Patents by Inventor Wen Hao

Wen Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging Material And Methods Of Manufacture
    Publication number: 20220363947
    Abstract: Packaging materials and methods of manufacture are disclosed. The packaging material comprises a substrate surface and film coating selected from the group consisting of an elastomer, a polymer, an inorganic material and combinations thereof. The film coating includes a first layer and a second layer, the first layer deposited on the second layer. The first layer has a formula of SiOxNyCz, where x is in a range from 1.9 to 2.15, y is in a range from 0.01 to 0.08, and z is in a range from 0.10 to 0.40.
    Type: Application
    Filed: May 11, 2022
    Publication date: November 17, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Vibhas Singh, Wen-Hao Wu, Jrjyan Jerry Chen, Soo Young Choi
  • ANTI-MALWARE ADAPTOR FOR REMOVABLE STORAGE DEVICES
    Publication number: 20220366046
    Abstract: An adaptor includes non-volatile memory that stores a scan engine. A removable storage device is connected to the adaptor, which in turn is connected to a host computer. Files being copied between the removable storage device and the host computer through the adaptor are scanned for malware using the scan engine.
    Type: Application
    Filed: August 16, 2021
    Publication date: November 17, 2022
    Applicant: TXOne Networks Inc.
    Inventors: Wen-Hao CHENG, Hsiao-Pei TIEN, Pao-Han LEE
  • PROJECTION DEVICE
    Publication number: 20220365410
    Abstract: Provided is a projection device, including a casing, a light source module, an optical engine module, a projection lens, and a fan. The casing includes a right cover plate and a baffle opposite to each other, and a lower cover plate adjacent to the right cover plate. The baffle divides the casing into first and second areas. The right and lower cover plates respectively have first and second air outlets adjacent to each other and located in the second area. The light source module, the optical engine module, located on a light transmission path of the light source module, the projection lens, connected to the optical engine module, and the fan, adjacent to the baffle, are disposed in the first area of the casing. The projection device is placed in a first or second state, and hot airflow therein flows out from the first or second air outlet.
    Type: Application
    Filed: July 20, 2021
    Publication date: November 17, 2022
    Applicant: Coretronic Corporation
    Inventors: Jui-Cheng Tseng, Wen-Hao Chu
  • Redistribution layer metallic structure and method
    Patent number: 11502050
    Abstract: The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a semiconductor substrate; an interconnection structure formed on the semiconductor substrate; and a redistribution layer (RDL) metallic feature formed on the interconnection structure. The RDL metallic feature further includes a barrier layer disposed on the interconnection structure; a diffusion layer disposed on the barrier layer, wherein the diffusion layer includes metal and oxygen; and a metallic layer disposed on the diffusion layer.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: November 15, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin
  • SYSTEM FOR DESIGNING SEMICONDUCTOR DEVICE
    Publication number: 20220358277
    Abstract: A system includes a non-transitory computer readable medium configured to store instructions thereon. The system further includes a processor connected to the non-transitory computer readable medium. The processor is configured to execute the instruction for comparing a size of a via pillar structure of a first layout pattern of a plurality of layout patterns with a size of a via pillar structure of a second layout pattern of the plurality of layout patterns, wherein each of the plurality of layout patterns meets an electromigration (EM) rule. The processor is further configured to execute the instructions for replacing, in a layout design, the first layout pattern with the second layout pattern in response to the size of the via pillar structure of the second layout pattern being less than the size of the via pillar structure of the first layout pattern.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Inventors: Shao-Huan WANG, Sheng-Hsiung CHEN, Wen-Hao CHEN, Chun-Chen CHEN, Hung-Chih OU
  • SYSTEM AND METHOD FOR MONITORING AND PERFORMING THIN FILM DEPOSITION
    Publication number: 20220356578
    Abstract: A thin film deposition system deposits a thin film on a substrate in a thin film deposition chamber. The thin film deposition system deposits the thin film by flowing a fluid into the thin film deposition chamber. The thin film deposition system includes a byproducts sensor that senses byproducts of the fluid in an exhaust fluid. The thin film deposition system adjusts the flow rate of the fluid based on the byproducts.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Inventors: Wen-Hao CHENG, Yi-Ming DAI, Yen-Yu CHEN, Hsuan-Chih CHU
  • MULTI-FUNCTIONAL SHUTTER DISK FOR THIN FILM DEPOSITION CHAMBER
    Publication number: 20220356562
    Abstract: The present disclosure provides a multifunction chamber having a multifunctional shutter disk. The shutter disk includes a lamp device, a DC/RF power device, and a gas line on one surface of the shutter disk. With this configuration, simplifying the chamber type is possible as the various specific, dedicated chambers such as a degas chamber, a pre-clean chamber, a CVD/PVD chamber are not required. By using the multifunctional shutter disk, the degassing function and the pre-cleaning function are provided within a single chamber. Accordingly, a separate degas chamber and a pre-clean chamber are no longer required and the overall transfer time between chambers is reduced or eliminated.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 10, 2022
    Inventors: Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai
  • WAFER HOLDER FOR FILM DEPOSITION CHAMBER
    Publication number: 20220359232
    Abstract: The present disclosure provides a flexible workpiece pedestal capable of tilting a workpiece support surface. The workpiece pedestal further includes a heater mounted on the workpiece support surface. The heater includes a plurality of heating sources such as heating coils. The plurality of heating sources in the heater allows heating the workpiece at different temperatures for different zones of the workpiece. For example, the workpiece can have a central zone heated by a first heating coil, a first outer ring zone that is outside of the central zone heated by a second heating coil, a second outer ring zone that is outside of the first outer ring zone heated by a third heating coil. By using the tunable heating feature and the tilting feature of the workpiece pedestal, the present disclosure can reduce or eliminate the shadowing effect problem of the related workpiece pedestal in the art.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 10, 2022
    Inventors: Hsuan-Chih Chu, Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai
  • Shutter disk having lamp, power, and/or gas modules arranged at the first side of the shutter disk of thin film deposition chamber
    Patent number: 11492700
    Abstract: The present disclosure provides a multifunction chamber having a multifunctional shutter disk. The shutter disk includes a lamp device, a DC/RF power device, and a gas line on one surface of the shutter disk. With this configuration, simplifying the chamber type is possible as the various specific, dedicated chambers such as a degas chamber, a pre-clean chamber, a CVD/PVD chamber are not required. By using the multifunctional shutter disk, the degassing function and the pre-cleaning function are provided within a single chamber. Accordingly, a separate degas chamber and a pre-clean chamber are no longer required and the overall transfer time between chambers is reduced or eliminated.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: November 8, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co.
    Inventors: Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai
  • Planting structure capable of controlling growth conditions and recycling nutrient solution
    Patent number: 11483982
    Abstract: A planting structure includes a trough and a plurality of lateral covers. The trough has a hollow space and a planting space, and a canal is formed inside of the trough; the lateral covers cover a lateral side of the trough and seals off the planting space. The inner walls on the two sides have bottom ends thereof integrally extended to form the canal therebetween. In addition, the planting structure possesses features such as being light in weight, easy to assemble and operate, and can be used to effectively lower production costs by modifying the length and the arrangement mode of the structure according to requirements.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: November 1, 2022
    Inventor: Wen-Hao Li
  • Semiconductor Process Technology Assessment
    Publication number: 20220335196
    Abstract: A method of process technology assessment is provided. The method includes: defining a scope of the process technology assessment, the scope comprising an original process technology and a first process technology; modeling a first object in an integrated circuit into a resistance domain and a capacitance domain; generating a first resistance scaling factor and a first capacitance scaling factor based on the modeling, the original process technology, and the first process technology; and utilizing, by an electronic design automation (EDA) tool, the first resistance scaling factor and the first capacitance scaling factor for simulation of the integrated circuit.
    Type: Application
    Filed: April 15, 2021
    Publication date: October 20, 2022
    Inventors: Hung-Chih Ou, Kuo-Fu Lee, Wen-Hao Chen, Keh-Jeng Chang, Hsiang-Ho Chang
  • DEPOSITION SYSTEM AND METHOD
    Publication number: 20220336297
    Abstract: A deposition system is provided capable of measuring at least one of the film characteristics (e.g., thickness, resistance, and composition) in the deposition system. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition system in accordance with the present disclosure includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, and a target enclosing the substrate process chamber. A shutter disk including an in-situ measuring device is provided.
    Type: Application
    Filed: April 16, 2021
    Publication date: October 20, 2022
    Inventors: Wen-Hao CHENG, Yen-Yu CHEN, Yi-Ming DAI
  • Semiconductor device manufacturing method and associated semiconductor die
    Patent number: 11469198
    Abstract: A semiconductor device manufacturing method including: simultaneously forming a plurality of conductive bumps respectively on a plurality of formation sites by adjusting a forming factor in accordance with an environmental density associated with each formation site; wherein the plurality of conductive bumps including an inter-bump height uniformity smaller than a value, and the environmental density is determined by a number of neighboring formation sites around each formation site in a predetermined range.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: October 11, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ming-Ho Tsai, Jyun-Hong Chen, Chun-Chen Liu, Yu-Nu Hsu, Peng-Ren Chen, Wen-Hao Cheng, Chi-Ming Tsai
  • Apparatus and a method of forming a particle shield
    Patent number: 11460787
    Abstract: An apparatus for generating a laminar flow includes an injection nozzle and a suction nozzle. The injection nozzle and the suction nozzle are operable to form the laminar flow for blocking particles from contacting a proximate surface of an object. The injection nozzle includes a main outlet to blow out the laminar flow and is configured to generate a Coanda flow along an external surface of the injection nozzle. The suction nozzle is configured to provide a gas pressure gradient for the laminar flow.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: October 4, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Wen-Hao Cheng
  • Extreme ultraviolet light reflective structure including nano-lattice and manufacturing method thereof
    Patent number: 11454877
    Abstract: An EUV reflective structure includes a substrate and multiple pairs of a Si layer and a Mo layer. The Si layer includes a plurality of cavities.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: September 27, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Benny Ku, Keith Kuang-Kuo Koai, Wen-Hao Cheng
  • DATA TRANSMITTING METHOD OF DISPLAY DEVICE
    Publication number: 20220300231
    Abstract: A data transmitting method of a display device, which applies to a transmitting device and the display device. The transmitting device includes a first transmitting module. The display device includes a processing module, a second transmitting module, a storage module, and a display module. The data transmission method includes steps of: select a file on the transmitting device; compress the file to form a compressed file; send the compressed file to the display device via the first transmitting module; receive the compressed file by the second transmitting module of the display device; decompress the compressed file by the processing module to obtain the file; write the file into the storage module by the processing module and correspondingly displaying on the display module based on the file. In this way, a time for transmitting the file could be effectively reduced.
    Type: Application
    Filed: March 17, 2021
    Publication date: September 22, 2022
    Applicant: WINSTAR DISPLAY CO., LTD.
    Inventors: CHIA-HSIANG NI, WEN-WEI CHUNG, YU-CHANG SONG, CHIEN-CHOU HSU, WEN-HAO LIAO, YU-PIN LIAO
  • PARTICLE REMOVER AND METHOD
    Publication number: 20220297037
    Abstract: A device for removing particles in a gas stream includes a first cylindrical portion configured to receive the gas stream containing a target gas and the particles, a rotatable device disposed within the first cylindrical portion and configured to generate a centrifugal force when in a rotational action to divert the particles away from the rotatable device, a second cylindrical portion coupled to the first cylindrical portion and configured to receive the target gas, and a third cylindrical portion coupled to the first cylindrical portion and surrounding the second cylindrical portion, the third cylindrical portion being configured to receive the diverted particles.
    Type: Application
    Filed: July 28, 2021
    Publication date: September 22, 2022
    Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
  • Method of designing semiconductor device
    Patent number: 11449656
    Abstract: A method including selecting a plurality of layout patterns, wherein each of the layout patterns comprises a corresponding via pillar structure that satisfies an electromigration (EM) rule, wherein each of the via pillar structures comprises metal layers and at least one via coupled to the metal layers. The method further includes selecting a layout pattern from the plurality of layout patterns having a smallest physical size. The method further includes performing a placement and routing process by using the selected layout pattern.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: September 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shao-Huan Wang, Sheng-Hsiung Chen, Wen-Hao Chen, Chun-Chen Chen, Hung-Chih Ou
  • Lithography system and methods
    Patent number: 11448970
    Abstract: A lithography exposure system includes a light source, a substrate stage, and a mask stage between the light source and the substrate stage along an optical path from the light source to the substrate stage. The lithography exposure system further comprises a reflector along the optical path. The reflector comprises: a first layer having a first material and a first thickness; a second layer having the first material and a second thickness different from the first thickness; and a third layer between the first layer and the second layer, and having a second material different from the first material.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: September 20, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Eng Hock Lee, Wen-Hao Cheng
  • Displaying device
    Patent number: 11435597
    Abstract: A displaying device adapted to a screen is provided. The displaying device includes a transparent pyramid, a movable support, and an image conversion unit. The movable support is connected to the transparent pyramid to move the transparent pyramid between a first location and a second location which is different from the first location. The first location is the position on the screen. The image conversion unit is configured to receive image data. When the transparent pyramid moves to the first location, the image conversion unit converts the image data to a holographic image displayed on the screen, and the transparent pyramid generates a 3D hologram based on the holographic image.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: September 6, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Wen-Hao Hsieh, Kai-Ze Luo, Ming-Lung Lin, Yu-Chen Lee, Sheng-Yen Tseng, Yen-Hui Zheng, Kuan-Yi Lin, Chih-Shien Lin