Abstract: A chip package structure including a leadframe, a chip, bonding wires and an encapsulant is provided. The leadframe includes a die pad, leads and an insulating layer. The die pad includes a chip mounting portion and a periphery portion. At the periphery portion, the die pad has a second upper surface lying between a first upper surface and a lower surface of the die pad. Each lead includes a suspending portion and a terminal portion. The suspending portion connects to the terminal portion and extends from the terminal portion towards the die pad. The insulating layer is disposed on the second upper surface of the periphery portion and connects the suspending portions to the die pad. The chip is disposed on the chip mounting portion. The bonding wires electrically connect the chip to the suspending portions. The encapsulant covers the chip, the bonding wires, the insulating layer, and the leadframe.

Abstract: An illuminated keycap for generating soft light is located in a keyboard which includes a command circuit board located beneath the keycap and a lighting unit to project light to the keycap. The keycap includes a press surface, a connecting section extended from the press surface towards the command circuit board and a color display surface extended from the connecting section and parallel to the press surface. The press surface, connecting section and color display surface form a light retaining zone. The press surface has a top surface coated with a first pigment layer. The color display surface has a bottom surface coated with a second pigment layer whose color is different from the first pigment layer. The first and second pigment layers form a mixed color so that light generated by the lighting unit to enter the light retaining zone is emitted softly through the connecting section.

Abstract: A roller curtain fixing bracket assembly includes a left support, a right support, a decoration board and two cover boards covering the left and right supports. A roller curtain device can be installed between the main bodies of the left and right supports. Each of the left and right supports has a plate board main body and several fixing boards protruding from outer edges of the plane board main body. Front edge of each of two fixing boards extending from two sides of the plane board main body is formed with a split. The decoration board has a horizontal panel and a vertical panel. A top end and a certain section of the vertical panel are formed with hook bars inserted and latched in the splits of the left and right supports and assembled therewith. The cover boards serve to conceal the seams between the supports and the decoration board.

Abstract: A sensor chip protective image sensor packaging method includes the steps of a) installing an image sensor chip in a circuit substrate and then covering a passivation layer on a sensing zone of the image sensor chip, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, d) removing the passivation layer, and e) mounting a light transmissive cover in the encapsulation over the sensing zone of the image sensor chip. Thus, the passivation layer protects the sensing zone of the image sensor chip against contamination and damage prior before having been protected by the cover, and therefore, this image sensor chip packaging method has high-yield performance.

Abstract: A image sensor packaging method includes the steps of: a) installing an image sensor chip in a circuit substrate and then covering a light transmissive cover on the image sensor chip over a sensing zone of the image sensor chip and then covering a passivation layer on the light transmissive cover, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, and d) removing the passivation layer. Thus, the light transmissive cover and the passivation layer protect the sensing zone of the image sensor chip and the light transmissive cover against contamination and damage, and therefore, this image sensor chip packaging method has high-yield performance.

Abstract: An illuminated keyboard equipped with light emitting keycaps includes a keyboard portion and a light emitting portion. The keyboard portion includes at least one circuit board contained a plurality of keyboard command portions and a plurality of press members located above the circuit board corresponding to the keyboard command portions that are depressible to trigger the keyboard command portions. Each press member has a press surface, a holding surface and a coupling surface interposed between the press surface and holding surface. The press surface and circuit board form a light projection zone therebetween. The light emitting portion includes a lighting unit to provide light to the light projection zone and a light mask plate. The light mask plate has an aperture to expose the press surface and a light mask portion overlapped over the holding surface.

Abstract: A locally illuminated keycap is located in a keyboard. The keyboard includes a lighting unit to project light to the keycap. The keycap includes at least one top edge to form an opaque press surface, at least one bottom edge located below the press surface to form a light incident surface to receive light, and at least one transparent light emitting surface connecting to the top edge and bottom edge to emit light. The press surface and light emitting surface form an inclined angle between them greater than 90 degrees. The press surface, light incident surface and light emitting surface jointly form a light retaining zone. Light generated by the lighting unit projects to the light incident surface and enters the light retaining zone, and is masked by the opaque press surface to emit locally through the transparent light emitting surface.

Abstract: A simple assembly thin keyboard includes at least one circuit board and a plurality of keycap assembly located on the circuit board and movable vertically to press the circuit board to generate keyboard command signals. The keycap assembly includes a plurality of first keycaps and second keycaps. Each first keycap abuts at least one second keycaps. The abutting first keycaps and second keycaps are interposed by a plurality of connection arms. Each connection arm includes at least one first connecting section connecting to the first keycap, at least one second connecting section connecting to the second keycap and an elastic section which bridges the first connecting section and second connecting section and contains at least one stress reversion spot. Through the connection arm bridged the first and second keycaps to substitute the conventional driven mechanism total thickness of the keyboard can be reduced, and assembly also is simpler.

Abstract: A thin keyboard includes a circuit board, a plurality of keycaps and a frame. The circuit board has a plurality of command portions to receive contact to generate command signals and a plurality of elastic support members located on the command portions. Each keycap is corresponding to one elastic support member and has at least one depressible press surface and a holding surface formed at an elevation difference interval with the press surface. The transverse cross section of the holding surface is greater than the transverse cross section of the press surface. The frame is positioned corresponding to the keycaps and has a plurality of installation portions corresponding to the keycaps, and a plurality of ribs abutting the circumference of the installation portions and overlapped over the holding surface of each keycap. Each installation portion has a carved out area which is smaller than the holding surface.

Abstract: A displaying method used in a portable electronic device is provided. The portable electronic device includes a display panel having a backlight module. The displaying method includes the following steps: turning off the backlight module when a rotation event occurs; waiting for a time period; turning on the backlight module.

Abstract: A waterproof piezoelectric ceramic speaker comprises a ceramic composite and a vibration membrane. The ceramic composite includes a ceramic plate and a driving electrode assembly arranged on the ceramic plate and supplying a driving voltage to the ceramic plate to generate vibration for the ceramic plate. The vibration membrane includes a first vibration layer and a second vibration layer respectively adhered to two opposite surfaces of the ceramic composite. The first vibration layer and the second vibration layer respectively have a resonance member adhered to the ceramic plate and resonating with the ceramic plate synchronously, a waterproof member connecting with the resonance member to seal the driving electrode assembly, and a bonding member extending from a perimeter of the resonance member to seal the resonance member.

Abstract: A method of manufacturing a semiconductor package structure is provided. A heat-conductive block is adhered to a portion of a second surface of a conductive substrate via a first adhesive layer. An opening is formed by performing a half-etching process on a first surface of the conductive substrate. The remaining conductive substrate is patterned to form leads and expose a portion of the heat-conductive block. Each lead has a first portion and a second portion. A thickness of the first portion is greater than a thickness of the second portion. A first lower surface of the first portion and a second lower surface of the second portion are coplanar. A chip is disposed on the exposed portion of the heat-conductive block and electrically connected to the second portions of the leads. A first bottom surface of the heat-conductive block and a second bottom surface of a molding compound are coplanar.

Abstract: A touch panel includes a substrate, scan lines, data output lines, a signal processing unit and touch sensing units. Each touch sensing unit includes a sensing electrode, a reference capacitor, an output circuit and a reset circuit. The sensing electrode is disposed in a breach of the sensing electrode. The reference capacitor, the output circuit and the reset circuit are disposed on the substrate and in the breach. The output circuit, the reset circuit, the reference capacitor and the sensing electrode are electrically coupled to a reference point. The output circuit is configured to output touch signals to the corresponding data output line. The signal processing unit is configured to obtain electric potential of the data output line and perform a corresponding processing step. When the touch sensing unit is out of working, the reference point is reset to a predetermined electric potential.

Abstract: A sensing display device including a display panel and a sensing element is provided. The display panel includes at least a plurality of pixel units, and the pixel units are arranged along a primary direction. The sensing element is disposed on the pixel units and includes at least a plurality of sensor units. Each of the sensor units includes a mesh-pattern electrode, and the mesh-pattern electrode includes a plurality of first traces having conductivity. At least one of the first traces is substantially extended along a first direction, wherein a first angle is formed between the first direction and the primary direction, and the first angle is an acute angle.

Abstract: A thin illuminated keyboard comprises a plurality of keys, a carrying unit and at least one light emission board. The carrying unit includes a baseboard to hold the keys and at least one light guide element located between the keys and baseboard. The light guide element includes at least one light guide port. The baseboard includes at least one installation port that communicates and incorporates with the light guide port to form at least one installation space. The light emission board is located on one side of the baseboard opposite to the keys and has at least one light source held in the installation space to emit light towards the light guide port, and the light is transmitted via the light guide element to project to the corresponding keys for illumination.

Abstract: A chip packaging method includes the steps of: attaching a first tape to a metal plate; patterning the metal plate to form a plurality of terminal pads and a plurality of leads, wherein the plurality of terminal pads and the plurality of leads are disposed on two opposite sides of a central void region, the plurality of terminal pads on each side are arranged in at least two rows spaced apart from each other in the direction away from the central void region, and each lead has a first end portion extending to the central void region and a second end portion connecting to a corresponding terminal pad; attaching a second tape having openings to the plurality of terminal pads, wherein each of the openings exposes the central void region and the first end portions of the leads; removing the first tape; attaching a chip to the plurality of terminal pads and the plurality of leads, wherein a plurality of bond pads on the chip are corresponding to the central void region; and connecting the bond pads to the first en

Abstract: An illuminated keyboard with a light transmission channel contains a substrate used to hold a plurality of press units, a circuit board disposed on the substrate and triggered by the press units, and a light shielding unit disposed on the circuit board and having a permeable area and a light impermeable area. The light impermeable area of the light shielding unit and a non-transparent surface of the circuit board form a light transmission channel between the substrate and the plurality of press units. The illuminated keyboard also contains at least one illuminating unit to emit light into the light transmission channel, thus the light can be projected to the plurality of press units through the light permeable area of the light shielding unit.