Abstract: A blind cord guide seat includes a connection seat fixed under a blind rail and a cord restriction seat connected under the connection seat. The cord restriction seat includes a fixing section and a latch section. An outer face of each of the fixing section and the latch section is formed with a belt guide channel. The top end of the fixing section is formed with threaded holes for connecting with the connection seat by screws. When assembled with a cord winding device, an external force is applied to the latch section to outward bias the latch section to provide an opening for placing the cord winding device through the opening into the cord restriction seat. An iron-made hook bracket and a latch body are securely disposed at the upper end of the latch section for securely latching the latch section with the connection seat.

Abstract: The present disclosure provides a semiconductor package including a bottom package having a substrate, a radio-frequency (RF) die and a system-on-a-chip (SoC) die arranged on the substrate in a side-by-side manner, a molding compound covering the RF die and the SoC die, and an interposer over the molding compound. Connection elements and a column of signal interference shielding elements are disposed on the substrate. The connection elements surround the SoC die. The column of signal interference shielding elements is interposed between the RF die and the SoC die. A top package is mounted on the interposer.

Abstract: A semiconductor device includes a first layer structure, a first layer structure, a second layer structure and a passive electronic component. The second layer structure is disposed below the first layer structure and coupled to a ground. The conductive structure is coupled to the first layer structure. The conductive structure is installed vertically between the first layer structure and the second layer structure, and is coupled to a first pad of the second layer structure. The passive electronic component comprises a first terminal coupled to the first pad of the second layer structure and a second terminal coupled to a second pad of the second layer structure. The conductive structure and the passive electronic component are connected in series between the first layer structure and the ground to form a conductive path for conducting at least one electromagnetic interference signal to the ground.

Abstract: A semiconductor device includes a first layer structure, a first layer structure, a second layer structure and a passive electronic component. The second layer structure is disposed below the first layer structure and coupled to a ground. The conductive structure is coupled to the first layer structure. The conductive structure is installed vertically between the first layer structure and the second layer structure, and is coupled to a first pad of the second layer structure. The passive electronic component comprises a first terminal coupled to the first pad of the second layer structure and a second terminal coupled to a second pad of the second layer structure. The conductive structure and the passive electronic component are connected in series between the first layer structure and the ground to form a conductive path for conducting at least one electromagnetic interference signal to the ground.

Abstract: A microelectronic assembly includes a substrate and a first microelectronic component mounted on the substrate. The first microelectronic component includes a digital/analog IP block and a RF IP block. A shielding case is mounted on the substrate. The shielding case includes a plurality of sidewalls, one intermediate wall, and a lid. A thermal interface material (TIM) layer is situated between the lid and the first microelectronic component. A noise suppressing structure is interposed between the TIM layer and the first microelectronic component.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a package substrate. An integrated circuit (IC) die having a radio frequency (RF) circuit and a memory die are stacked over the package substrate. The memory die entirely covers a first surface portion of the package substrate to define a second surface portion of the package substrate exposed from the memory die, and the IC die partially covers the first surface portion and the second surface portion of the package substrate. The RF circuit includes a first sensitive device region corresponding to the second surface portion of the package substrate and a second sensitive device region corresponding to the first surface portion of the package substrate and offsetting a memory input/output (I/O) electrical path of the memory die, as viewed from a top-view perspective.

Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.

Abstract: A blind decorative board fixing support assembly includes a decorative board main body, a left-side cover board, a right-side cover board, a connection seat and a hanging bracket hanging on and latching with a blind frame rail. Protruding insertion blocks are disposed on the inner face of the decorative board main body. The inner end faces of the left-side cover board and the right-side cover board are formed with insertion frames for inserting and connecting with the insertion blocks. The connection seat is securely disposed on the insertion blocks and the hanging bracket is securely hanged on and connected with the connection seat, whereby the decorative board main body, the left-side cover board and the right-side cover board can be hanged on and latched with the blind frame rail to seal and cover the blind accessories so as to achieve a beautiful appearance and fast installation effect.

Abstract: A dustproofing device for use with a linear module includes a dustproofing band disposed around a first pulley pivotally connected to a first end unit and a second pulley pivotally connected to a second end unit. Two ends of the dustproofing band fixedly connect to a fixing platform. The fixing platform fixedly connects to a moving platform of the linear module. A top lid is fixedly disposed on the first end unit and the second end unit and covers the fixing platform, so as for the dustproofing device to be mounted on the linear module. Since the linear module is covered with the first end unit, a first lateral lid, the second end unit and the top lid, not only is the linear module rendered dustproof, but it also takes less time than before to mount the dustproofing device in place.

Abstract: A horizontal blind structure includes a blind rail, more than one slat control unit and more than one cord winding unit. The slat control unit includes a fixing seat and a control polygonal drum received in the fixing seat and a cord restriction seat. The control polygonal drum is connected with a ladder belt. The ladder belt extends along the cord restriction seat to connect with the slats so as to control the slats to rotate into a horizontal state or a vertical state for shading sunlight. The cord winding unit includes a cord winding tube passing through the cord restriction seat and a movable conic tube movably fitted on the cord winding tube. A pull cord is wound on the movable conic tube. Multiple guide wheels are disposed at lower end of the cord restriction seat for guiding the pull cord to be positioned at the center of the slats, whereby the slats can be tidily overlapped and the pull cord is prevented from tangling so as to enhance the sunshade effect.

Abstract: A ladder strap structure installable on high/low rail includes two vertical straps, multiple horizontal straps and a polygonal control drum. Multiple perforations are formed on the vertical straps at equal intervals. A securing bolt is passed through the perforations of the vertical straps to secure the ladder strap on the polygonal control drum. By means of selecting the perforations positioned at different heights, the ladder strap can be secured on the polygonal control drum according to the height of the high/low blind rails so that the application range of the ladder strap is widened.

Abstract: An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer. The interface layer includes an antenna layer, and an insulating layer between the antenna layer and the ground reflector layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge.

Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.

Abstract: A blind co-used sheet includes a vertical first blind sheet, a vertical second blind sheet, transverse double-layered blind sheets sown between the first and second blind sheets and fixing plate assemblies for securely holding front ends of the transverse double-layered blind sheets. The transverse double-layered blind sheets can be turned from a transverse state into a vertical state and used as a vertical blind. Alternatively, the transverse double-layered blind sheets can be 90-degree turned back from the vertical state into the transverse state and used as a Shangri-la blind. Two sides of the transverse double-layered blind sheet have upward and downward extending sunshade sections, which can overlap each other. A sunshade sheet is disposed in the transverse double-layered blind sheet to locate the blind sheets.

Abstract: A power supply module with enhanced heat dissipation effect includes a rack including an opening and an accommodating room connected to the opening, as well as at least one power supply including a fitting section inserted from the opening while positioned within the accommodating room, and a heat dissipation section extending toward the outside of the opening from the opening, in which the power supply is formed in the heat dissipation section with a plurality of heat dissipation holes, in such a way that air is capable of entering the power supply from an output end to form heat convection together with the dissipation holes, so as to form a heat dissipation effect with respect to the power supply.

Abstract: An over-the-air (OTA) wireless test system includes a container, a machine plate disposed on the container, a supporter disposed on the machine plate, a load board disposed on the supporter, a socket disposed on the load board, a device under test (DUT) installed in the socket, and a wave-guiding feature in the socket and the load board configured to pass and guide electromagnetic waves to and/or from an antenna structure of the DUT. The wave-guiding feature comprises a wave-guiding channel in the socket defined by a plurality of pogo pins surrounding the antenna structure of the DUT. The wave-guiding feature may further comprise a radiation passage in the load board defined by rows of via fence extending through an entire thickness of the load board.