Abstract: A method and an apparatus for desorption and a dehumidifier are provided in the present invention, in which an electrical potential is applied to electrodes disposed on both ends of an absorbing material so as to desorb the substances absorbed within the absorbing material whereby the absorbing material is capable of being maintained for cycling the absorbing operation. By means of the method and the apparatus of the present invention, the desorbing efficiency can be enhanced and the energy consumption can be reduced during desorption.

Abstract: A dispensing control device for an icemaker includes a dispensing structure and a control structure assembled with the dispensing structure. The dispensing structure includes at least a first dispensing portion and a second dispensing portion for dispensing at least two kinds of materials, wherein the first and the second dispensing portion and the dispensing structure form a dispensing area in which a first position and a second position are defined respectively.

Abstract: A method for producing a thermoelectric material is provided. A semiconductor material powder is provided. An electroless plating process is preformed to deposit metal nano-particles on the surface of semiconductor material powder. An electrical current activated sintering process is performed to form a thermoelectric material having one and plurality grain boundaries.

Abstract: A shielding device for serving as an electromagnetic shield includes a shield body having a top piece and a plurality of sidewall pieces, and an electromagnetic band-gap (EBG) structure disposed on the top piece of the shield body.

Abstract: A display includes a scan line, a data line, a pixel circuit, a compensation circuit, a voltage controller, and a data line driver. The data line forms a junction with the scan line. The pixel circuit is disposed at the junction of the scan line and the data line. When the scan line and the data line are driven, the pixel circuit generates a driving current. The compensation circuit generates a comparing signal and a positioning signal based on the driving current. The voltage controller generates a reference voltage that corresponds to the positioning signal with reference to the comparing signal. The data line driver corrects an image signal based on the reference voltage, and drives the data line with the corrected image signal. A compensation circuit for the display is also disclosed.

Abstract: A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate.

Abstract: The present invention relates to a quad flat no lead (QFN) package is provided. In the invention, a plurality of first pads are disposed outside an extension area of a conductive circuit layer, and a plurality of second pads are disposed inside a die bonding area of the conductive circuit layer, wherein the extension area surrounds the die bonding area. First ends of a plurality of traces are connected to the second pads, and second ends of the traces are located in the extension area. An insulating layer fills at least the die bonding area and the extension area, and exposes top surfaces and bottom surfaces of the second pads. A chip is mounted at the die bonding area and a plurality of wires electrically connect the chip to the first pads and the second ends of the traces respectively. An encapsulation material is used to cover the conductive circuit layer, the chip and the wires.

Abstract: A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.

Abstract: A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.

Abstract: A portable electronic apparatus including a host and a display unit pivotally connected to the host is provided. The display unit includes a panel module, a first plate having a plate body and a plurality of positioning structures provided on the plate body, and a second plate. The panel module is locked at the first plate by the positioning structures and tightly fits with the first plate. The second plate is connected to the first plate, and the panel module is held between the first plate and the second plate.

Abstract: A ladder drum for adjusting and regulating the angular orientation and closure of horizontal slats of a venetian blind, of the type incorporating ladder cords or tape ladders, having a polygonal profiled structure comprising a series of planar sidewalls defining a substantially hollow interior. The number of sidewalls defining the polygonal structure is greater than four sidewalls, and less than or equal to twelve sidewalls, with each adjacent plane sidewall having an internal angular orientation in the range of 90° to 150°. To enhance the uniform closure of the slats of a horizontal blind, the polygonal ladder drum is more preferably in the form of an uneven hexagon that is formed from injection molded plastics. The opposing top and bottom sidewalls are greater in dimension than the mediate sidewalls, and have attachment means to insert various widths of ladder tape. The mediate sidewalls have at least two opposing access slots to insert and retain ladder cords in a counter balanced relation.

Abstract: A ladder drum for adjusting and regulating the angular orientation and closure of horizontal slats of a venetian blind, of the type incorporating ladder cords or tape ladders, having a polygonal profiled structure comprising a series of planar sidewalls defining a substantially hollow interior. The number of sidewalls defining the polygonal structure is greater than four sidewalls, and less than or equal to twelve sidewalls, with each adjacent plane sidewall having an internal angular orientation in the range of 90° to 150°. To enhance the uniform closure of the slats of a horizontal blind, the polygonal ladder drum is more preferably in the form of an uneven hexagon that is formed from injection molded plastics. The opposing top and bottom sidewalls are greater in dimension than the mediate sidewalls, and have attachment means to insert various widths of ladder tape. The mediate sidewalls have at least two opposing access slots to insert and retain ladder cords in a counter balanced relation.

Abstract: A chip package including a base, a chip, a molding compound and a plurality of outer terminals is provided. The base is essentially consisted of a patterned circuit layer having a first surface and a second surface opposite to each other and a solder mask disposed on the second surface, wherein the solder mask has a plurality of first openings by which part of the patterned circuit layer is exposed. The chip is disposed on the first surface and is electrically connected to the patterned circuit layer. The molding compound covers the pattern circuit layer and fixes the chip onto the patterned circuit layer. The outer terminals are disposed in the first openings and electrically connected to the patterned circuit layer.

Abstract: A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.

Abstract: A computer system with dual hosts is provided. The computer system includes a body, a first host, a second host and multiple peripheral devices. The first host and the second host are configured in the body, and the peripheral devices are coupled to the first host and the second host. When the first host starts, the peripheral devices are controlled by the first host. When the second host starts and the first host does not start, the peripheral devices are controlled by the second host.

Abstract: A chip stacked package structure and applications are provided. The chip-stacked package structure includes a main substrate, a baseboard substrate, and a molding compound. The main substrate has a substrate and a first chip. The substrate has a first surface and a second surface opposite to the first surface. The first chip is disposed on the first surface and electrically connected to the substrate via first bumps. The baseboard substrate has a third surface and a fourth surface faced towards the substrate. The baseboard substrate includes a core layer having a plurality of first through holes and a first accommodation space in which the first chip is received. The second chip is disposed on the third surface of the baseboard substrate. The molding compound is used to encapsulate the main substrate, and the baseboard substrate.

Abstract: A wafer treating method for making adhesive dies is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform a thermo-bonding adhesive film having B-stage property which has a glass transition temperature not less than 40° C. for handling without adhesive under room temperature. After positioning the wafer, the wafer is singulated to form a plurality of dies with adhesive for die-to-die stacking, die-to-substrate or die-to-leadframe attaching.