Abstract: This invention provides an optical lens system in order from an object side to an image side comprising: a first lens element having a convex object-side surface; a negative second lens element having a concave object-side surface and a convex image-side surface; a positive third lens element having a convex object-side surface and a convex image-side surface; a plastic negative fourth lens element having a concave object-side surface and a convex image-side surface, with both the object-side and image-side surfaces thereof being aspheric. By such arrangement, the incident angle of off-axis light projected onto the sensor can be suppressed for improving the sensitivity of the sensor effectively. Also, a sufficient back focal length can be retained for disposing other optical elements (e.g., an IR-pass filter), and thereby the system can be more suitable for the infrared aspect of optical imaging systems.

Abstract: A trench power MOSFET structure and fabrication method thereof is provided. The fabrication method comprises following process. First, form an isolating trench. Then, form at least two doped regions around the isolating trench. The doped regions are adjacent and the doping concentrations of two doped regions are different. Form an isolating structure in the isolating trench. Wherein, the junction profiles of the two doped regions are made by ion implantation method for moderate the electric field distribution and decreasing the conduction loss.

Abstract: A reading circuit of a gyroscope is provided. The reading circuit includes a driving unit, a high pass filter, a signal processing unit, and a low pass filter. The driving unit generates a resonance signal for a resonator of the gyroscope and generates a demodulation signal for the signal processing unit. The signal processing unit provides a modulation signal to a Coriolis accelerometer of the gyroscope. An input terminal of the high pass filter receives an output signal of the Coriolis accelerometer. The signal processing unit processes and demodulates an output of the high pass filter according to the demodulation signal and outputs a demodulation result to the low pass filter.

Abstract: A fabrication method of a trenched power semiconductor device with source trench is provided. Firstly, at least two gate trenches are formed in a base. Then, a dielectric layer and a polysilicon structure are sequentially formed in the gate trench. Afterward, at least a source trench is formed between the neighboring gate trenches. Next, the dielectric layer and a second polysilicon structure are sequentially formed in the source trench. The second polysilicon structure is located in a lower portion of the source trench. Then, the exposed portion of the dielectric layer in the source trench is removed to expose a source region and a body region. Finally, a conductive structure is filled into the source trench to electrically connect the second polysilicon structure, the body region, and the source region.

Abstract: A MEMS apparatus comprising composite vibrating unit and the manufacturing method thereof are disclosed. The vibrating unit includes a stiffness element on which a first material is disposed. A second material being a conductive material is disposed on the first material and is extended to the stiffness element to remove electric charge on first material. When a temperature is changed, a variation direction of a Young's modulus of the first material is opposite to a variation direction of a Young's modulus of the stiffness element. The unique attributes above allow vibrating unit of the MEMS apparatus such as resonator and gyroscope to have stable resonance frequency against the change of temperature.

Abstract: An image capturing lens assembly includes, in order from an object-side to an image-side along an optical axis, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element with negative refractive power has an image-side surface being concave at a paraxial region. The second lens element with positive refractive power has an image-side surface being convex at a paraxial region. The third lens element with negative refractive power has an object-side surface being concave at a paraxial region, and an image-side surface being convex at a paraxial region. The fourth lens element with positive refractive power has an object-side surface being convex at a paraxial region, and an image-side surface being concave at a paraxial region, and at least one of the object-side surface and the image-side surface is aspheric.

Abstract: One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

Abstract: A micro-electro mechanical apparatus with interdigitated spring including a substrate, at least one first mass, a movable electrode, a stationary electrode, an anchor and an interdigitated spring is provided. The movable electrode is disposed on the mass along an axial direction. The stationary electrode is disposed on the substrate along the axial direction, and the movable electrode and the stationary electrode have a critical gap there between. The interdigitated springs connects the mass and the anchor along the axial direction. The interdigitated spring includes first folded portions, first connecting portions, second folded portions, and second connecting portions. Each first folded portion includes two first spans and a first head portion. Each second folded portion includes two second spans and a second head portion. A width of the first span and a width of the second span are greater than the critical gap respectively.

Abstract: This invention provides an image capturing lens system in order from an object side to an image side comprising four non-cemented lens elements with refractive power: a first lens element with positive refractive power having a convex object-side surface; a second lens element with negative refractive power having a concave image-side surface; a plastic third lens element having a concave object-side surface and a convex image-side surface, both the object-side and image-side surfaces thereof being aspheric; and a plastic fourth lens element with negative refractive power having a concave image-side surface, both the object-side and image-side surfaces thereof being aspheric, and at least one inflection point is formed on at least one of the object-side and image-side surfaces thereof; wherein the image capturing lens system comprises a stop positioned between the first lens element and the second lens element.

Abstract: One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

Abstract: An image lens system includes, in order from an object side to an image side, a first lens element with negative refractive power including a concave image-side surface; a second lens element with positive refractive power including a convex object-side surface; a third lens element with negative refractive power including an object-side surface and a concave image-side surface, the object-side surface and the image-side surface being aspheric; a fourth lens element with positive refractive power including a convex object-side surface and a convex image-side surface; and a fifth lens element with negative refractive power including a convex object-side surface and a concave image-side surface, the object-side surface and the image-side surface being aspheric, the fifth lens element having at least one inflection point.

Abstract: A method for preventing arcing during processing of a back side of a semiconductor wafer is provided herein. The method comprising includes steps of depositing a dielectric layer over the back side and depositing an anti-arcing layer over the dielectric layer. The anti-arcing layer is a conductive layer, but it not suitable for conducting signals or power. The method further includes etching an opening through a plurality of material layers of the semiconductor wafer. The opening exposes a conductive layer located on a front side of the semiconductor wafer. Additionally, the method includes depositing a conductive layer in the opening to form a through-wafer interconnect. A semiconductor wafer fabricated according to the method is also disclosed.

Abstract: A method of manufacturing a trench power semiconductor structure is provided. The method comprising the steps of: providing a base, forming a dielectric pattern layer on the base to define an active region and a terminal region, wherein a portion of the base in the active region and the terminal region is covered by the dielectric pattern layer; selectively forming a first epitaxial layer on the base without being covered by the dielectric pattern layer; removing the dielectric pattern layer in the active region to form a gate trench on the base, and forming a gate dielectric layer on the first epitaxial layer and on the inner surface of the gate trench; forming the gate structure in the gate trench; utilizing the dielectric pattern layer to forming a body on or in the first epitaxial layer; and forming a source on the upper portion of the body.

Abstract: The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.

Abstract: A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.

Abstract: A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.

Abstract: A retractable safety syringe includes a retractable needle hub holding a needle and having a first guiding means; and a hollow barrel having a second guiding means set correspondingly to the first guiding means; and a collapsible plunger comprising of a first plunger element having a protrusion releasably coupled with a second plunger element having a longitudinal slot with a pinched zone to curb the movement of said protrusion; and a spring disposed between the needle hub and hollow barrel and acts between the needle hub and the hollow barrel. The uncoupling of the collapsible plunger triggers the retraction mechanism to enable the needle hub to retract into the barrel by the decompression force of a spring. The reliability of retraction is further improved by a longitudinal slot and a protrusion to facilitate the retreating of the collapsible plunger in an orderly way.

Abstract: A MEMS device with a first electrode, a second electrode and a third electrode is disclosed. These electrodes are disposed on a substrate in such a manner that (1) a pointing direction of the first electrode is in parallel with a normal direction of the substrate, (2) a pointing direction of the third electrode is perpendicular to the pointing direction of the first electrode, (3) the second electrode includes a sensing portion and a stationary portion, (4) the first electrode and the sensing portion are configured to define a sensing capacitor, and (5) the third electrode and the stationary portion are configured to define a reference capacitor. This arrangement facilitates the MEMS device such as a differential pressure sensor, differential barometer, differential microphone and decoupling capacitor to be miniaturized.

Abstract: A projector includes a projection lens set, a DMD, a prism unit, a light guide unit, and a light source device. The light source device includes a first and a second LEDs, a laser light source, and a color wheel. The first LED is positioned in a first optical path and generates a first light. The laser light source is positioned in a second optical path and generates a laser light. The second LED is positioned in a third optical path and generates a second light. The laser light irradiates the color wheel to generate a third light. A light merging unit merges the first, second, and third lights. The light guide unit guides the mixed light to the prism unit. The mixed light is refracted to the DMD via the prism unit. The refracted mixed light is reflected to the projection lens set via the DMD.

Abstract: A splitting apparatus suitable to split a work piece along at least one cutting line formed on the work piece is provided. The splitting apparatus includes a chopper, a detector, a controller and an adjustor. The chopper is disposed above the work piece. The detector is disposed above the work piece for transmitting a signal to the work piece so as to get a specification data of the work piece. The controller connects the detector and receives the specification data and generates an adjustment data. The adjustor connects the controller and the chopper. The adjustor receives the adjustment data and adjusts a parameter data of the chopper according to the adjustment data so that the chopper splits the work piece for once along the cutting line formed on the work piece.