Patents by Inventor Wen Hsu

Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SIGNAL PROCESSING METHOD OF MULTIPLE MIRCO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICES AND COMBO MEMS DEVICE APPLYING THE METHOD
    Publication number: 20150355523
    Abstract: This invention provides a signal processing method of multiple micro-electro-mechanical system devices. The signal processing method includes: providing at least two MEMS devices; applying driving or modulating signals of different frequencies to the MEMS devices such that the MEMS devices generate respective MEMS signals with respective frequencies; and combining the MEMS signals with respective frequencies into one or more multi-frequency signals and outputting the multi-frequency signals, wherein a number of the multi-frequency signals is less than a number of the MEMS signals with respective frequencies. This invention also provides a combo MEMS device integrating two or more MEMS devices and two or more vibration sources.
    Type: Application
    Filed: April 1, 2015
    Publication date: December 10, 2015
    Applicant: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Yu-Wen Hsu, Ying-Che Lo, Lu-Po Liao, Chia-Yu Wu
  • MIM CAPACITOR AND METHOD OF FORMING THE SAME
    Publication number: 20150349047
    Abstract: According to an exemplary embodiment, a method of forming a MIM capacitor is provided. The method includes the following operations: providing a first metal layer; providing a dielectric layer over the first metal layer; providing a second metal layer over the dielectric layer; etching the second metal layer to define the metal-insulator-metal capacitor; and oxidizing a sidewall of the second metal layer. According to an exemplary embodiment, a MIM capacitor is provided. The MIM capacitor includes a first metal layer; a dielectric layer over the first metal layer; a second metal layer over the dielectric layer; and an oxidized portion in proximity to the second metal layer and made of oxidized second metal layer.
    Type: Application
    Filed: May 27, 2014
    Publication date: December 3, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chih-Wei KAO, Chun-Chieh HUANG, Hsiao-Hui YU, Hao-Wen HSU, Pin-Cheng HSU, Chia-Der CHANG
  • PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20150325762
    Abstract: A package structure and a manufacturing method thereof are disclosed. The package structure includes: a substrate; at least one light emitting diode disposed on the substrate by eutectic bonding; and at least one Zener diode disposed on the substrate by at least one silver glue. The method of manufacturing the package structure includes: providing a substrate; performing a eutectic bonding process to dispose at least one light emitting diode on the substrate; and performing a silver glue bonding process at room temperature to dispose at least one Zener diode on the substrate.
    Type: Application
    Filed: April 23, 2015
    Publication date: November 12, 2015
    Inventors: Shou-Wen Hsu, Yu-Feng Lin, Cheng-Bin Liu, Tai-Cheng Tsai, Chin-Hua Hung
  • LIQUID CRYSTAL DISPLAY PANEL
    Publication number: 20150277167
    Abstract: A liquid crystal display panel including a bottom layer, a first alignment layer, a liquid crystal layer, a second alignment layer, a top layer and a plurality of conductive connectors electrically connecting the top layer and the bottom layer is provided. Each of the plurality of conductive connectors includes conductive powders.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 1, 2015
    Applicant: Himax Display, Inc.
    Inventors: Wen-Hsu Chen, Hsing-Lung Wang, Yuet-Wing Li, Kuan-Hsu Fan-Chiang
  • TRENCH POWER MOSFET AND MANUFACTURING METHOD THEREOF
    Publication number: 20150270384
    Abstract: A trench power MOSFET and a manufacturing method thereof are provided. The gate of the trench power MOSFET includes an upper doped region and a lower doped region which have different types of doping to form a PN junction. As such, when the trench power MOSFET is in operation, a junction capacitance formed at the PN junction is in series with the intrinsic gate-to-drain capacitance. Accordingly, the effective capacitance between the gate and the drain may be reduced.
    Type: Application
    Filed: January 20, 2015
    Publication date: September 24, 2015
    Inventor: HSIU-WEN HSU
  • PACKAGE STRUCTURE AND PACKAGING METHOD OF WAFER LEVEL CHIP SCALE PACKAGE
    Publication number: 20150262843
    Abstract: A package structure and a packaging method of wafer level chip scale package are provided. The packaging method includes: providing a carrier, and disposing a plurality of chips on the carrier; forming a plurality of adhesive layers on a surface of the corresponding chips; covering a conductive cover plate, bonding the conductive cover plate with the chips through the adhesive layers, and dividing out a plurality of packaging spaces by the conductive cover plate for disposing the chips respectively; and providing an insulation material to fill the packaging spaces through via holes on the conductive cover plate to form a first insulation structure; finally, removing the carrier.
    Type: Application
    Filed: December 18, 2014
    Publication date: September 17, 2015
    Applicants: Super Group Semiconductor Co., LTD., NIKO SEMICONDUCTOR CO., LTD.
    Inventors: Chih-Cheng Hsieh, Hsiu-Wen Hsu, Chun-Ying Yeh, Chung-Ming Leng
  • MIRCO-ELECTRO-MECHANICAL SYSTEM PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF
    Publication number: 20150260593
    Abstract: The invention provides a micro-electro-mechanical system pressure sensor. The micro-electro-mechanical system pressure sensor includes: a substrate, including at least one conductive wiring; a membrane disposed above the substrate to form a semi-open chamber between the membrane and the substrate, the semi-open chamber having an opening to receive an external pressure; and a cap, disposed above the membrane and forming an enclosed space with the membrane, the cap including a top electrode corresponding to the membrane and at least one portion of the membrane forming a bottom electrode, wherein the top and bottom electrodes form a sensing capacitor to sense the external pressure.
    Type: Application
    Filed: July 11, 2014
    Publication date: September 17, 2015
    Applicant: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Yu-Wen Hsu, Chia-Yu Wu, Shih-Chieh Lin, Shih-Ting Lin
  • Structure and fabrication method of a sensing device
    Patent number: 9133018
    Abstract: A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.
    Type: Grant
    Filed: October 2, 2009
    Date of Patent: September 15, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Lung-Tai Chen, Yu-Wen Hsu, Sheah Chen, Jing-Yuan Lin, Li-Chi Pan, Tzong-Che Ho
  • Trench power MOSFET and manufacturing method thereof
    Patent number: 9130035
    Abstract: A trench power MOSFET and a manufacturing method thereof are provided. The trench power MOSFET has a buried oxide layer formed in the epitaxial layer, wherein the buried oxide layer is located under a body region for changing a vertical electric field distribution to increase a breakdown voltage of the MOSFET, thereby obtaining a lower on-state resistance.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: September 8, 2015
    Assignee: SUPER GROUP SEMICONDUCTOR CO., LTD.
    Inventor: Hsiu-Wen Hsu
  • Carbon nanotube powders and methods for manufacturing the same and composite materials
    Patent number: 9115271
    Abstract: Disclosed is a carbon nanotube powder, including a carbon nanotube averagely mixed with a dispersant, wherein the carbon nanotube and the dispersant have a weight ratio of 30:70 to 90:10. The carbon nanotube has a diameter of 10 nm to 100 nm, and a length/diameter ratio of 100:1 to 5000:1. The dispersant is an alternative copolymer, a block copolymer, or a random copolymer polymerized of a solvation segment (A) and a carbon affinity group (B). The carbon nanotube powder can be blended with a thermoplastic material to form a composite, wherein the carbon nanotube and the composite have a weight ratio of 0.5:100 to 50:100.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: August 25, 2015
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: An-En Hsiao, Shinn-Jen Chang, Shu-Ya Tsai, Mei-Wen Hsu
  • Network communication system with packet forwarding and method of operation thereof
    Patent number: 9088476
    Abstract: A method of operation of a network communication system includes: analyzing a packet header by: loading a packet input register, generating a forwarding hash from the packet input register, and identifying a routing update by comparing the forwarding hash; accessing a packet analysis bus for updating the packet header; and enabling a routing switch for forwarding a packet including the packet header updated.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: July 21, 2015
    Assignee: Cortina Access, Inc.
    Inventors: Xiaochong Cao, Wen Hsu, Jian-Jr Li, Chih-Hsien Hsu
  • TRENCH POWER MOSFET AND MANUFACUTRING METHOD THEREOF
    Publication number: 20150200294
    Abstract: A trench power MOSFET and a manufacturing method thereof are provided. The trench power MOSFET has a buried oxide layer formed in the epitaxial layer, wherein the buried oxide layer is located under a body region for changing a vertical electric field distribution to increase a breakdown voltage of the MOSFET, thereby obtaining a lower on-state resistance.
    Type: Application
    Filed: July 28, 2014
    Publication date: July 16, 2015
    Inventor: HSIU-WEN HSU
  • Light source structure of projector
    Patent number: 9057939
    Abstract: A light source structure of a projector includes at least a solid state lighting element, at least an optical collimator lens, a condenser lens, and a light dispersing apparatus. The solid state lighting element generates a plurality of radial beams, which are incident, to the optical collimator lens. The optical collimator lens converts the radial beams into a plurality of parallel beams which strike the condenser lens. The parallel beams are concentrated and focused by the condenser lens into a projecting beam. The light dispersing apparatus is positioned on at a focal point of the condenser lens and receives the projecting beam to scatter the projecting beam uniformly.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: June 16, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chien-Wen Hsu, Wen-Pin Yeh
  • SHOCK ABSORBING AND PRESSURE RELEASING DAMPER APPARATUS FOR SHOE INSOLE
    Publication number: 20150157091
    Abstract: A shock absorbing and pressure releasing damper apparatus for a shoe insole, wherein the damper apparatus comprises: an upper board having a plurality of upper mounting portions on a bottom thereof; a lower board arranged at the bottom of the upper board and having a plurality of lower mounting portions corresponding to the upper mounting portions of the upper board on a top thereof; a plurality of elastic members arranged between the upper mounting portions of the upper board and the lower mounting portions of the lower board; a plurality of magnets arranged inside the upper and lower mounting portions of the upper and lower boards and at centers of the elastic members; wherein the damper apparatus further includes a shoe body having an insole portion with a concave portion; a pad is provided on a top of the damper apparatus. Accordingly, the damper apparatus rises and lowers as appropriate.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 11, 2015
    Inventor: Ming-Wen Hsu
  • LOOP TOWER CO2 CAPTURE SYSTEM, CARBONATOR, CALCINER AND OPERATING METHOD THEREOF
    Publication number: 20150157978
    Abstract: A loop tower CO2 capture system includes a feeding unit, a carbonator, an accumulator, a calciner, a combustion chamber and a gas blower. The feeding unit has a first gas pipe. The carbonator includes multiple first cyclone dust collecting units. The first gas pipe has one end connected to the uppermost first cyclone dust collecting unit. The accumulator is connected to the lowermost first cyclone dust collecting unit, and is located between the carbonator and the calciner. The calciner includes multiple second cyclone dust collecting units. The accumulator is connected to the uppermost second cyclone dust collecting unit. The first gas pipe has the other end connected to the lowermost second cyclone dust collecting unit. The combustion chamber is connected to the lowermost second cyclone dust collecting unit. The gas blower is connected to the first gas pipe of the feeding unit.
    Type: Application
    Filed: May 12, 2014
    Publication date: June 11, 2015
    Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN CEMENT CORPORATION
    Inventors: Wei-Cheng Chen, Shoung Ouyang, Chin-Ming Huang, Cheng-Hsien Shen, Heng-Wen Hsu
  • Microelectromechanical system device with electrical interconnections and method for fabricating the same
    Patent number: 9051170
    Abstract: A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: June 9, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Chao-Ta Huang, Yu-Wen Hsu, Chin-Fu Kuo
  • ELECTROMAGNETIC DRIVING MODULE AND LENS DEVICE USING THE SAME
    Publication number: 20150155768
    Abstract: The disclosure discloses an electromagnetic driving module which includes a base, two magnetic elements, a wiring assembly, a reference element, and a sensor element. The two magnetic elements are arranged along a reference line and positioned at two sides of the base. The wiring assembly is connected to the base and arranged adjacent to the two magnetic elements. The reference element is positioned on the base. The sensor element is adjacent to the reference elements and configured to detect the movement of the reference element to position the base. A lens device using the electromagnetic driving module is also disclosed.
    Type: Application
    Filed: October 10, 2014
    Publication date: June 4, 2015
    Inventors: SHANGYU HSU, NAI-WEN HSU
  • Micro-electro-mechanical-system device with oscillating assembly
    Patent number: 9046367
    Abstract: A micro-electro-mechanical-system (MEMS) device comprising two proof masses disposed in the first frame, such that the MEMS device with oscillating assemblies senses the angular velocity in the two axes, respectively. The MEMS device with oscillating assemblies further comprises a lever structure and two oscillating assemblies connecting at two opposite ends of the lever structure, such that the oscillating assemblies move in opposite directions synchronously. The MEMS device with oscillating assemblies further comprises a spring assembly connected between the proof mass and a movable electrode, restricting the proof mass to drive the movable electrode to only move in a specific direction.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: June 2, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Chung-Yuan Su, Chao-Ta Huang, Shih-Chieh Lin, Yu-Wen Hsu
  • Methods for achieving width control in etching processes
    Patent number: 9040317
    Abstract: A method includes performing a patterning step on a layer using a process gas. When the patterning step is performed, a signal strength is monitored, wherein the signal strength is from an emission spectrum of a compound generated from the patterning step. The compound includes an element in the patterned layer. At a time the signal strength is reduced to a pre-determined threshold value, the patterning step is stopped.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: May 26, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Ying Liao, Szu-Hung Yang, Chiung Wen Hsu
  • Table clock
    Patent number: D733577
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: July 7, 2015
    Inventor: Hua Wen Hsu