Abstract: A wireless inductive pointer clock includes a wireless inductive receiver module for receiving a time code, a control circuit module electrically coupled to the wireless inductive receiver module for receiving the time code and converting the time code into a pointer drive signal, a movement electrically coupled to the control circuit module for receiving the pointer drive signal and driving by the control circuit module, and a pointer unit including a plurality of pointers drivable by the movement. The wireless inductive receiver module can receive the time code (hour, minute, second) of a smart phone or tablet computer, enabling the control circuit module to drive the movement and the pointers of the pointer unit so that the time on the wireless inductive pointer clock can be automatically synchronized to the time on the smart phone or tablet.

Abstract: In a seat height adjustment method for a chair, a body height of a user of an electronic device is acquired from the electronic device which is in communication with the chair. The method further computes a target seat height suitable for the user according to the user's body height and a preset formula. The lifting device can automatically adjust the seat height for a user when the user has leave the chair and further returning the seat of the chair to an original height.

Abstract: A fan-out wafer level chip package structure and the manufacturing method thereof are provided. The method includes the steps of providing a supporting plate having a removable tape formed on the supporting plate, placing a plurality of chips on the removable tape, applying an adhesive layer on a back surface of each of the chips, providing a conductive cover for covering all chips and isolating the chips from each other by a plurality of partitions, injecting a molding compound into an inside of the conductive cover and curing the molding compound for forming an encapsulation, separating the encapsulation from the supporting plate, forming a connection layer on an active surface of each of the chips to establish electrical connections, and performing a cutting process to divide the encapsulation into a plurality of the package structures.

Abstract: An optical lens system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element has negative refractive power. The third lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof, wherein both of the surfaces thereof are aspheric. The fourth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface of the fourth lens element has at least one convex shape in an off-axis region thereof, and both of the surfaces thereof are aspheric. The optical lens system has a total of four lens elements with refractive power.

Abstract: A manufacturing method of wafer level chip scale package structure is provided. Firstly, a wafer including a plurality of semiconductor devices is provided. An active surface of one of the semiconductor devices has an active an active region and an outer region. A first electrode and a second electrode are arranged on the active region, and the outer region has a cutting portion and a channel portion. Next, a patterned protecting layer having a plurality of openings is formed on the active surface to respectively expose the first and second electrodes and channel portion. Subsequently, a wafer back thinning process is performed and then a back electrode layer is deposited. Subsequently, the channel portion is etched to form a trench exposing the back electrode layer, and a conductive structure connected to the back electrode layer is formed through the trench. Thereafter, the wafer is cut along the cutting portion.

Abstract: A liquid crystal on silicon (LCOS) display apparatus is provided, which includes a silicon substrate, a color filter layer, a first alignment layer, a second alignment layer and a liquid crystal layer. The silicon substrate has pixels arranged in a matrix. Each of the pixels has a tilting angle ranging from about 0 degrees to about 90 degrees and includes a pixel electrode. The color filter layer is disposed on the pixels. The color filter layer has a plurality of color filter units, and each of the color filter units respectively corresponds to one of the pixel electrodes. The first alignment layer is disposed on the color filter layer. The second alignment layer is disposed opposite to the first alignment layer. The liquid crystal layer is disposed between the first alignment layer and the second alignment layer. The liquid crystal layer has liquid crystal molecules with negative dielectric anisotropy.

Abstract: A wireless inductive pointer clock includes a wireless inductive receiver module for receiving a time code, a control circuit module electrically coupled to the wireless inductive receiver module for receiving the time code and converting the time code into a pointer drive signal, a movement electrically coupled to the control circuit module for receiving the pointer drive signal and driving by the control circuit module, and a pointer unit including a plurality of pointers drivable by the movement. The wireless inductive receiver module can receive the time code (hour, minute, second) of a smart phone or tablet computer, enabling the control circuit module to drive the movement and the pointers of the pointer unit so that the time on the wireless inductive pointer clock can be automatically synchronized to the time on the smart phone or tablet.

Abstract: A bicycle trainer is adapted to be arranged with a bicycle to simulate riding a bicycle on an outdoor road. The bicycle includes a stand, a roller, a first resistance source and a second resistance source. The stand is adapted to support the bicycle. The roller is pivoted to the stand and is adapted to contact a bicycle wheel of the bicycle. The first resistance source is coupled to the roller and provides resistance to the bicycle wheel via the roller. The second resistance source is coupled to the roller and provides resistance to the bicycle wheel via the roller.

Abstract: A bicycle trainer is adapted to be arranged with a bicycle to simulate riding a bicycle on an outdoor road. The bicycle includes a stand, a roller and a resistance source. The stand is adapted to support the bicycle. The roller is pivoted to the stand and adapted to contact a bicycle wheel of the bicycle. The resistance source is coupled to the roller and provides resistance to the bicycle wheel via the roller. The resistance source varies the magnitude of the provided resistance according to the rotation speed of the roller.

Abstract: A package structure and a packaging method of wafer level chip scale package are provided. The packaging method includes: providing a carrier, and disposing a plurality of chips on the carrier; forming a plurality of adhesive layers on a surface of the corresponding chips; covering a conductive cover plate, bonding the conductive cover plate with the chips through the adhesive layers, and dividing out a plurality of packaging spaces by the conductive cover plate for disposing the chips respectively; and providing an insulation material to fill the packaging spaces through via holes on the conductive cover plate to form a first insulation structure; finally, removing the carrier.

Abstract: A transparent conductive layer structure for an LED is provided. The LED includes a reflecting layer, an N-type electrode, an N-type semiconductor layer, a light emitting layer, a P-type semiconductor layer, a current block layer, a transparent conductive layer and a P-type electrode that are stacked on a substrate. The current block layer is disposed between and separates the P-type electrode and the P-type semiconductor layer. The transparent conductive layer is disposed between the P-type electrode and the current block layer, and connects to the P-type electrode and the P-type semiconductor layer. At a region corresponding to the P-type electrode, a plurality of holes are disposed at the transparent conductive layer to reduce an area of and hence an amount of light absorbed by the transparent conductive layer, thereby increasing light extraction efficiency of excited light from the light emitting layer and enhancing light emitting efficiency of the LED.

Abstract: An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two substrates, such as wafers, dies, or a wafer and a die, are bonded together. A first mask is used to form a first opening extending partially to an interconnect formed on the first wafer. A dielectric liner is formed, and then another etch process is performed using the same mask. The etch process continues to expose interconnects formed on the first substrate and the second substrate. The opening is filled with a conductive material to form a conductive plug.

Abstract: A liquid crystal display panel including a bottom layer, a first alignment layer, a liquid crystal layer, a second alignment layer, a top layer and a plurality of conductive connectors electrically connecting the top layer and the bottom layer is provided. Each of the plurality of conductive connectors includes conductive powders.

Abstract: A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.

Abstract: Some embodiments of the present disclosure provide a semiconductor device including a substrate and a gate structure on the substrate. A first well region of a first conductivity type is in the substrate, close to a first sidewall of the gate structure. A second well region of a second conductivity type is also in the substrate close to the second sidewall of the gate structure. A conductive region is disposed in the second well region. The conductive region can be an epitaxy region. A chemical composition inside the second well region between the conductive region and the gate structure is essentially homogeneous as a chemical composition throughout the second well region.

Abstract: A MEMS device with a first electrode, a second electrode and a third electrode is disclosed. These electrodes are disposed on a substrate in such a manner that (1) a pointing direction of the first electrode is in parallel with a normal direction of the substrate, (2) a pointing direction of the third electrode is perpendicular to the pointing direction of the first electrode, (3) the second electrode includes a sensing portion and a stationary portion, (4) the first electrode and the sensing portion are configured to define a sensing capacitor, and (5) the third electrode and the stationary portion are configured to define a reference capacitor. This arrangement facilitates the MEMS device such as a differential pressure sensor, differential barometer, differential microphone and decoupling capacitor to be miniaturized.

Abstract: A MEMS apparatus comprising composite vibrating unit and the manufacturing method thereof are disclosed. The vibrating unit includes a stiffness element on which a first material is disposed. A second material being a conductive material is disposed on the first material and is extended to the stiffness element to remove electric charge on first material. When a temperature is changed, a variation direction of a Young's modulus of the first material is opposite to a variation direction of a Young's modulus of the stiffness element. The unique attributes above allow vibrating unit of the MEMS apparatus such as resonator and gyroscope to have stable resonance frequency against the change of temperature.

Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.

Abstract: One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

Abstract: The present invention provides an image capturing optical system comprising: a positive first lens element having a convex object-side surface in a paraxial region; a second lens element with refractive power; a third lens element; a fourth lens element having a concave image-side surface in a paraxial region; a plastic fifth lens element having a concave image-side surface in a paraxial region, and the image-side surface has at least one convex shape in an off-axis region thereof; and a plastic sixth lens element w having a concave image-side surface in a paraxial region, and the image-side surface has at least one convex shape in an off-axis region thereof.