Patents by Inventor Wen Cheng

Wen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10273144
    Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package having two MEMS devices with different pressures, and an associated method of formation. In some embodiments, the (MEMS) package includes a device substrate and a cap substrate bonded together. The device substrate includes a first trench and a second trench. A first MEMS device is disposed over the first trench and a second MEMS device is disposed over the second trench. A first stopper is raised from a first trench bottom surface of the first trench but below a top surface of the device substrate and a second stopper is raised from a second trench bottom surface of the second trench but below the top surface of the device substrate. A first depth of the first trench is greater than a second depth of the second trench.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng, Kuei-Sung Chang, Jung-Huei Peng
  • Publication number: 20190123168
    Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a gate electrode over the semiconductor substrate. The semiconductor device structure also includes a source/drain structure adjacent to the gate electrode. The semiconductor device structure further includes a spacer element over a sidewall of the gate electrode, and the spacer element has an upper portion having a first exterior surface and a lower portion having a second exterior surface. Lateral distances between the first exterior surface and the sidewall of the gate electrode are substantially the same. Lateral distances between the second exterior surface and the sidewall of the gate electrode increase along a direction from a top of the lower portion towards the semiconductor substrate.
    Type: Application
    Filed: December 21, 2018
    Publication date: April 25, 2019
    Inventors: Bo-Feng Young, Che-Cheng Chang, Mu-Tsang Lin, Tung-Wen Cheng, Zhe-Hao Zhang
  • Publication number: 20190119591
    Abstract: In order to develop a high combustion heat and stable bio-oil for safer transportation. The present invention discloses a low carbon bio-oil, selected from the group consisting of a thermo-chemical oil product, a fatty acid containing bio-oil and a bio-alcohol. The invention also discloses a preparation method of preparing the low carbon bio-oil.
    Type: Application
    Filed: January 22, 2018
    Publication date: April 25, 2019
    Inventors: Tzu-Hsien HSIEH, Yang-Chuang CHANG, Haw-Yeu CHUANG, Wen-Cheng KANG
  • Publication number: 20190123205
    Abstract: A fin field effect transistor (FinFET) device structure and method for forming the FinFET device structure are provided. The FinFET structure includes a substrate, and the substrate includes a core region and an I/O region. The FinFET structure includes a first etched fin structure formed in the core region, and a second etched fin structure formed in the I/O region. The FinFET structure further includes a plurality of gate stack structures formed over the first etched fin structure and the second etched fin structure, and a width of the first etched fin structure is smaller than a width of the second etched fin structure.
    Type: Application
    Filed: December 21, 2018
    Publication date: April 25, 2019
    Inventors: Zhe-Hao Zhang, Tung-Wen Cheng, Che-Cheng Chang, Yung-Jung Chang
  • Patent number: 10267988
    Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: April 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
  • Patent number: 10266396
    Abstract: The present disclosure provides a semiconductor device, which includes a first substrate comprising an upper surface and a second substrate disposed over the first substrate. The semiconductor device also includes a first electrode disposed in the second substrate and configured to move in a direction substantially parallel to the upper surface in response to a pressure difference, and a second electrode disposed in the second substrate. The second electrode is configured to provide a capacitance in conjunction with the first electrode.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: April 23, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ching-Kai Shen, Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen, Jung-Huei Peng, Chun-Wen Cheng
  • Publication number: 20190115473
    Abstract: A fin field effect transistor (FinFET) device structure and method for forming FinFET device structure are provided. The FinFET structure includes a substrate and an isolation structure formed on the substrate. The FinFET structure also includes a fin structure extending above the substrate, and the fin structure is embedded in the isolation structure. The FinFET structure further includes an epitaxial structure formed on the fin structure, the epitaxial structure has a pentagon-like shape, and an interface between the epitaxial structure and the fin structure is lower than a top surface of the isolation structure.
    Type: Application
    Filed: December 21, 2018
    Publication date: April 18, 2019
    Inventors: Zhe-Hao Zhang, Tung-Wen Cheng, Chang-Yin Chen, Che-Cheng Chang, Yung-Jung Chang
  • Publication number: 20190112183
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure has a plurality of interconnect layers disposed within a dielectric structure over a substrate. A passivation layer is over the dielectric structure. A sensing electrode and a bonding electrode have bottom surfaces directly contacting the passivation layer. A microelectromechanical systems (MEMS) substrate is vertically separated from the sensing electrode. The bonding electrode is electrically connected to the MEMs substrate and to one or more of the plurality of interconnect layers. An electrode extension via is configured to electrically connect the sensing electrode to one or more of the plurality of interconnect layers.
    Type: Application
    Filed: December 6, 2018
    Publication date: April 18, 2019
    Inventors: Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng, Jung-Huei Peng
  • Publication number: 20190114888
    Abstract: A time-reversal indoor detection system and method are provided. The system includes an anchor node device, an access point (AP) device, and a first electronic device. The first wireless communication circuit of the anchor node device is configured to send a probe signal, a third wireless communication circuit of the access point device is configured to receive the probe signal, a processor is configured to obtain a current CSI from the probe signal, and to compare the current CSI to a preset CSI, and when a first CSI included in the preset CSI is matched to the current CSI, a second wireless communication circuit of the anchor node device is configured to activate at least one function of a first electronic device through a second communication protocol.
    Type: Application
    Filed: March 26, 2018
    Publication date: April 18, 2019
    Inventors: YA-PING WEI, CHIEH-WEN CHENG, HOREN CHEN
  • Patent number: 10263813
    Abstract: A signal receiving apparatus includes a phase recovery look, a phase estimation circuit, a phase noise detection circuit, and a bandwidth setting circuit. The phase recovery loop performs a phase recovery process on an input signal according to a bandwidth setting. The phase estimation circuit generates an estimated phase associated with the input signal. The phase noise detection circuit determines a phase noise amount according to the estimated phase. The bandwidth setting circuit calculates an average and a variance of the phase noise amounts, and adjusts the bandwidth setting of the phase recovery loop according to the average and the variance.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: April 16, 2019
    Assignee: MSTAR SEMICONDUCTOR, INC.
    Inventors: Chia-Chun Hung, Ting-Nan Cho, Kai-Wen Cheng, Tai-Lai Tung
  • Publication number: 20190100554
    Abstract: The present invention provides a method for synthesizing etelcalcetide or salts thereof, comprising the steps of: (a) synthesizing the D-amino acids in the formula (I) sequentially by Fmoc solid-phase synthesis, using a solid support as a starting material in solid phase peptide synthesis and sequentially synthesizing a D-form amino acid of formula (I) by Fmoc chemistry; deprotecting Fmoc group and acetylating the amino group to obtain a sequence A comprising protecting groups (PG) in the side chain of D-Cys and D-Arg; (b) removing the protecting group in the side-chain of D-Cys of the sequence A to form a sequence B; (c) disulfide formation at D-Cys of the sequence B by (PG)-L-Cys-OH to obtain a sequence C; (d) using a cleavage solution to remove the protecting groups of the sequence C to give etelcalcetide as formula (I). The present invention can shorten the steps and time for preparing Etelcalcetide.
    Type: Application
    Filed: September 21, 2018
    Publication date: April 4, 2019
    Inventors: Kwang-Chung LEE, Kuang-Chan HSIEH, Hui-Wen CHENG, Chia-Sui KAO, Ya-Ling HUANG, Wei-Ssu WANG
  • Publication number: 20190101531
    Abstract: The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.
    Type: Application
    Filed: December 3, 2018
    Publication date: April 4, 2019
    Inventors: Chia-Hua Chu, Allen Timothy Chang, Ching-Ray Chen, Yi-Hsien Chang, Yi-Shao Liu, Chun-Ren Cheng, Chun-Wen Cheng
  • Publication number: 20190099721
    Abstract: A method for manufacturing a porous membrane includes: mixing silicon carbide powders and a coagulant to form a first mixture; adding a sintering aid to the first mixture to form a second mixture; compressing the second mixture; and sintering the compressed second mixture. More particularly, the coagulant is in an amount of 1% to 3% by weight of the silicon carbide powders and the sintering aid is in an amount of 10% by weight of the first mixture.
    Type: Application
    Filed: April 20, 2018
    Publication date: April 4, 2019
    Applicant: Tamkang University
    Inventors: Tung-Wen Cheng, Su-En Wu, Yi-Chun Lin, Chung-Kai Chang
  • Publication number: 20190101110
    Abstract: Cryogenic pump apparatuses include nanostructure material to achieve an ultra-high vacuum level. The nanostructure material can be mixed with either an adsorbent material or a fixed glue layer which is utilized to fix the adsorbent material. The nanostructure material's good thermal conductivity and adsorption properties help to lower working temperature and extend regeneration cycle of the cryogenic pumps.
    Type: Application
    Filed: December 3, 2018
    Publication date: April 4, 2019
    Inventors: Surendra Babu Anantharaman, Wen-Cheng Yang, Chung-En Kao, Victor Y. Lu, Wei Chin
  • Publication number: 20190103997
    Abstract: A symbol rate estimation device includes: a power spectrum density (PSD) generating unit, estimating a power of an input signal to generate a PSD; a cut-off frequency index outputting unit, outputting a cut-off frequency index according to the power; and a symbol rate calculating unit, calculating a symbol rate of the input signal according to the cut-off frequency index.
    Type: Application
    Filed: June 1, 2018
    Publication date: April 4, 2019
    Inventors: Ting-Nan CHO, Kai-Wen CHENG, Tai-Lai TUNG
  • Patent number: 10249939
    Abstract: An antenna device for a signal having a frequency within an operation band comprises a ground element, a radiating element short-circuited to the ground element, a positive feed connected to the radiating element, and a ground feed coupled to the ground element by a capacitive element. The capacitive element is a substantially open circuit for signals having a frequency lower than the operation band. The capacitive element is a substantially short circuit for signals having a frequency within or higher than the operation band.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: April 2, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chun Chih Chen, Hung-Wen Cheng
  • Publication number: 20190094581
    Abstract: The present disclosure discloses a liquid crystal display and a manufacturing method thereof. The liquid crystal display includes a first flexible substrate, a display structure, a sealant, and a second flexible substrate. The display structure is positioned on the first flexible substrate. The sealant surrounds a side of the display structure. The second flexible substrate is positioned on the sealant and the display structure. One of the first flexible substrate and the second flexible substrate includes a first flexible material layer and a second flexible material layer. The second flexible material layer is between the first flexible material layer and the display structure and has a portion surrounding a side of the first flexible material layer and overlapping the sealant. An ultraviolet light transmission of the second flexible material layer is higher than an ultraviolet light transmission of the first flexible material layer.
    Type: Application
    Filed: November 30, 2017
    Publication date: March 28, 2019
    Inventors: Wen-Cheng LU, Yen-Yu HUANG, Che-Cheng KUO
  • Publication number: 20190098373
    Abstract: A packet output device includes: a first extracting unit, extracting a plurality of first packets and a plurality of first null packet values corresponding to a first channel; a first buffer, storing the first packets and the first null packet values; a second extracting unit, extracting a plurality of second packets and a plurality of second null packet values corresponding to a second channel; a second buffer, storing the second packets and the second null packet values; and a packet outputting unit, selecting, according to the first null packet values and the second null packet values, one of the first packets and the second packets as an output packet.
    Type: Application
    Filed: July 20, 2018
    Publication date: March 28, 2019
    Inventors: Szu-Hsiang LAI, Kai-Wen CHENG, Yi-Ying LIAO
  • Patent number: 10241546
    Abstract: A portable electronic device includes a first body and a second body. The second body includes a processing unit, and a first touch panel, a second touch panel, a keyboard and at least one detecting module electrically connected to the processing unit, respectively. The keyboard is slidably disposed above the second touch panel, and the detecting module is adapted to detect a position of the keyboard. When the keyboard is located at a first position, the keyboard module covers the second touch panel, and the detecting module transmits a first signal to the processing unit so that the first touch panel is turned on. When the keyboard is located at a second position, the keyboard exposes the second touch panel, and the detecting module transmits a second signal to the processing unit so that the first touch panel is turned off. A touch panel controlling method of the portable electronic device is further provided.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: March 26, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Shun Lu, Ming-Chung Liu, Hsin-Chieh Fang, Yu-Wen Cheng, Yu-Ning Chang
  • Publication number: 20190088426
    Abstract: A key structure includes a membrane switch circuit member, a rubbery elastomer, a housing, a triggering element, a metallic elastic element and a keycap. The keycap is disposed on the triggering element. The rubbery elastomer is disposed on the membrane switch circuit member. The housing is located over the rubbery elastomer. The triggering element is movable relative to the housing. The metallic elastic element is contacted with the triggering element. While the keycap is depressed, the triggering element is moved relative to the housing to press the metallic elastic element. While the metallic elastic element is pushed by the triggering element, the metallic elastic element is swung to collide with the triggering element. Consequently, a click sound is generated.
    Type: Application
    Filed: January 9, 2018
    Publication date: March 21, 2019
    Inventors: SHENG-AN TSAI, LI-JEN CHIEN, HSIANG-WEN CHENG, JIA-JUI YANG, PAI-PING HSU