Abstract: Display systems and methods for generating a display providing runway illusion alleviation are disclosed herein. An exemplary method for generating a display includes the steps of determining a position of the aircraft in a vicinity of an approaching runway, retrieving terrain data regarding the vicinity of the approaching runway and retrieving runway data regarding the approaching runway, determining the existence of a runway illusion effect by analyzing the terrain data and the runway data. The method further includes the steps of rendering graphical terrain imagery and rendering graphical runway imagery on the flight display in accordance with the terrain data and the runway data and rendering a graphical runway illusion alleviation object on the flight display.

Abstract: A wireless tunneling system tunnels communications between a first host device and a second host device through a wireless link, while maintaining compliance of the communications between the first and second host devices with a wired communication protocol and operates in a power efficient manner. Two host devices may communicate with each other through a wireless link using the wireless tunneling system, as if two host devices were connected through the wired cable. The wireless tunneling system operates in one of a high power state and one or more low power states. In the high power state, the wireless tunneling system exchanges data at a higher data rate for tunneling. In the low power state, the wireless tunneling system disables power hungry components for conserving power.

Abstract: An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.

Abstract: An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.

Abstract: A method of determining the presence of Pseudomonas involves establishing a gaseous headspace over a surface suspected of containing at least one Pseudomonas strain and contacting at least a portion of the gaseous headspace with a capillary microextraction of volatiles (CMV) sampling device to absorb at least one component of the headspace by the CMV sampling device. The component loaded CMV sampling device is coupled to an injection port of an analytical device where the components are desorbed into the analytical device, where components are separated, detected, and identified to determine if one or more of the identified components is a biomarker for at least one Pseudomonas strain.

Abstract: An organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a material of the sealing metal layer includes AgSn and is lead-free.

Abstract: A method of fabricating a package structure is provided. The method includes providing a carrier having two opposing surfaces, forming dielectric bodies on the two surfaces of the carrier, respectively, each of the dielectric bodies having a wiring layer embedded therein and a conductive layer formed on the wiring layer, and removing the carrier. Therefore, the wiring layers, the conductive layers and the dielectric bodies are formed on the two surfaces of the carrier, respectively, and the production yield is thus increased. The present invention further provides the package structure thus fabricated.

Abstract: A capillary microextractor of volatiles (CMV) allows the sampling of diagnostic volatiles that can be an explosive, explosive taggant, drug, poison, decomposition products thereof, a mixture of chemicals comprising an odor signature determined from detector dog trials, or volatile organic compounds indicative of a disease or other medical condition. The CMV has a thermally stable housing with orifices to allow the contact of a gas that contains one or more diagnostic volatiles with an absorbent that extracts and concentrates the diagnostic volatiles. After sampling, the CMV with the absorbed diagnostic volatiles can be placed in an ionized gas beam and introduced into a mass spectrometer or placed in a thermal desorption unit (TDU), where, upon heating, the diagnostic volatiles are released to an inlet port of an analytical instrument.

Abstract: A motor stator includes a stator core, first and second insulating members and a stator winding. The stator core defines upper and lower ends and has a central through hole and a plurality of stator slots distributed along a circumferential direction of the stator core, and each stator slot includes first and second slot segments. The first insulating member is disposed in the stator slot. The second insulating member is disposed at at least one of the upper and lower ends of the stator core, and defines a central hole and a plurality of grooves corresponding to the plurality of stator slots respectively. A flange is formed on the second insulating member along a peripheral of the groove and fitted within the second slot segment. The stator winding is wound on the stator core and passing through the plurality of stator slots and grooves.

Abstract: A touch display device includes a first substrate, a second substrate, a plurality of sub-pixel regions, a plurality of display devices, a plurality of first optical touch sensor device and second optical touch sensor devices. The first substrate and the second substrate are disposed oppositely. The display devices are disposed in the sub-pixel regions, respectively, to provide images for a first display surface and a second display surface. The first optical touch sensor devices are disposed on the first substrate and at least corresponding to part of the sub-pixel regions for implementing touch input function on the first display surface. The second optical touch sensor devices are disposed on the first substrate and at least corresponding to part of the sub-pixel regions for implementing touch input function on the second display surface.

Abstract: A touch panel and fabricating method thereof are provided. The patterned transparent conductive layer, disposed on the substrate, includes first electrodes. The photo-sensing layers are disposed on the first electrodes. The first patterned conductive layer includes gate electrodes, scan lines and second electrodes. The gate electrodes and the scan lines are disposed on the substrate. The second electrodes are disposed on the photo-sensing layers. The first electrodes, the photo-sensing layers and the second electrodes constitute photo-sensors. The second patterned conductive layer includes source electrodes and drain electrodes, wherein the gate electrodes, the channel layers, the source electrodes and the drain electrodes constitute read-out transistors and each of the read-out transistors is electrically connected to the corresponding photo-sensor respectively.

Abstract: A capillary microextractor of volatiles (CMV) allows the sampling of diagnostic volatiles that can be an explosive, explosive taggant, drug, poison, decomposition products thereof, a mixture of chemicals comprising an odor signature determined from detector dog trials, or volatile organic compounds indicative of a disease or other medical condition. The CMV has a thermally stable housing with orifices to allow the contact of a gas that contains one or more diagnostic volatiles with an absorbent that extracts and concentrates the diagnostic volatiles. After sampling, the CMV with the absorbed diagnostic volatiles can be placed in an ionized gas beam and introduced into a mass spectrometer or placed in a thermal desorption unit (TDU), where, upon heating, the diagnostic volatiles are released to an inlet port of an analytical instrument.

Abstract: A planet wind sail mechanism includes a main axis, a first driving unit, and a wind sail body. The first driving further includes a rotation frame with a plurality of ribs, a transmission gear attached on the rib, a fixed gear which is disposed on the main axis and engaged with the transmission gear and a rotary gear is disposed on the edge of the rotation frame and engaged with the transmission gear. The wind sail body includes one rotation axis and the rotation axis is disposed on the edge of the rotation frame. When the wind sail body revolves along the main axis, both the rotary gear and the wind sail body also rotate itself. And the fixed gear rotates in an opposite direction with the rotary gear.

Abstract: A resistor is disclosed. The resistor is disposed on a substrate, in which the resistor includes: a dielectric layer disposed on the substrate; a polysilicon structure disposed on the dielectric layer; two primary resistance structures disposed on the dielectric layer and at two ends of the polysilicon structure; and a plurality of secondary resistance structures disposed on the dielectric layer and interlaced with the polysilicon structures.

Abstract: A touch panel and fabricating method thereof are provided. The patterned transparent conductive layer, disposed on the substrate, includes first electrodes. The photo-sensing layers are disposed on the first electrodes. The first patterned conductive layer includes gate electrodes, scan lines and second electrodes. The gate electrodes and the scan lines are disposed on the substrate. The second electrodes are disposed on the photo-sensing layers. The first electrodes, the photo-sensing layers and the second electrodes constitute photo-sensors. The second patterned conductive layer includes source electrodes and drain electrodes, wherein the gate electrodes, the channel layers, the source electrodes and the drain electrodes constitute read-out transistors and each of the read-out transistors is electrically connected to the corresponding photo-sensor respectively.

Abstract: An electroluminescent phosphor comprising ZnS:Mn is disclosed. Also disclosed are ZnS:Mn electroluminescent phosphors that are free of or substantially free of copper, and/or wherein the phosphor has a D50 size of less than about 5 ?m. In addition, a method for preparing a ZnS:Mn phosphor is disclosed, comprising the steps of contacting at least a portion of each of a first solution comprising a Zn2+ compound, a manganese source, and a second solution comprising a S2? source agent; and then heating the mixture at a temperature and for a time sufficient to form a phosphor.

Abstract: A touch display device includes a first substrate, a second substrate, a plurality of sub-pixel regions, a plurality of display devices, a plurality of first optical touch sensor device and second optical touch sensor devices. The first substrate and the second substrate are disposed oppositely. The display devices are disposed in the sub-pixel regions, respectively, to provide images for a first display surface and a second display surface. The first optical touch sensor devices are disposed on the first substrate and at least corresponding to part of the sub-pixel regions for implementing touch input function on the first display surface. The second optical touch sensor devices are disposed on the first substrate and at least corresponding to part of the sub-pixel regions for implementing touch input function on the second display surface.

Abstract: A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

Abstract: A semiconductor device including a substrate, a first device, a second device and an interlayer dielectric layer is provided. The substrate has a first area and a second area. The first device is disposed in the first area of the substrate and includes a first dielectric layer on the substrate and a metal gate on the first dielectric layer. The second device is in the second area of the substrate and includes a second dielectric layer on the substrate and, a polysilicon layer on the second dielectric layer. It is noted that the height of the polysilicon layer is less than that of the metal gate of the first device. The interlayer dielectric layer covers the second device.

Abstract: An integrated method includes fabricating a metal gate transistor and a polysilicon resistor structure. A photoresistor layer is defined by an SAB photo mask and covers a part of a high resistance structure of the polysilicon resistor. When the dummy gate of the transistor is etched, the part of the high resistance structure is protected by the patterned photoresistor layer. The polysilicon resistor is formed simultaneously with the transistor. Furthermore, the polysilicon resistor still has sufficient resistance and includes two metal structures for electrical connection.