitting a connection test report; replying with a D2D tunnel establishment decision according to the connection test report; and establishing a D2D tunnel between the second small cell and the first small cell.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: September 24, 2019
    Assignees: WISTRON NEWEB CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chui-Chu Cheng, Chieh-Wen Cheng, Jen-Shun Yang, Kuei-Li Huang, Yi-Huai Hsu
  • Publication number: 20190273023
    Abstract: Generally, examples are provided relating to conductive features that include a barrier layer, and to methods thereof. In an embodiment, a metal layer is deposited in an opening through a dielectric layer(s) to a source/drain region. The metal layer is along the source/drain region and along a sidewall of the dielectric layer(s) that at least partially defines the opening. The metal layer is nitrided, which includes performing a multiple plasma process that includes at least one directional-dependent plasma process. A portion of the metal layer remains un-nitrided by the multiple plasma process. A silicide region is formed, which includes reacting the un-nitrided portion of the metal layer with a portion of the source/drain region. A conductive material is disposed in the opening on the nitrided portions of the metal layer.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 5, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Yip LOH, Chih-Wei CHANG, Hong-Mao LEE, Chun-Hsien HUANG, Yu-Ming HUANG, Yan-Ming TSAI, Yu-Shiuan WANG, Hung-Hsu CHEN, Yu-Kai CHEN, Yu-Wen CHENG
  • Publication number: 20190273532
    Abstract: A carrier frequency offset (CFO) estimation device includes an echo cancelling unit, performing echo cancellation on an input signal to generate an echo-cancelled signal; and a CFO estimating unit, performing CFO estimation on the echo-cancelled signal to generate an estimated CFO.
    Type: Application
    Filed: August 14, 2018
    Publication date: September 5, 2019
    Inventors: Kuan-Chou LEE, Kai-Wen CHENG, Chia-Wei CHEN, Tai-Lai TUNG
  • Publication number: 20190273147
    Abstract: Embodiments disclosed herein relate generally to forming an effective metal diffusion barrier in sidewalls of epitaxy source/drain regions. In an embodiment, a structure includes an active area having a source/drain region on a substrate, a dielectric layer over the active area and having a sidewall aligned with the sidewall of the source/drain region, and a conductive feature along the sidewall of the dielectric layer to the source/drain region. The source/drain region has a sidewall and a lateral surface extending laterally from the sidewall of the source/drain region, and the source/drain region further includes a nitrided region extending laterally from the sidewall of the source/drain region into the source/drain region. The conductive feature includes a silicide region along the lateral surface of the source/drain region and along at least a portion of the sidewall of the source/drain region.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 5, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Wen CHENG, Cheng-Tung LIN, Chih-Wei CHANG, Hong-Mao LEE, Ming-Hsing TSAI, Sheng-Hsuan LIN, Wei-Jung LIN, Yan-Ming TSAI, Yu-Shiuan WANG, Hung-Hsu CHEN, Wei-Yip LOH, Ya-Yi CHENG
  • Publication number: 20190273042
    Abstract: A semiconductor device and method of forming the same that includes forming a dielectric layer over a substrate and patterning a contact region in the dielectric layer, the contact region having side portions and a bottom portion that exposes the substrate. The method can also include forming a dielectric barrier layer in the contact region to cover the side portions and the bottom portion, and etching the dielectric barrier layer to expose the substrate. Subsequently, a conductive layer can be formed to cover the side portions and the bottom portion of the contact region and the conductive layer can be annealed to form a silicide region in the substrate beneath the bottom portion of the contact region, and the conductive layer can then be selectively removed on the side portions of the contact region.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 5, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee, Chun-I Tsai, Ken-Yu Chang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20190267369
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an ultra-high voltage resistor and methods of manufacture. The structure includes at least one resistor coupled to a well of a doped substrate, the at least one resistor being separated vertically from the well by an isolation region with one end of the resistor being attached to an input pad and another end coupled to circuitry.
    Type: Application
    Filed: February 28, 2018
    Publication date: August 29, 2019
    Inventors: Donald R. DISNEY, Jongjib KIM, Wen-Cheng LIN
  • Publication number: 20190262677
    Abstract: A head of a golf club is provided with a high coefficient of restitution. The head has a club head with an opening and a through hole opposite each other, a face panel securely mounted on the opening of the club head, a shaft securely mounted in the through hole of the club head, a shock-proof component mounted in the shaft, and an anti-impulse component mounted in the shaft and abutting the face panel. When hitting a golf, the face panel deforms concavely and shock waves are generated. Some of the shock waves are transmitted to the shaft via the through hole. With the shock-proof component, the shock waves transmitted via the through hole may be obstructed and not be absorbed by the anti-impulse component, which let all of the remaining shock waves on the face panel can be absorbed by the anti-impulse component thoroughly.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Inventor: Wen-Cheng TSENG
  • Patent number: 10394518
    Abstract: An audio synchronization method includes: receiving a first audio signal from a first recording device; receiving a second audio signal from a second recording device; performing a correlation operation upon the first audio signal and the second audio signal to align a first pattern of the first audio signal and the first pattern of the second audio signal; after the first patterns of the first audio signal and the second audio signal are aligned, calculating a difference between a second pattern of the first audio signal and the second pattern of the second audio signal; and obtaining a starting-time difference between the first audio signal and the second audio signal for audio synchronization according to the difference between the second pattern of the first audio signal and the second pattern of the second audio signal.
    Type: Grant
    Filed: March 5, 2017
    Date of Patent: August 27, 2019
    Assignee: MEDIATEK INC.
    Inventors: Xin-Wei Shih, Chia-Ying Li, Chao-Ling Hsu, Yiou-Wen Cheng, Shen-Kai Chang
  • Patent number: 10384933
    Abstract: A method of making a micro electromechanical system (MEMS) package includes patterning a substrate to form a MEMS section. The method further includes bonding a carrier to a surface of the substrate. The carrier is free of active devices. The carrier includes a carrier bond pad on a surface of the carrier opposite the MEMS section. The carrier bond pad is electrically connected to the MEMS section. The method further includes bonding a wafer bond pad of an active circuit wafer to the carrier bond pad. The bonding of the wafer bond pad to the carrier bond pad includes re-graining the wafer bond pad to form at least one grain boundary extending from the wafer bond pad to the carrier bond pad.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: August 20, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu
  • Patent number: 10389112
    Abstract: A device for generating a duty cycle includes a converter, a corrector, and a control circuit. The converter is configured to generate a first output signal having a duty cycle to an output terminal according to an input signal. The corrector is coupled to the output terminal, and is configured to adjust the duty cycle of the first output signal according to a control signal. The converter is coupled in parallel with the corrector and between a first power source and a second power source. The control circuit is coupled to the output terminal, and is configured to generate the control signal according to the first output signal and a reference signal.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: August 20, 2019
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ting-Hsu Chien, Chih-Wen Cheng, Jeng-Hung Tsai
  • Patent number: 10389515
    Abstract: An integrated circuit, a multi-channel transmission apparatus, and a signal transmission method thereof are provided. The multi-channel transmission apparatus includes a pre-stage circuit, a clock signal generator, and a post-stage circuit. The pre-stage circuit receives a plurality of first clock signals and a plurality of data signals, selects one of the first clock signals to be a base clock signal, and transmits the data signals according to the base clock signal to respectively generate a plurality of middle signals. The clock signal generator generates the first clock signals according to a second clock signal, wherein a frequency of the second clock signal is higher than a frequency of the first clock signals. The post-stage circuit transmits the middle signals according to the second clock signal to respectively generate a plurality of output signals. The pre-stage circuit is a digital circuit, and the post-stage circuit is an analog circuit.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: August 20, 2019
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Hsu Chien, Chih-Wen Cheng, Hua-Shih Liao
  • Publication number: 20190250327
    Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
  • Publication number: 20190251302
    Abstract: A card insertion structure suited for a portable electronic device is provided. The portable electronic device includes a housing. The card insertion structure includes a base disposed in the housing, a pressing member movably disposed on the base, and a plastic spring strip disposed on the base. A portion of the pressing member is exposed out of the housing. The plastic spring strip leans against the pressing member and the base. A force supplied via an insertion of an electronic card drives the pressing member to deform the plastic spring strip, and after the electronic card passing by the pressing member and being inserted into the card insertion structure between the base and the housing, the pressing member is released and is restored by resilience of the plastic spring strip, and the electronic card is fixed with the housing by the pressing member.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 15, 2019
    Applicant: PEGATRON CORPORATION
    Inventors: Guo-Long Guo, Ho-Ching Huang, Wen-Cheng Tsai
  • Publication number: 20190250260
    Abstract: An electronic device including a sound receiver and a processor is provided. The sound receiver receives a sound signal provided by a sound generator. When the processor determines that an obstacle is blocked between the electronic device and the fixed device, the processor estimates a virtual position of the electronic device at a current time according to previous movement information and a previous position of the electronic device. The virtual position has a shortest path between a boundary position of the obstacle and the sound generator. The processor obtains a first relative distance between the electronic device and the boundary position according to the sound signal received by the sound receiver and the boundary position. The processor calculates a relative velocity and a relative acceleration of the electronic device relative to the fixed device at the current time according to the sound signal and the first relative distance.
    Type: Application
    Filed: May 21, 2018
    Publication date: August 15, 2019
    Applicant: Acer Incorporated
    Inventors: Po-Jen Tu, Jia-Ren Chang, Kai-Meng Tzeng, Wen-Cheng Hsu, Hsing-Chu Wu
  • Publication number: 20190246475
    Abstract: A light emitting device driver circuit includes: a power conversion circuit, an error amplifier circuit, a sample-and-hold circuit, a load current generation circuit and a feed-forward capacitor. When the light emitting device driver circuit is in a disable phase, the sample-and-hold circuit connects a feedback signal with a second reference voltage and the sample-and-hold circuit disconnects the feedback signal from a load node, whereby the feed-forward capacitor samples a sample voltage and holds it after the disable phase transits to an enable phase. In the enable phase, the sample-and-hold circuit disconnects the feedback signal from the second reference voltage and the sample-and-hold circuit connects the feedback signal with the load node, so that during a predetermined period following the transition, there is a sufficient difference between two input terminals of the error amplifier circuit so that the load current is raised to a desired current level within the predetermined period.
    Type: Application
    Filed: November 22, 2018
    Publication date: August 8, 2019
    Inventors: Huan-Chien Yang, Tsung-Wei Huang, Hui-Wen Cheng, Shui-Mu Lin
  • Patent number: 10373570
    Abstract: A display apparatus and an image data processing method thereof are provided. The display apparatus includes a first display panel, a second display panel and a backlight module. The image processing method includes: receiving image data; detecting an ambient temperature and an ambient brightness to obtain a detection result; when the ambient temperature is lower than a preset temperature value, selecting the image data to be divided into a plurality block data by display location or gray level range according to the ambient brightness, and performing a blur process on the block data to generate adjusted image data; when the ambient temperature is not lower than the preset temperature value, performing a binary process on the image data to generate the adjusted image data; and driving the second display panel according to the adjust image data.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: August 6, 2019
    Assignee: Au Optronics Corporation
    Inventors: Hui-Feng Lin, Sheng-Wen Cheng