Patents by Inventor Wen Hao

Wen Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fan noise-lowering structure
    Patent number: 11326623
    Abstract: A fan noise-lowering structure includes a fan frame and a connection section. The fan frame has a bottom side and a circumferential wall. The circumferential wall defines an airflow passage. Two ends of the airflow passage respectively have an inlet and an outlet. The connection section is disposed on inner side or outer side of the circumferential wall. The connection section has an internal passage. Two ends of the internal passage respectively have an inlet end and an outlet end. The outlet end is disposed on the inner side of the circumferential wall in connection with the airflow passage near the inlet. The inlet end is disposed on the bottom side in flush with the outlet. The connection section serves to guide the high-pressure air at the outlet to jet to the inlet so as to achieve multiple noise-lowering effects.
    Type: Grant
    Filed: July 3, 2020
    Date of Patent: May 10, 2022
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Hao Liu
  • Light-detection device and light-detection method for reducing power consumption of read-out integrated circuit
    Patent number: 11317037
    Abstract: A light-detection method for a light-detection device including a plurality of scan lines, a plurality of read-out lines and a plurality of photo sensing elements is provided. Each of the plurality of photo sensing elements is coupled to one of the plurality of scan lines and one of the plurality of read-out lines. The method includes simultaneously turning on at least two of the plurality of scan lines to turn on a portion of the plurality of photo sensing elements which are coupled to the turned-on scan lines, turning on at least one of the plurality of read-out lines to transmit signals of the portion of the plurality of photo sensing elements, and determining whether the signals match a trigger standard. When it is determined that the signals match the trigger standard, a reading mode is entered.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: April 26, 2022
    Assignee: INNOLUX CORPORATION
    Inventors: Chun-Fu Lai, Wen-Hao Kuo
  • USB integrated circuit
    Patent number: 11308016
    Abstract: A USB integrated circuit includes three TX connecting component pairs and three RX connecting component pairs. The first TX connecting component pair and the first RX connecting component pair are respectively coupled to the first TX pin pair and the first RX pin pair of the first USB connector. The second TX connecting component pair and the second RX connecting component pair are respectively coupled to the first TX pin pair and the first RX pin pair of a second USB connector. The third TX connecting component pair is coupled to the second TX pin pair of the first USB connector or to the second TX pin pair of the second USB connector. The third RX connecting component pair is coupled to the second RX pin pair of the first USB connector or to the second RX pin pair of the second USB connector.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: April 19, 2022
    Assignee: VIA LABS, INC.
    Inventors: Wen-Yu Tseng, Wen-Hao Cheng, Terrance Shiyang Shih
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20220115541
    Abstract: A semiconductor device includes channel region, first and second two-dimensional metallic contacts, a gate structure, and first and second metal contacts. The channel region includes a two-dimensional semiconductor material. The first two-dimensional metallic contact is disposed at a side of the channel region and includes a two-dimensional metallic material. The second two-dimensional metallic contact is disposed at an opposite side of the channel region and includes the two-dimensional metallic material. The gate structure is disposed on the channel region in between the first and second two-dimensional metallic contacts. The first metal contact is disposed at an opposite side of the first two-dimensional metallic contact with respect to the channel region. The second metal contact is disposed at an opposite side of the second two-dimensional metallic contact with respect to the channel region.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 14, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Yang Li, Lain-Jong Li, Han Yeh, Wen-Hao Chang
  • OPTOMECHANICAL MODULE AND PROJECTOR
    Publication number: 20220100065
    Abstract: An optomechanical module, including an optomechanical housing, a light source, and a display element, is provided. The optomechanical housing includes at least one heat-dissipation hole. The light source is configured to emit an illumination beam and is disposed in the optomechanical housing. The display element is disposed in the optomechanical housing, is located on a transmission path of the illumination beam, and is configured to convert the illumination beam into an image beam. When the optomechanical module operates, the light source generates heat, and the at least one heat-dissipation hole is configured to allow airflow to pass through, so as to dissipate the heat generated by the light source. A projector is also provided.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 31, 2022
    Applicant: Coretronic Corporation
    Inventors: Kuang-Hsiang Chang, Wen-Hao Chu, Li-Wei Tseng
  • Single-crystal hexagonal boron nitride layer and method forming same
    Patent number: 11289582
    Abstract: A method includes depositing a copper layer over a first substrate, annealing the copper layer, depositing a hexagonal boron nitride (hBN) film on the copper layer, and removing the hBN film from the copper layer. The hBN film may be transferred to a second substrate.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: March 29, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tse-An Chen, Chih-Piao Chuu, Lain-Jong Li, Wen-Hao Chang, ChienChih Tseng, Chao-Kai Wen
  • FOLDING CHAIR
    Publication number: 20220087428
    Abstract: A folding chair includes a right seat receiver, right front and rear legs, right armrest, a right armrest post, a right leg connecting member, a right backrest support, first and second right front support, and first and second right rear supports; a left seat receiver, left front and rear legs, a left armrest, a left armrest post, a left leg connecting member, a left backrest support, first and second left front support, and first and second left rear supports; a middle seat receiver, middle front and rear legs, a middle seat receiver post, a middle leg connecting member, a middle backrest support; a seat; and a backrest. These components are connected to one another that the folding chair can be collapsed into a bundle to be conveniently portable without occupying too much space; and the folding chair extended from the collapsed state provides improved stability and load capacity.
    Type: Application
    Filed: September 23, 2020
    Publication date: March 24, 2022
    Inventor: WEN-HAO TSAI
  • Folding chair
    Patent number: 11278121
    Abstract: A folding chair includes a right seat receiver, right front and rear legs, a right armrest, a right armrest post, a right leg connecting member, a right backrest support, first and second right front support, and first and second right rear supports; a left seat receiver, left front and rear legs, a left armrest, a left armrest post, a left leg connecting member, a left backrest support, first and second left front support, and first and second left rear supports; a middle seat receiver, middle front and rear legs, a middle seat receiver post, a middle leg connecting member, a middle backrest support; a seat; and a backrest. These components are connected to one another that the folding chair can be collapsed into a bundle to be conveniently portable without occupying too much space; and the folding chair extended from the collapsed state provides improved stability and load capacity.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: March 22, 2022
    Assignee: SPORT DIVERSIONS INC.
    Inventor: Wen-Hao Tsai
  • Integrated circuit and method of forming same and a system
    Patent number: 11275886
    Abstract: A multi-bit flip-flop includes a first flip-flop, a second flip-flop, a first inverter, and a second inverter. The first flip-flop has a first driving capability. The second flip-flop has a second driving capability different from the first driving capability. The first inverter is configured to receive a first clock signal on a first clock pin, and is configured to generate a second clock signal inverted from the first clock signal. The second inverter is coupled to the first inverter, is configured to receive the second clock signal, and is configured to generate a third clock signal inverted from the second clock signal. The first flip-flop and the second flip-flop are configured to share at least the first clock pin.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: March 15, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sheng-Hsiung Chen, Wen-Hao Chen, Chun-Yao Ku, Shao-Huan Wang, Hung-Chih Ou
  • LITHOGRAPHY SYSTEM AND METHODS
    Publication number: 20220075273
    Abstract: A lithography exposure system includes a light source, a substrate stage, and a mask stage between the light source and the substrate stage along an optical path from the light source to the substrate stage. The lithography exposure system further comprises a reflector along the optical path. The reflector comprises: a first layer having a first material and a first thickness; a second layer having the first material and a second thickness different from the first thickness; and a third layer between the first layer and the second layer, and having a second material different from the first material.
    Type: Application
    Filed: March 23, 2021
    Publication date: March 10, 2022
    Inventors: Eng Hock LEE, Wen-Hao CHENG
  • HIERARCHICAL DENSITY UNIFORMIZATION FOR SEMICONDUCTOR FEATURE SURFACE PLANARIZATION
    Publication number: 20220075924
    Abstract: The current disclosure describes techniques for managing planarization of features formed on a semiconductor wafer. The disclosed techniques achieve relative planarization of micro bump structures formed on a wafer surface by adjusting the pattern density of the micro bumps formed within various regions on the wafer surface. The surface area size of a micro bump formed within a given wafer surface region may be enlarged or reduced to change the pattern density. A dummy micro bump may be inserted into a given wafer surface region to increase the pattern density.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Inventors: Venkata Sripathi Sasanka Pratapa, Jyun-Hong Chen, Wen-Hao Cheng
  • Composition for substrate surface modification and method using the same
    Patent number: 11261204
    Abstract: The present invention provides a composition for substrate surface modification and a method using the same, and the composition for substrate surface modification is composed of a compound of the general formula structure shown in formula 1: formula 1, wherein n1 is an integer of 1 to 6, and R is a zwitterionic group. The composition for substrate surface modification uses water as a medium to perform modifying reaction over a substrate surface, and at the same time has biological modification characteristics, and abilities of immobilizing biomolecules and anti-biofouling.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: March 1, 2022
    Assignee: NATIONAL CENTRAL UNIVERSITY
    Inventors: Chen-Han Huang, Wen-Hao Chen
  • Composition for substrate surface modification and method using the same
    Patent number: 11261203
    Abstract: The present invention provides a composition for substrate surface modification and a method using the same, and the composition for substrate surface modification is composed of a compound of the general formula structure shown in formula 1: formula 1, wherein n1 is an integer of 1 to 6, and R is a zwitterionic group. The composition for substrate surface modification uses water as a medium to perform modifying reaction over a substrate surface, and at the same time has biological modification characteristics, and abilities of immobilizing biomolecules and anti-biofouling.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: March 1, 2022
    Assignee: NATIONAL CENTRAL UNIVERSITY
    Inventors: Chen-Han Huang, Wen-Hao Chen
  • Multi-row standard cell design method in hybrid row height system
    Patent number: 11263378
    Abstract: A discrete multi-row height cell in a hybrid row-height system with a plurality of rows of at least two different row-heights is disclosed. The discrete multi-row height cell includes: a first sub-cell deployed on a first row with a first row-height; a second sub-cell deployed on a second row with a second row-height, wherein the second row and the first row is separated by a third row with a third row-height, wherein the third row-height is different from the first row-height, wherein the first sub-cell and the second sub-cell are electrically connected by at least a wire.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: March 1, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Hung-Chih Ou, Wen-Hao Chen, Chun-Yao Ku
  • SYSTEM AND METHOD FOR HEATING SEMICONDUCTOR WAFERS
    Publication number: 20220059375
    Abstract: A semiconductor process system includes a wafer support and a control system. The wafer support includes a plurality of heating elements and a plurality of temperature sensors. The heating elements heat a semiconductor wafer supported by the support system. The temperature sensors generate sensor signals indicative of a temperature. The control system selectively controls the heating elements responsive to the sensor signals.
    Type: Application
    Filed: August 19, 2020
    Publication date: February 24, 2022
    Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN
  • Cell row arrangement in regions of integrated circuit layout
    Patent number: 11256844
    Abstract: A method of generating a layout design of an integrated circuit. The method includes forming a first region having at least two first-type cell rows extending in a first direction. Each one of the first-type cell rows has a first row height measured along a second direction perpendicular to the first direction. The method also includes forming a second region having at least two second-type cell rows extending in the first direction. Each one of the second-type cell rows has a second row height measured along the second direction. The first region is adjacent to the second region, and the first row height of the first-type cell rows is different from the second row height of the second-type cell rows.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: February 22, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Yao Ku, Wen-Hao Chen, Ming-Tao Yu
  • DEPOSITION SYSTEM AND METHOD
    Publication number: 20220051952
    Abstract: A deposition system provides a feature that may reduce costs of the sputtering process by increasing a target change interval. The deposition system provides an array of magnet members which generate a magnetic field and redirect the magnetic field based on target thickness measurement data. To adjust or redirect the magnetic field, at least one of the magnet members in the array tilts to focus on an area of the target where more target material remains than other areas. As a result, more ion, e.g., argon ion bombardment occurs on the area, creating more uniform erosion on the target surface.
    Type: Application
    Filed: August 14, 2020
    Publication date: February 17, 2022
    Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN, Yi-Ming DAI
  • Apparatus And A Method Of Forming A Particle Shield
    Publication number: 20220043362
    Abstract: An apparatus for generating a laminar flow includes an injection nozzle and a suction nozzle. The injection nozzle and the suction nozzle are operable to form the laminar flow for blocking particles from contacting a proximate surface of an object. The injection nozzle includes a main outlet to blow out the laminar flow and is configured to generate a Coanda flow along an external surface of the injection nozzle. The suction nozzle is configured to provide a gas pressure gradient for the laminar flow.
    Type: Application
    Filed: October 20, 2021
    Publication date: February 10, 2022
    Inventor: Wen-Hao Cheng
  • Folding chair
    Patent number: 11234524
    Abstract: A folding chair includes U-shaped first to fourth supporting frame members, U-shaped first to third legs, inverted U-shaped first and second armrests, first to fourth seat receivers, first to fourth front supports, first to fourth rear supports, first to fourth front connecting members, first to fourth rear connecting members, first to third backrest supports, a seat and a backrest. All these members can be smoothly pivotally turned about corresponding couplers or unions, enabling the folding chair to be collapsed into a slim-folded state to occupy a very small space and be easily portable, or be fully extended from the collapsed state to provide improved stability and load capacity in use.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: February 1, 2022
    Assignee: SPORT DIVERSIONS INC.
    Inventor: Wen-Hao Tsai
  • Folding chair
    Patent number: 11234525
    Abstract: A folding chair includes U-shaped first to fourth supporting frame members, U-shaped first to third legs, inverted U-shaped first and second armrests, first to fourth seat receivers, first to fourth front supports, first to fourth rear supports, first to fourth front connecting members, first to fourth rear connecting members, first to third backrest supports, a locking element, a seat and a backrest. All these members can be smoothly pivotally turned about corresponding couplers or unions, enabling the folding chair to be collapsed into a slim-folded state to occupy a very small space and be easily portable, or be fully extended from the collapsed state to provide improved stability and load capacity in use.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: February 1, 2022
    Assignee: SPORT DIVERSIONS INC.
    Inventor: Wen-Hao Tsai