Abstract: A physiological detection device includes system including a first array PPG detector, a second array PPG detector, a display and a processing unit. The first array PPG detector is configured to generate a plurality of first PPG signals. The second array PPG detector is configured to generate a plurality of second PPG signals. The display is configured to show a detected result of the physiological detection system. The processing unit is configured to convert the plurality of first PPG signals and the plurality of second PPG signals to a first 3D energy distribution and a second 3D energy distribution, respectively, and control the display to show an alert message.

Abstract: Disclosed is a modified carbonaceous material, which includes hexagonal carbon networks in a layered stacking structure and acidic functional groups bonded to the hexagonal carbon networks and mainly existing at edges of the layered carbonaceous structure. Accordingly, the close proximity of acid moiety at the edges can resemble the center of hydrolysis enzymes, resulting in enhancement of hydrolytic efficiency. Additionally, the acid-functionalized carbonaceous material can also be applied in the capture and storage of carbon dioxide due to its unexpectedly higher capacity for CO2 molecular.

Abstract: A peak cover for lift cord and tilt ladder includes a limiter having an arcuate cover. A fixed engagement plate is disposed at an upper end of a left side of the arcuate cover. Two stop walls are disposed on two sides of a lower end of the left side of the arcuate cover. Two grooves are formed inside the stop walls. Two annular ribs of a cord winding reel are engaged in the grooves, whereby the cord winding reel is freely rotatable. A movable engagement plate is disposed at an upper end of a right side of the arcuate cover. Four raised columns are formed on an upper end of the arcuate cover. The arcuate cover of the limiter is capped on the cord winding reel. The fixed engagement plate and the movable engagement plate of the arcuate cover are engaged with the annular ribs on two sides of the cord winding reel.

Abstract: A semiconductor device includes a substrate and a gate structure. The gate structure is disposed on the substrate, and the gate structure includes a titanium nitride barrier layer a titanium aluminide layer, and a middle layer. The titanium aluminide layer is disposed on the titanium nitride barrier layer, and the middle layer is disposed between the titanium aluminide layer and the titanium nitride barrier layer. The middle layer is directly connected with the titanium aluminide layer and the titanium nitride barrier layer, and the middle layer includes titanium and nitrogen. A concentration of nitrogen in the middle layer is gradually decreased in a vertical direction towards an interface between the middle layer and the titanium aluminide layer.

Abstract: An apparatus for ensuring evenness and smoothness in the operations of a roller shutter or window blind is provided. The apparatus synchronizes the torque applied across the length of the roller. The apparatus also enhances the rigidity of the roller tube without significantly increasing the cost and the weight of the roller shutter. The apparatus may include an outer tube, a rotation power source, an inner shaft, and a rotation synchronizer. The inner shaft is disposed within the outer tube. The rotation synchronizer is installed at the inner shaft to rotationally couple the inner shaft with the outer tube. A rotation power source is installed at one end of the outer tube or the inner shaft to provide power to rotate the inner shaft and the outer tube. The outer tube may be for winding the screen of a roller shutter, or a lifting or tilting cord of a horizontal blind.

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

Abstract: A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.

Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

Abstract: A video transmission system is disclosed. The video transmission system comprises a multi-drop bus, a first source driving chip, a second source driving chip and a timing controller. The first source driving chip comprises a first source driving circuit and a first terminal circuit. The first terminal circuit is coupled to the multi-drop bus and the first source driving circuit for providing a first terminal resistor. The second source driving chip comprises a second source driving circuit and a second terminal circuit. The second terminal circuit is coupled to the multi-drop bus and the second source driving circuit for providing a second terminal resistor. The timing controller is coupled to the first source driving chip and the second source driving chip via the multi-drop bus.

Abstract: A safety cord tilter, in which two cords of the cord tilter for controlling opening or closing of the blind slats are exposed outside the headrail by a length set within a safety length range. The rear ends of the two cords are respectively connected with a first pull rod and a second pull rod for pulling the cords. When the first and second pull rods are used to control opening or closing of the blind slats, the first pull rod or the second pull rod reaches the blind rail at the top end, whereby the allowable exposed lengths of the pulled-out cords will not exceed the safety range so as to shorten the exposed length of the cords. This prevents a child from playing with the cords and twisting the cords around the neck and achieves safety effect.

Abstract: A high electron mobility transistor device including a channel layer, a first barrier layer, a gate structure, and a spacer is provided. The first barrier layer is disposed on the channel layer. The gate structure is disposed on the first barrier layer. The gate structure includes a first P-type gallium nitride layer, a second barrier layer, and a second P-type gallium nitride layer. The first P-type gallium nitride layer is disposed on the first barrier layer. The second barrier layer is disposed on the first P-type gallium nitride layer. The second P-type gallium nitride layer is disposed on the second barrier layer. A width of the second P-type gallium nitride layer is smaller than a width of the first P-type gallium nitride layer. The spacer is disposed on a sidewall of the second P-type gallium nitride layer.

Abstract: One wireless communication device includes a transmitter circuit and a control circuit, wherein the control circuit sets a request to send (RTS) frame, and controls the transmitter circuit to transmit the RTS frame via at least one channel excluding a preamble punctured channel. Another wireless communication device includes a transmitter circuit and a control circuit, wherein the control circuit sets an RTS frame, and controls the transmitter circuit to transmit the RTS frame via a plurality of channels including the preamble punctured channel.

Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes a fan-out package and a memory package stacked on the fan-out package. The fan-out package includes a first redistribution layer (RDL) structure, a first logic die, through via (TV) interconnects, and first conductive structures. The first logic die and the first conductive structures are in contact with the first RDL structure. The TV interconnects are electrically connected to the first RDL structure. The memory package includes a first substrate, a memory die, and second conductive structures. The memory die and the second conductive structures are disposed on the first substrate. The memory die is electrically connected to the first logic die using the TV interconnects and the first RDL structure. The semiconductor package assembly further includes a second substrate electrically connected to the first logic die using the first conductive structures.

Abstract: One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.

Abstract: Various techniques pertaining to a special dual clear-to-send (CTS) mode for improvement in collision avoidance in wireless communications are described. A first station (STA) transmits a request-to-send (RTS) and, in response, receives a first CTS from a second STA. The first STA waits to receive a second CTS from the second STA before transmitting data to the second STA responsive to the first CTS being of a first type and the second CTS being of a second type different from the first type. The first STA then transmits the data to the second STA upon passage of a waiting period.

Abstract: One wireless communication method includes: receiving a request action frame; and in response to the request action frame, generating and sending an acknowledgement (ACK) control frame that is configured to serve as a response action frame for the request action frame, wherein the response action frame is not solicited by the request action frame. Another wireless communication method includes: receiving a request action frame; and in response to the request action frame, generating and sending an acknowledgement (ACK) control frame and a time-constrained response action frame following the ACK control frame, wherein the time-constrained response action frame is solicited by the request action frame.