Abstract: An application circuit for shaping noises and method thereof involve an analog-to-digital converter which converts a first analog signal into an n-bit digital signal for an encoder to generate a p-bit digital signal. Then a control circuit generates a plurality of control signals based on the p-bit digital signal, wherein p is two to the power of n minus one, and n is an integer greater than one. Each of the (2n?1) unit elements with element mismatch in an internal n-bit digital-to-analog converter executes the digital to analog conversion in response to the corresponding control signal, thereby generating a second analog signal, and an adder outputs the first analog signal based on the second analog signal and a third analog signal.

Abstract: An output stage structure includes first and second PMOS transistors and first and second NMOS transistors, wherein the MOS transistors are manufactured with a twin well process. The first PMOS transistor has a source coupled to a supply voltage (VDD), and a gate coupled to the first voltage. The second PMOS transistor has a source coupled to a drain of the first PMOS transistor, a gate coupled to the second voltage, and a drain coupled to an output pad. The first NMOS transistor has a drain coupled to the output pad, and a gate coupled to the third voltage. The second NMOS transistor has a drain coupled to source of the first NMOS transistor, a gate coupled to the fourth voltage, and a source coupled to ground.

Abstract: A sigma-delta modulator is disclosed. The sigma-delta modulator includes a first integrator, a second integrator, an analog-to-digital converter, a digital-to-analog converter (DAC), and a compensating device. The first integrator receives an input signal for generating a first output signal. The second integrator receives the first output signal for generating a second output signal. The ADC converts the second output signal into a digital modulation signal. The DAC converts the digital modulation signal into an analog feedback signal. The analog feedback signal is transmitted to the first integrator and the second integrator. The compensating device is for compensating the analog feedback signal for a time delay caused by a feedback loop from the ADC through the DAC to the first integrator.

Abstract: The present invention relates to a Bluetooth cordless phone, which comprises: a Bluetooth base set that has a main body; and a Bluetooth remote set that may be separately disposed on the main body. Wherein, the main body comprises a compartment, a first opening, a second opening, and a third opening. A printed circuit board (PCB) is disposed inside the compartment, and the PCB further comprises at least a Bluetooth module and a hook that is exposed to the first opening. The Bluetooth remote set comprises at least a main body, a Bluetooth module, a microphone, a speaker, a battery, and a TALK button. When the Bluetooth cordless phone is being used, first the Bluetooth remote set is disposed in the main body of the Bluetooth base set for pairing. Once there is an incoming call, the user can press the TALK button such that the Bluetooth base set can control and cut off the hook in order to receive the incoming call.

Abstract: A receiving antenna for digital television signal reception includes a dielectric substrate, a radiating plate formed on the dielectric substrate with a bar shape, having a first long edge and a second long edge corresponding to the first long edge, a slit formed on the radiating plate with a length at least two times the width of the radiating plate, having a terminal at about the center of the first long edge and a terminal at the second long edge, and separating the radiating plate into a first sub-plate and a second sub-plate, a first feeding point formed on the first sub-plate, a second feeding point formed on the second sub-plate, and a feeding coaxial cable having a core conductor connected to the first feeding point and a grounding conductor connected to the second feeding point.

Abstract: An apparatus includes a first trigger, a second trigger, a pulse generator, and a control unit. The first trigger generates a first trigger signal and a first level signal; the second trigger generates a second trigger signal and a second level signal; the pulse generator generates a digital output signal according to the first and the second level signals; and the control unit outputs the first and the second control voltages according to the digital input signal and the digital output signal.

Abstract: A pulse width modulation (PWM) controlling module, includes: a PWM controller, a load detector, and an adjusting module. The PWM controller generates a PWM signal that is utilized for controlling a supply voltage applied to an electronic system. The load detector, coupled to the PWM controller, detects a load of the electronic system according to the PWM signal and generates a decision value accordingly. The adjusting module, coupled to the PWM controller and the load detector, controls the PWM controller to adjust the PWM signal according to the decision value.

Abstract: A system and method that prioritizes product lots for fabrication and dispatching to manufacturing equipment establishes priorities for dispatching product lots based on a criticality factor and establishes a priority for dispatching product lots to manufacturing equipment based on processing capability and the efficiency of manufacturing equipment. A computer integrated manufacturing system executes a program process that functions as a lot dispatcher and a priority factor calculator. The lot dispatcher is in communication with an order entry system to receive requests for fabrication and with a process information system to receive procedures defining which manufacturing equipment is required. A manufacturing information system provides the lot dispatcher with a criticality factor and a queue level for each piece of manufacturing equipment. Then the current group of pieces of manufacturing equipment is followed with a balanced loading.

Abstract: A lead-free solder reworking method. A solder tank including a nozzle and containing molten lead-free solder is provided. A printed circuit board assembly is placed on the solder tank. The printed circuit board assembly has a printed circuit board and a first electronic member. The printed circuit board has at least one through hole. The first electronic member has at least one first pin soldered in the through hole by lead-free solder. The through hole and first pin are located above the nozzle. A reworking temperature and a reworking time are established. The printed circuit board is heated until the temperature thereof reaches the reworking temperature. The nozzle outputs the molten lead-free solder from the solder tank to the through hole of the printed circuit board until the nozzle operates for the reworking time.

Abstract: A signal processing system for changing a level of an input signal to generate an output signal is disclosed. The signal processing system includes a shifter, a sigma-delta modulator, and a level adjuster. The shifter is utilized for receiving the input signal and for bit-shifting the input signal according to a first predetermined gain to generate a first adjustment signal. The sigma-delta modulator is utilized for generating the output signal according a second adjustment signal and the first adjustment. The level adjuster is utilized for adjusting a level of the output signal according to a second predetermined gain to generate the second adjustment signal.

Abstract: A wave solder apparatus. A conveyer carries a circuit board. A solder tank is disposed under the conveyer and includes a turbulent nozzle and a laminar nozzle separated therefrom by a predetermined distance. A first heater is disposed under the conveyer and adjacent to the solder tank, heating the bottom surface of the circuit board. A second heater is disposed above the conveyer and opposes the first heater, heating the top surface of the circuit board. A third heater is disposed above the conveyer and opposes the turbulent and laminar nozzles of the solder tank, heating the top surface of the circuit board.

Abstract: A wave solder apparatus. A conveyer carries a circuit board. A solder tank is disposed under the conveyer and includes a turbulent nozzle and a laminar nozzle separated therefrom. The turbulent nozzle includes a plurality of turbulent spouting holes. The ratio of the cross-sectional area of the turbulent spouting holes to that of the turbulent nozzle exceeds 0.377. A first heater is disposed under the conveyer and adjacent to the solder tank, heating the bottom surface of the circuit board. A second heater is disposed above the conveyer and opposes the first heater, heating the top surface of the circuit board.

Abstract: A backlight button assemblage includes an opaque button, a light-guiding element, and a light-emitting element. The light-emitting element is disposed under the button and light emitted from the light-emitting element is guided to the front side of the button via the light-guiding element surrounding the button. Light can therefore be evenly distributed over the light-guiding element, and uniformity of light achieved, so that partial dazzling spots are avoided, the quantity of light-emitting elements is reduced, and fabrication costs are saved.

Abstract: A reference voltage generating circuit includes: a first capacitor; a second capacitor; a reference voltage sampling capacitor; a first switch for alternatively coupling the second capacitor to a predetermined voltage to allow the second capacitor to sample the predetermined voltage; a second switch for alternatively coupling the second capacitor to the first capacitor to allow the second capacitor to redistribute charges with the first capacitor in order to generate the reference voltage; and a third switch for alternatively coupling the first capacitor to the reference voltage sampling capacitor to allow the reference voltage sampling capacitor to redistribute charges with the first capacitor in order to output the reference voltage.

Abstract: A power supply with optional types of plugs, composed by one universal body and replaceable plug, is disclosed.

Abstract: A power supply with optional types of plugs, composed by one universal body and replaceable plug, is disclosed. The universal body includes a plurality of blocks, a circular recess, an elastic switch key, and two conductive plates; whereas the plugs could be different specifications of plug with opposite blocks and two conductive plates, the block holes and blocks include a set of error-proof block hole and error-proof block which posses a block slot to hold the fan-shaped block.

Abstract: A positioning device for positioning an integration rod module disposed in an optical path between a light source device and a projection lens within a projection apparatus includes a flexible element having a fixing plate section mounted securely on an inner surface of a casing interconnecting the light source device and the projection lens and enclosing the integration rod module, and a first distal plate section extending integrally from one end of the fixing plate section toward a rod cover mounted on the casing for resiliently urging a holder of the rod module to press against the inner surface of the casing at a position opposite to the flexible element. A stop member is disposed securely on the holder adjacent to the rod cover to facilitate abutment of the first distal plate section of the flexible element against the holder to enhance retention of the rod module within the casing.

Abstract: An adjusting device for a screen has a barrel, a pivotal device and at least one elastic element. The barrel has a frictional device formed on the barrel and an opening longitudinally defined in the barrel. The pivotal device has a shaft inserted into the barrel and a flat axially extending out from the shaft. The at least one elastic element is mounted on the pivotal device and contacts with the frictional device on the barrel. With the friction between the frictional device and the at least one elastic element, the shaft can be positioned in a desired angle.

Abstract: A system and method for semiconductor work-in-process (WIP) dispatch management. Information regarding multiple wafer lots to be processed in a process node is acquired. Which wafer lot requires processing prior to the other wafer lots is determined by analyzing a load of multiple successive process nodes for each wafer lot. The analyzed quantity of the load of the successive process nodes for each wafer lots is determined contingent upon a predetermined observation time period.

Abstract: An apparatus for feature detection of a test object includes at least one light source module and at least one image capturing unit. The light source module provides light to illuminate a test region of the test object, and includes a substrate, a set of light-emitting components, and a light-focusing unit. The light-emitting components are mounted on the substrate for emitting light in parallel directions that are generally transverse to the substrate. The light-focusing unit is to be disposed between the light-emitting components and the test object, receives the light emitted by the light-emitting components, and focuses the light on the test region of the test object. The image capturing unit captures an image of the test object at the test region.