Abstract: A safety release device for Roman blind pull cord is disposed between the control pull cord of the Roman blind and a lower suspension thereof. The safety release device includes a latch body for connecting with the pull cord, a latch ring seat connected with the lower suspension of the Roman blind, and a connection barrel. The latch body can be plugged into and latched with the connection barrel or extracted out of the connection barrel. The latch body has a latch force greater than the weight of the suspended Roman blind. When an abnormal pulling force greater than the latch force between the latch body and the connection barrel is applied to the pull cord in any direction, the latch body will be easily extracted out of the connection barrel to avoid tangle of the pull cord with a kid and ensure safety in use of the Roman blind.

Abstract: A chip package structure including a leadframe, a chip, bonding wires and an encapsulant is provided. The leadframe includes a die pad, leads and an insulating layer. The die pad includes a chip mounting portion and a periphery portion. At the periphery portion, the die pad has a second upper surface lying between a first upper surface and a lower surface of the die pad. Each lead includes a suspending portion and a terminal portion. The suspending portion connects to the terminal portion and extends from the terminal portion towards the die pad. The insulating layer is disposed on the second upper surface of the periphery portion and connects the suspending portions to the die pad. The chip is disposed on the chip mounting portion. The bonding wires electrically connect the chip to the suspending portions. The encapsulant covers the chip, the bonding wires, the insulating layer, and the leadframe.

Abstract: A display includes a scan line, a data line, a pixel circuit, a compensation circuit, a voltage controller, and a data line driver. The data line forms a junction with the scan line. The pixel circuit is disposed at the junction of the scan line and the data line. When the scan line and the data line are driven, the pixel circuit generates a driving current. The compensation circuit generates a comparing signal and a positioning signal based on the driving current. The voltage controller generates a reference voltage that corresponds to the positioning signal with reference to the comparing signal. The data line driver corrects an image signal based on the reference voltage, and drives the data line with the corrected image signal. A compensation circuit for the display is also disclosed.

Abstract: The emergency light of the invention includes a base (1), a lighting module (2), a rechargeable battery (3) and a retractable support (4). The base (1) has a back (11) with a trough (111). The lighting module (2) is installed in the base (1) and electrically connects a lighting device (21) and a circuit board (22). The rechargeable battery (3) is installed in the base (1) and electrically connects the circuit board (22). The retractable support (4) is pivotally connected to the back (11) and received in the trough (111).

Abstract: A manufacturing method of a non-leaded package structure is provided. An upper surface and a lower surface of a metal base plate are patterned so as to form a plurality of first protruding parts and at least a second protruding part on the upper surface and to form a plurality of first recess patterns on the lower surface corresponding to the first protruding parts. A first solder layer is formed in each of the first recess patterns respectively. A chip is mounted on the second protruding part and electrically connected to the first protruding parts with a plurality of bonding wires. An encapsulant is formed on the upper surface. A back etching process is performed on the lower surface to partially remove the metal base plate until the encapsulant is exposed and a lead group including at least a die pad and a plurality of leads is defined.

Abstract: A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate.

Abstract: A multi-color illuminated keyboard at least includes a plurality of keys, an array circuit board, a signal processing unit and a lighting control processor. The array circuit board is located beneath the keys and triggered by depressing one key to generate a corresponding array signal or a mode switching signal. The signal processing unit receives the array signal and converts the array signal into a character signal to be output. The signal processing also can receive the mode switching signal and transmit the mode switching signal to the lighting control processor. The lighting control processor presets multiple driving modes and is electrically connected to the lighting element sets in the illuminated keyboard. The lighting control processor can be triggered by the mode switching signal to change the driving modes of the lighting element sets in the illuminated keyboard.

Abstract: A method for producing a thermoelectric material is provided. A semiconductor material powder is provided. An electroless plating process is preformed to deposit metal nano-particles on the surface of semiconductor material powder. An electrical current activated sintering process is performed to form a thermoelectric material having one and plurality grain boundaries.

Abstract: The present invention relates to a method of modulating complement factor B (CFB) expression in cells, comprising administering an effective amount of tannic acid to the cells. This method can be applied in treating or prophylaxis of the disease, disorder or medical condition associated to complement factor B (CFB) expression.

Abstract: A package-on-package structure includes first and second package structures and bumps. The first package structure includes a carrier, a chip configured on the carrier, a heat spreader, and an encapsulant. The chip is electrically connected to the carrier through conductive wires. The heat spreader includes a support portion located on the chip and connection portions located respectively at two opposite sides of the support portion. The heat spreader has a circuit layer thereon, covers the chip and the conductive wires, and electrically connects the carrier through the circuit layer on the connecting portions. The encapsulant encapsulates the chip, the conductive wires, a portion of the heat spreader, and a portion of the carrier. The bumps are configured on the support portion. The second package structure is configured on the first package structure and is electrically connected to the first package structure through the bumps.

Abstract: A polygonal drum for controlling blind slats is pivotally connected with a control bar in a blind tilt mechanism for adjusting the angle of the blind slats or controlling opening/closing the blind slats. The polygonal drum includes an elongated equilateral polygonal drum body having multiple plane sidewalls with equal area. The plane sidewalls form the periphery of the elongated equilateral polygonal drum body for winding/unwinding a ladder string by equal length. Accordingly, the blind slats can be easily stably operated and adjusted without obstacle. The polygonal drum further includes multiple reinforcement ribs perpendicularly extending from inner faces of the plane sidewalls to integrally connect with a control bar passage. The reinforcement ribs serve to increase the strength of the polygonal drum so as to overcome the problem of deformation of the conventional control drum.

Abstract: A thermoelectric device is provided. The thermoelectric device includes a P-type thermoelectric component, an N-type thermoelectric component, and an electrically conductive layer. Each of the P-type thermoelectric component and the N-type thermoelectric component includes a substrate and a nanowire structure. The conductive layer connects the P-type thermoelectric component set with the N-type thermoelectric component set. The thermoelectric device is adapted for recycling heat generated by the heat source, and for effectively converting the heat into electrical energy.

Abstract: A control method is to generate flickering color-light alteration of an illuminated keyboard which includes a plurality of keys depressed to provide at least one key-in signal, a plurality of backlight units and a control unit. The illuminated keyboard is divided into a plurality of illumination zones according to the backlight units. The control method includes steps of: first, setting multiple different illumination times corresponding to the backlight units through the control unit; next, detecting the key-in signal not being generated over a preset time or detecting the key-in signal matching a working condition to activate the control unit; and sending out a driving signal respectively by the control unit within the illumination time to the corresponding backlight units to generate illumination asynchronously in the illumination zones.

Abstract: A touch panel includes a substrate, scan lines, data output lines, a signal processing unit and touch sensing units. Each touch sensing unit includes a sensing electrode, a reference capacitor, an output circuit and a reset circuit. The sensing electrode is disposed in a breach of the sensing electrode. The reference capacitor, the output circuit and the reset circuit are disposed on the substrate and in the breach. The output circuit, the reset circuit, the reference capacitor and the sensing electrode are electrically coupled to a reference point. The output circuit is configured to output touch signals to the corresponding data output line. The signal processing unit is configured to obtain electric potential of the data output line and perform a corresponding processing step. When the touch sensing unit is out of working, the reference point is reset to a predetermined electric potential.

Abstract: A safety release device for Roman blind pull cord is disposed between the control pull cord of the Roman blind and a lower suspension thereof. The safety release device includes a latch body for connecting with the pull cord, a latch ring seat connected with the lower suspension of the Roman blind, and a connection barrel. The latch body can be plugged into and latched with the connection barrel or extracted out of the connection barrel. The latch body has a latch force greater than the weight of the suspended Roman blind. When an abnormal pulling force greater than the latch force between the latch body and the connection barrel is applied to the pull cord in any direction, the latch body will be easily extracted out of the connection barrel to avoid tangle of the pull cord with a kid and ensure safety in use of the Roman blind.

Abstract: Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of the package stresses. Also provided are fabrication methods for such packages and package components. For instance, the thickness of a die can be controlled such that the stress generated/experienced by the die is minimized. As such, the package stress is managed to suitable levels for incorporation of a low-K Si die and/or a thin package substrate. Further, a thin die can be attached to a heat spreader to increase the rigidity for easier handling during fabrication of the semiconductor die flip chip package.

Abstract: A touch display panel includes a first substrate, a second substrate, a display medium layer and a touch electrode layer. The touch electrode layer has sensing regions, and each sensing region includes sub-sensing regions. The touch electrode layer includes driving electrode series and sensing electrode series. Each driving electrode series has driving electrodes, and each driving electrode has sub-driving pattern electrodes. The sensing electrode series intersect the driving electrode series. Each sensing electrode series has a plurality of sensing electrode, and each sensing electrode has sub-sensing pattern electrodes.

Abstract: A manufacturing method of a non-leaded package structure is provided. An upper surface and a lower surface of a metal base plate are patterned so as to form a plurality of first protruding parts and at least a second protruding part on the upper surface and to form a plurality of first recess patterns on the lower surface corresponding to the first protruding parts. A first solder layer is formed in each of the first recess patterns respectively. A chip is mounted on the second protruding part and electrically connected to the first protruding parts with a plurality of bonding wires. An encapsulant is formed on the upper surface. A back etching process is performed on the lower surface to partially remove the metal base plate until the encapsulant is exposed and a lead group including at least a die pad and a plurality of leads is defined.

Abstract: A blind support for installation of a blind rail. The blind support includes a main support body and an engagement member. The main support body has two horizontal support boards and a vertical support board connected between the horizontal support boards to form a support body with an open side. The blind rail can be placed into the main support body through the open side thereof and supported by the main support body. The engagement member has horizontally extending abutment sections that can be slidably received slide channels of the main support body. Each abutment section has a key body projecting therefrom. The key bodies are engageable in engagement holes formed on the main support body to block the open side thereof and enclose and support the blind rail.