Abstract: An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer. The interface layer includes an antenna layer, and an insulating layer between the antenna layer and the ground reflector layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge.

Abstract: A video transmission system is disclosed. The video transmission system comprises a multi-drop bus, a first source driving chip, a second source driving chip and a timing controller. The first source driving chip comprises a first source driving circuit and a first terminal circuit. The first terminal circuit is coupled to the multi-drop bus and the first source driving circuit for providing a first terminal resistor. The second source driving chip comprises a second source driving circuit and a second terminal circuit. The second terminal circuit is coupled to the multi-drop bus and the second source driving circuit for providing a second terminal resistor. The timing controller is coupled to the first source driving chip and the second source driving chip via the multi-drop bus.

Abstract: An over-the-air (OTA) wireless test system includes a container, a machine plate disposed on the container, a supporter disposed on the machine plate, a load board disposed on the supporter, a socket disposed on the load board, a device under test (DUT) installed in the socket, and a wave-guiding feature in the socket and the load board configured to pass and guide electromagnetic waves to and/or from an antenna structure of the DUT. The wave-guiding feature comprises a wave-guiding channel in the socket defined by a plurality of pogo pins surrounding the antenna structure of the DUT. The wave-guiding feature may further comprise a radiation passage in the load board defined by rows of via fence extending through an entire thickness of the load board.

Abstract: A timing calibration system is applicable to a memory read system which includes a memory, a delay unit and a data read circuit. The memory outputs a data signal and a data latch signal. The delay unit delays the data latch signal by a delay value, to generate a read signal. The data read circuit reads the data signal according to the read signal. In the timing calibration system, a logic computation unit generates first and second charging signals according to the data signal and the read signal, and a capacitor-resistor charging unit performs charging operations according to the first and second charging signals, so as to generate first and second capacitor voltages, and a comparing unit can compare the first and second capacitor voltages, to generate a comparison result, thereby adjusting the delay value of the delay unit according to the comparison result.

Abstract: A timing calibration system is applicable to a memory read system which includes a memory, a delay unit and a data read circuit. The memory outputs a data signal and a data latch signal. The delay unit delays the data latch signal by a delay value, to generate a read signal. The data read circuit reads the data signal according to the read signal. In the timing calibration system, a logic computation unit generates first and second charging signals according to the data signal and the read signal, and a capacitor-resistor charging unit performs charging operations according to the first and second charging signals, so as to generate first and second capacitor voltages, and a comparing unit can compare the first and second capacitor voltages, to generate a comparison result, thereby adjusting the delay value of the delay unit according to the comparison result.

Abstract: A video transmission system is disclosed. The video transmission system comprises a multi-drop bus, a first source driving chip, a second source driving chip and a timing controller. The first source driving chip comprises a first source driving circuit and a first terminal circuit. The first terminal circuit is coupled to the multi-drop bus and the first source driving circuit for providing a first terminal resistor. The second source driving chip comprises a second source driving circuit and a second terminal circuit. The second terminal circuit is coupled to the multi-drop bus and the second source driving circuit for providing a second terminal resistor. The timing controller is coupled to the first source driving chip and the second source driving chip via the multi-drop bus.

Abstract: A Radio Frequency (RF) device may include a plurality of antennas and one or more conductive traces configured to trap a portion of energy transmitted from at least one of the plurality of antennas. The one or more conductive traces are sized and positioned such that undesired coupling between the plurality of antennas may be suppressed while maintaining performance parameters of at least one of the plurality of antennas. The plurality of antennas and the one or more conductive traces may be formed using a redistribution layer coupled to a chip embedded in a molding layer.

Abstract: A wireless charging device with a heat dissipation function is provided. The wireless charging device includes a case, a wireless charging assembly and a working fluid. The case includes an accommodation space. The wireless charging assembly is disposed in the accommodation space. The wireless charging assembly includes a circuit board, a coil coupled to the circuit board and a connector coupled to the circuit board. The working fluid is disposed in the accommodation space in the case. The circuit board and the coil of the wireless charging assembly are immersed in the working fluid.

Abstract: A touch-controlled assembly adapted to an electronic device is provided. The electronic device has a front casing, a rear casing and a display surface, where the display surface is located on the front casing. The touch-controlled assembly includes a circuit board and at least one touch key. The circuit board is disposed between the front casing and the rear casing. The circuit board has at least one pad, which contacts one surface of the rear casing. The at least one touch key is disposed on another surface of the rear casing for corresponding to the at least one pad, where an orthogonal projection of the at least one touch key on the at least on pad is partially overlapped with the at least one pad.

Abstract: A blind cord guide seat includes a connection seat fixed under a blind rail and a cord restriction seat connected under the connection seat. The cord restriction seat includes a fixing section and a latch section. An outer face of each of the fixing section and the latch section is formed with a belt guide channel. The top end of the fixing section is formed with threaded holes for connecting with the connection seat by screws. When assembled with a cord winding device, an external force is applied to the latch section to outward bias the latch section to provide an opening for placing the cord winding device through the opening into the cord restriction seat. An iron-made hook bracket and a latch body are securely disposed at the upper end of the latch section for securely latching the latch section with the connection seat.

Abstract: The present disclosure provides a semiconductor package including a bottom package having a substrate, a radio-frequency (RF) die and a system-on-a-chip (SoC) die arranged on the substrate in a side-by-side manner, a molding compound covering the RF die and the SoC die, and an interposer over the molding compound. Connection elements and a column of signal interference shielding elements are disposed on the substrate. The connection elements surround the SoC die. The column of signal interference shielding elements is interposed between the RF die and the SoC die. A top package is mounted on the interposer.

Abstract: A semiconductor device includes a first layer structure, a first layer structure, a second layer structure and a passive electronic component. The second layer structure is disposed below the first layer structure and coupled to a ground. The conductive structure is coupled to the first layer structure. The conductive structure is installed vertically between the first layer structure and the second layer structure, and is coupled to a first pad of the second layer structure. The passive electronic component comprises a first terminal coupled to the first pad of the second layer structure and a second terminal coupled to a second pad of the second layer structure. The conductive structure and the passive electronic component are connected in series between the first layer structure and the ground to form a conductive path for conducting at least one electromagnetic interference signal to the ground.

Abstract: A semiconductor device includes a first layer structure, a first layer structure, a second layer structure and a passive electronic component. The second layer structure is disposed below the first layer structure and coupled to a ground. The conductive structure is coupled to the first layer structure. The conductive structure is installed vertically between the first layer structure and the second layer structure, and is coupled to a first pad of the second layer structure. The passive electronic component comprises a first terminal coupled to the first pad of the second layer structure and a second terminal coupled to a second pad of the second layer structure. The conductive structure and the passive electronic component are connected in series between the first layer structure and the ground to form a conductive path for conducting at least one electromagnetic interference signal to the ground.

Abstract: A microelectronic assembly includes a substrate and a first microelectronic component mounted on the substrate. The first microelectronic component includes a digital/analog IP block and a RF IP block. A shielding case is mounted on the substrate. The shielding case includes a plurality of sidewalls, one intermediate wall, and a lid. A thermal interface material (TIM) layer is situated between the lid and the first microelectronic component. A noise suppressing structure is interposed between the TIM layer and the first microelectronic component.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a package substrate. An integrated circuit (IC) die having a radio frequency (RF) circuit and a memory die are stacked over the package substrate. The memory die entirely covers a first surface portion of the package substrate to define a second surface portion of the package substrate exposed from the memory die, and the IC die partially covers the first surface portion and the second surface portion of the package substrate. The RF circuit includes a first sensitive device region corresponding to the second surface portion of the package substrate and a second sensitive device region corresponding to the first surface portion of the package substrate and offsetting a memory input/output (I/O) electrical path of the memory die, as viewed from a top-view perspective.

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.

Abstract: A blind decorative board fixing support assembly includes a decorative board main body, a left-side cover board, a right-side cover board, a connection seat and a hanging bracket hanging on and latching with a blind frame rail. Protruding insertion blocks are disposed on the inner face of the decorative board main body. The inner end faces of the left-side cover board and the right-side cover board are formed with insertion frames for inserting and connecting with the insertion blocks. The connection seat is securely disposed on the insertion blocks and the hanging bracket is securely hanged on and connected with the connection seat, whereby the decorative board main body, the left-side cover board and the right-side cover board can be hanged on and latched with the blind frame rail to seal and cover the blind accessories so as to achieve a beautiful appearance and fast installation effect.

Abstract: A dustproofing device for use with a linear module includes a dustproofing band disposed around a first pulley pivotally connected to a first end unit and a second pulley pivotally connected to a second end unit. Two ends of the dustproofing band fixedly connect to a fixing platform. The fixing platform fixedly connects to a moving platform of the linear module. A top lid is fixedly disposed on the first end unit and the second end unit and covers the fixing platform, so as for the dustproofing device to be mounted on the linear module. Since the linear module is covered with the first end unit, a first lateral lid, the second end unit and the top lid, not only is the linear module rendered dustproof, but it also takes less time than before to mount the dustproofing device in place.

Abstract: A horizontal blind structure includes a blind rail, more than one slat control unit and more than one cord winding unit. The slat control unit includes a fixing seat and a control polygonal drum received in the fixing seat and a cord restriction seat. The control polygonal drum is connected with a ladder belt. The ladder belt extends along the cord restriction seat to connect with the slats so as to control the slats to rotate into a horizontal state or a vertical state for shading sunlight. The cord winding unit includes a cord winding tube passing through the cord restriction seat and a movable conic tube movably fitted on the cord winding tube. A pull cord is wound on the movable conic tube. Multiple guide wheels are disposed at lower end of the cord restriction seat for guiding the pull cord to be positioned at the center of the slats, whereby the slats can be tidily overlapped and the pull cord is prevented from tangling so as to enhance the sunshade effect.