Abstract: An inspection apparatus is capable for inspecting at least one light-emitting device. The inspection apparatus includes a working machine and an inspection light source. The inspection light source is disposed on the working machine and located above the light-emitting device. A dominant wavelength of the inspection light source is smaller than a dominant wavelength of the light-emitting device so as to excite the light-emitting device and get an optical property of the light-emitting device.

Abstract: An electric pencil sharpener includes a cutter carrier, and first and second cutter members mounted on the cutter carrier and having long and short blade portions. The rear end of the short blade portion is disposed forwardly of the rear end of the long blade portion. A shaving space includes a rear region disposed between the rear ends of the long and short blade portions. The rear region allows extension of a tip portion of a pencil thereinto for pushing a switch actuation unit so as to deactivate a motor when the tip portion of the pencil has been sharpened to extend a predetermined length into the rear region.

Abstract: A trench power MOSFET and a manufacturing method thereof are provided. The gate of the trench power MOSFET includes an upper doped region and a lower doped region which have different types of doping to form a PN junction. As such, when the trench power MOSFET is in operation, a junction capacitance formed at the PN junction is in series with the intrinsic gate-to-drain capacitance. Accordingly, the effective capacitance between the gate and the drain may be reduced.

Abstract: A photographing lens system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with negative refractive power has a concave image-side surface. The second lens element has refractive power. The third lens element with positive refractive power has a convex object-side surface and a convex image-side surface. The fourth lens element with negative refractive power has a concave image-side surface, wherein an object-side surface and the image-side surface of the fourth lens element are aspheric. The fifth lens element with positive refractive power has a convex object-side surface and a convex image-side surface, wherein the object-side surface and the image-side surface of the fifth lens element are aspheric.

Abstract: The invention provides a MEMS device. The MEMS device includes: a substrate; a proof mass, including at least two slots, each of the slots including an inner space and an opening, the inner space being relatively closer to a center area of the proof mass than the opening; at least two anchors located in the corresponding slots and connected to the substrate; at least two linkages located in the corresponding slots and connected to the corresponding anchors; and a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors. The multi-dimensional spring structure includes first and second springs for assisting an out-of-plane movement and an in-plane movement of the proof mass.

Abstract: A manufacturing method of wafer level chip scale package structure is provided. Firstly, a wafer including a plurality of semiconductor devices is provided. An active surface of one of the semiconductor devices has an active an active region and an outer region. A first electrode and a second electrode are arranged on the active region, and the outer region has a cutting portion and a channel portion. Next, a patterned protecting layer having a plurality of openings is formed on the active surface to respectively expose the first and second electrodes and channel portion. Subsequently, a wafer back thinning process is performed and then a back electrode layer is deposited. Subsequently, the channel portion is etched to form a trench exposing the back electrode layer, and a conductive structure connected to the back electrode layer is formed through the trench. Thereafter, the wafer is cut along the cutting portion.

Abstract: A backside illumination semiconductor image sensing device includes a semiconductor substrate. The semiconductor substrate includes a radiation sensitive diode and a peripheral region. The peripheral region is proximal to a sidewall of the backside illumination semiconductor image sensing device. The backside illumination semiconductor image sensing device further includes a first anti reflective coating (ARC) on a backside of the semiconductor substrate and a dielectric layer on the first anti reflective coating. Additionally, a radiation shielding layer is disposed on the dielectric layer. Moreover, the backside illumination semiconductor image sensing device has a photon blocking layer on the sidewall of the backside illumination semiconductor image sensing device. The at least a portion of a sidewall of the radiation shielding layer is not covered by the photon blocking layer and the photon blocking layer is configured to block photons penetrating into the semiconductor substrate.

Abstract: In a seat height adjustment method for a chair, a body height of a user of an electronic device is acquired from the electronic device which is in communication with the chair. The method further computes a target seat height suitable for the user according to the user's body height and a preset formula. The lifting device can automatically adjust the seat height for a user when the user has leave the chair and further returning the seat of the chair to an original height.

Abstract: A wireless inductive display clock includes a wireless inductive receiver module, a control circuit module, and a display unit. The wireless inductive receiver module can be, for example, an NFC module. The control circuit module is electrically connected to the wireless inductive receiver module for receiving an information signal from the wireless inductive receiver module and converting it into an information display signal, for example, time display signal. The display unit is, for example, a LCD electrically connected to the control circuit module for receiving the information display signal and drivable by the control circuit module to display the information.

Abstract: A fan-out wafer level chip package structure and the manufacturing method thereof are provided. The method includes the steps of providing a supporting plate having a removable tape formed on the supporting plate, placing a plurality of chips on the removable tape, applying an adhesive layer on a back surface of each of the chips, providing a conductive cover for covering all chips and isolating the chips from each other by a plurality of partitions, injecting a molding compound into an inside of the conductive cover and curing the molding compound for forming an encapsulation, separating the encapsulation from the supporting plate, forming a connection layer on an active surface of each of the chips to establish electrical connections, and performing a cutting process to divide the encapsulation into a plurality of the package structures.

Abstract: A wireless inductive pointer clock includes a wireless inductive receiver module for receiving a time code, a control circuit module electrically coupled to the wireless inductive receiver module for receiving the time code and converting the time code into a pointer drive signal, a movement electrically coupled to the control circuit module for receiving the pointer drive signal and driving by the control circuit module, and a pointer unit including a plurality of pointers drivable by the movement. The wireless inductive receiver module can receive the time code (hour, minute, second) of a smart phone or tablet computer, enabling the control circuit module to drive the movement and the pointers of the pointer unit so that the time on the wireless inductive pointer clock can be automatically synchronized to the time on the smart phone or tablet.

Abstract: A photographing lens system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with negative refractive power has a concave image-side surface. The second lens element has refractive power. The third lens element with positive refractive power has a convex object-side surface and a convex image-side surface. The fourth lens element with negative refractive power has a concave image-side surface, wherein an object-side surface and the image-side surface of the fourth lens element are aspheric. The fifth lens element with positive refractive power has a convex object-side surface and a convex image-side surface, wherein the object-side surface and the image-side surface of the fifth lens element are aspheric.

Abstract: An optical lens system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element has negative refractive power. The third lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof, wherein both of the surfaces thereof are aspheric. The fourth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface of the fourth lens element has at least one convex shape in an off-axis region thereof, and both of the surfaces thereof are aspheric. The optical lens system has a total of four lens elements with refractive power.

Abstract: A manufacturing method of wafer level chip scale package structure is provided. Firstly, a wafer including a plurality of semiconductor devices is provided. An active surface of one of the semiconductor devices has an active an active region and an outer region. A first electrode and a second electrode are arranged on the active region, and the outer region has a cutting portion and a channel portion. Next, a patterned protecting layer having a plurality of openings is formed on the active surface to respectively expose the first and second electrodes and channel portion. Subsequently, a wafer back thinning process is performed and then a back electrode layer is deposited. Subsequently, the channel portion is etched to form a trench exposing the back electrode layer, and a conductive structure connected to the back electrode layer is formed through the trench. Thereafter, the wafer is cut along the cutting portion.

Abstract: A liquid crystal on silicon (LCOS) display apparatus is provided, which includes a silicon substrate, a color filter layer, a first alignment layer, a second alignment layer and a liquid crystal layer. The silicon substrate has pixels arranged in a matrix. Each of the pixels has a tilting angle ranging from about 0 degrees to about 90 degrees and includes a pixel electrode. The color filter layer is disposed on the pixels. The color filter layer has a plurality of color filter units, and each of the color filter units respectively corresponds to one of the pixel electrodes. The first alignment layer is disposed on the color filter layer. The second alignment layer is disposed opposite to the first alignment layer. The liquid crystal layer is disposed between the first alignment layer and the second alignment layer. The liquid crystal layer has liquid crystal molecules with negative dielectric anisotropy.

Abstract: A wireless inductive pointer clock includes a wireless inductive receiver module for receiving a time code, a control circuit module electrically coupled to the wireless inductive receiver module for receiving the time code and converting the time code into a pointer drive signal, a movement electrically coupled to the control circuit module for receiving the pointer drive signal and driving by the control circuit module, and a pointer unit including a plurality of pointers drivable by the movement. The wireless inductive receiver module can receive the time code (hour, minute, second) of a smart phone or tablet computer, enabling the control circuit module to drive the movement and the pointers of the pointer unit so that the time on the wireless inductive pointer clock can be automatically synchronized to the time on the smart phone or tablet.

Abstract: A bicycle trainer is adapted to be arranged with a bicycle to simulate riding a bicycle on an outdoor road. The bicycle includes a stand, a roller and a resistance source. The stand is adapted to support the bicycle. The roller is pivoted to the stand and adapted to contact a bicycle wheel of the bicycle. The resistance source is coupled to the roller and provides resistance to the bicycle wheel via the roller. The resistance source varies the magnitude of the provided resistance according to the rotation speed of the roller.

Abstract: A bicycle trainer is adapted to be arranged with a bicycle to simulate riding a bicycle on an outdoor road. The bicycle includes a stand, a roller, a first resistance source and a second resistance source. The stand is adapted to support the bicycle. The roller is pivoted to the stand and is adapted to contact a bicycle wheel of the bicycle. The first resistance source is coupled to the roller and provides resistance to the bicycle wheel via the roller. The second resistance source is coupled to the roller and provides resistance to the bicycle wheel via the roller.

Abstract: A package structure and a packaging method of wafer level chip scale package are provided. The packaging method includes: providing a carrier, and disposing a plurality of chips on the carrier; forming a plurality of adhesive layers on a surface of the corresponding chips; covering a conductive cover plate, bonding the conductive cover plate with the chips through the adhesive layers, and dividing out a plurality of packaging spaces by the conductive cover plate for disposing the chips respectively; and providing an insulation material to fill the packaging spaces through via holes on the conductive cover plate to form a first insulation structure; finally, removing the carrier.

Abstract: A transparent conductive layer structure for an LED is provided. The LED includes a reflecting layer, an N-type electrode, an N-type semiconductor layer, a light emitting layer, a P-type semiconductor layer, a current block layer, a transparent conductive layer and a P-type electrode that are stacked on a substrate. The current block layer is disposed between and separates the P-type electrode and the P-type semiconductor layer. The transparent conductive layer is disposed between the P-type electrode and the current block layer, and connects to the P-type electrode and the P-type semiconductor layer. At a region corresponding to the P-type electrode, a plurality of holes are disposed at the transparent conductive layer to reduce an area of and hence an amount of light absorbed by the transparent conductive layer, thereby increasing light extraction efficiency of excited light from the light emitting layer and enhancing light emitting efficiency of the LED.