Patents by Inventor Wen Hsu

Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DETECTION APPARATUS FOR LIGHT-EMITTING DIODE CHIP
    Publication number: 20140159733
    Abstract: A detection apparatus for light-emitting diode chip comprising a light-collecting apparatus having an opening, a bracing component and a probing device is disclosed. The bracing component is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two flexible current-transporting elements. The two ends of the current-transporting elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Besides, the detection apparatus for light-emitting diode chip of the present invention further comprises a thimble to push the light-emitting diode chip into the inside of the light-collecting apparatus via the opening such that the light beams emitted by the light-emitting diode chip are collected by the light-collecting apparatus.
    Type: Application
    Filed: March 15, 2013
    Publication date: June 12, 2014
    Applicant: GENESIS PHOTONICS INC
    Inventors: TAI-CHENG TSAI, TAI-WEI WU, HSIN-HUNG LIN, PING-TSUNG TSAI, GWO-JIUN SHEU, SHOU-WEN HSU, YUN-LI LI
  • Micro-Image Acquisition and Transmission System
    Publication number: 20140158862
    Abstract: A micro-image acquisition and transmission system is provided. In a preferred embodiment, the system is comprised of an image acquisition chip comprising an electronic imager, control electronics and a micro powered rotary stage comprising a transceiver array that acts as a hub to optically link a group of distributed image acquisition chips. A preferred embodiment is further comprised of a transceiver array chip comprising one or more micro-powered rotary stages having a transceiver array assembly disposed thereon. The micro-powered rotary stage is supported by a micro-brush bearing.
    Type: Application
    Filed: December 11, 2012
    Publication date: June 12, 2014
    Inventor: Ying Wen Hsu
  • DETECTION APPARATUS FOR LIGHT-EMITTING DIODE CHIP
    Publication number: 20140159732
    Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.
    Type: Application
    Filed: March 15, 2013
    Publication date: June 12, 2014
    Applicant: GENESIS PHOTONICS INC
    Inventors: TAI-WEI WU, TAI-CHENG TSAI, Hsin-Hung Lin, Ping-Tsung Tsai, Pei-Yi Huang, Gwo-Jiun Sheu, Shou-Wen Hsu, YUN-LI LI
  • Semiconductor structure with low resistance of substrate and low power consumption
    Patent number: 8729632
    Abstract: A semiconductor structure comprising a semiconductor unit, a first conductive structure, a first conductive plug, and a second conductive structure is provided. The semiconductor unit has a substrate on a first side of the semiconductor unit. The substrate has at least a hole. The first conductive plug is in the hole and the hole may be full of the conductive plug. The first conductive structure is on the surface of the semiconductor unit. The surface is at the first side of the semiconductor unit. The second conductive structure is on a surface at a second side of the substrate of the semiconductor unit.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: May 20, 2014
    Assignee: Niko Semiconductor Co., Ltd.
    Inventors: Hsiu Wen Hsu, Chih Cheng Hsieh
  • PROTECTIVE DEVICE AND PROTECTIVE MODULE
    Publication number: 20140133059
    Abstract: A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided.
    Type: Application
    Filed: January 23, 2014
    Publication date: May 15, 2014
    Applicant: CYNTEC CO., LTD.
    Inventors: Chung-Hsiung WANG, Hung-Ming LIN, Lang-Yi CHIANG, Wen-Shiang LUO, Kuo-Shu CHEN, Han-Yang CHUNG, Hui-Wen HSU, Po-Wei SU, Hong-Ming CHEN
  • Organic-inorganic metal oxide hybrid resin, a method for forming the same, and transparent resin composition formed therefrom
    Patent number: 8721919
    Abstract: In one embodiment, an organic-inorganic metal oxide hybrid resin having the following formula: wherein each R1 is independently a substituted or non-substituted C1 to C10 alkyl group; each R2 is independently a substituted or non-substituted C1 to C10 alkyl group or benzyl group; n is a positive integer from 3 to 30; and each Y is independently (MO4/2)l[(MO)(4-a)/2M(OH)a/2]m[MO(4-b)/2M(OZ)b/2]p, wherein M is a metal; l is a positive integer from 10 to 90; m is a positive integer from 2 to 20; p is a positive integer from 4 to 15; a is a positive integer from 1 to 2; b is a positive integer from 1 to 2; and Z is an organosilane group.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: May 13, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Shu-Chen Huang, Wen-Bin Chen, Hsun-Tien Li, Chia-Wen Hsu
  • Power semiconductor device and fabrication method thereof
    Patent number: 8716787
    Abstract: A fabrication method of a power semiconductor device is provided. Firstly, a plurality of trenched gate structures is formed in the base. Then, a body mask is used for forming a pattern layer on the base. The pattern layer has at least a first open and a second open for forming at least a body region and a heavily doped region in the base respectively. Then, a shielding structure is formed on the base to fill the second open and line at least a sidewall of the first open. Next, a plurality of source doped regions is formed in the body region by using the pattern layer and the shielding structure as the mask. Then, an interlayer dielectric layer is formed on the base and a plurality of source contact windows is formed therein to expose the source doped regions.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: May 6, 2014
    Assignee: Super Group Semiconductor Co., Ltd.
    Inventors: Sung-Nien Tang, Hsiu-Wen Hsu
  • Image lens assembly
    Patent number: 8717687
    Abstract: An image lens assembly includes, in order from an object side to an image side, the first lens element with positive refractive power having a convex object-side surface, the second lens element with negative refractive power, the third lens element with refractive power, the fourth lens element with positive refractive power made of plastic material, the fifth lens element with negative refractive power made of plastic material. At least one surface of the third lens element, the fourth lens element and the fifth lens element are aspheric.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: May 6, 2014
    Assignee: Largan Precision Co., Ltd.
    Inventors: Chih-Wen Hsu, Tsung-Han Tsai, Ming-Ta Chou
  • Circuit sharing time delay integrator
    Patent number: 8704580
    Abstract: The present invention discloses a circuit sharing time delay integrator structure. The major composing elements of this circuit sharing time delay integrator structure are: a sharing circuit, a first control block, a plurality of second control blocks and a timing set generated by a timing generator circuit. The sharing circuit can be an OP-AMP, an active load, or any of a variety of combinations used in signal accumulation applications. With the implementation of the present invention to applications of signal accumulations, the necessity of an adder circuitry is eliminated, the overall circuitry and hence the total amount of transistors required when producing the integrated circuit is massively reduced, and thus a great cost reduction and better timing and power efficiency can all be thereof achieved.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: April 22, 2014
    Assignee: National Applied Research Laboratories
    Inventors: Chin-Fong Chiu, Hann-Huei Tsai, Wen-Hsu Chang, Chih-Cheng Hsieh, Kuo-Wei Cheng
  • Micro-electromechanical system device having electrical insulating structure and manufacturing methods
    Patent number: 8695426
    Abstract: The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: April 15, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu Wen Hsu, Shih Ting Lin, Jen Yi Chen, Chao Ta Huang
  • Light source device and projector
    Patent number: 8690351
    Abstract: A projector includes a projection lens set, a digital micro-mirror device, a prism unit, a light merging unit, a light guide unit, and a light source device. The light source device includes a laser light source and a color wheel. The laser light source is positioned in a straight optical path and generates a first light. The color wheel is positioned in the straight optical path. The first light irradiates the color wheel to generate a second light and the third light. The light merging unit merges the first, second, and third lights to generate a mixed light. The light guide unit guides the mixed light to the prism unit. The mixed light is refracted to the DMD via the prism unit, and then the refracted mixed light is reflected to the projection lens set via the DMD.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: April 8, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chien-Wen Hsu, Wen-Pin Yeh
  • Three-Axis Nano-Resonator Accelerometer Device and Method
    Publication number: 20140090471
    Abstract: An inertial measurement device and method for measuring acceleration in three axes. Three orthogonally disposed accelerometers are defined on a common planar substrate. At least one of the accelerometers is provided with a proof mass coupled to a nano-resonator element. The nano-resonator element is oscillated at a first predetermined frequency, which may be a first resonant frequency, and is altered to oscillate at a second frequency, which may be a second resonant frequency, in response to a resultant force produced by the acceleration of the proof mass. The degree of change in nano-resonator element output frequency is sensed and processed using suitable processing circuitry as a change in acceleration on the active axis.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 3, 2014
    Inventor: Ying Wen Hsu
  • DETECTION APPARATUS FOR LIGHT-EMITTING DIODE CHIPS
    Publication number: 20140084931
    Abstract: A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 27, 2014
    Applicant: GENESIS PHOTONICS INC
    Inventors: TAI-WEI WU, TAI-CHENG TSAI, GWO-JIUN SHEU, SHOU-WEN HSU, YUN-LI LI
  • DETECTION APPARATUS
    Publication number: 20140084191
    Abstract: A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 27, 2014
    Applicant: GENESIS PHOTONICS INC
    Inventors: TAI-CHENG TSAI, TAI-WEI WU, GWO-JIUN SHEU, SHOU-WEN HSU, YUN-LI LI
  • IMAGE CAPTURING LENS ASSEMBLY
    Publication number: 20140078601
    Abstract: An image capturing lens assembly includes, in order from an object-side to an image-side along an optical axis, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element with negative refractive power has an image-side surface being concave at a paraxial region. The second lens element with positive refractive power has an image-side surface being convex at a paraxial region. The third lens element with negative refractive power has an object-side surface being concave at a paraxial region, and an image-side surface being convex at a paraxial region. The fourth lens element with positive refractive power has an object-side surface being convex at a paraxial region, and an image-side surface being concave at a paraxial region, and at least one of the object-side surface and the image-side surface is aspheric.
    Type: Application
    Filed: February 8, 2013
    Publication date: March 20, 2014
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Chih-Wen Hsu, Tsung-Han Tsai, Wei-Yu Chen
  • Sidewall for Backside Illuminated Image Sensor Metal Grid and Method of Manufacturing Same
    Publication number: 20140065756
    Abstract: The present disclosure provides an image sensor device and a method for manufacturing the image sensor device. An exemplary image sensor device includes a substrate having a front surface and a back surface; a plurality of sensor elements disposed at the front surface of the substrate, each of the plurality of sensor elements being operable to sense radiation projected towards the back surface of the substrate; a radiation-shielding feature disposed over the back surface of the substrate and horizontally disposed between each of the plurality of sensor elements; a dielectric feature disposed between the back surface of the substrate and the radiation-shielding feature; and a metal layer disposed along sidewalls of the dielectric feature.
    Type: Application
    Filed: November 22, 2013
    Publication date: March 6, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Wen Hsu, Shih-Chang Liu, Yeur-Luen Tu
  • Back Frame Module
    Publication number: 20140048658
    Abstract: A back frame module includes a base plate, two locking plate members, a cable organizing plate, and a stowage plate. The base plate is adapted to be provided on a rear face of a display. The locking plate members, the cable organizing plate, and the stowage plate are selectively connected to the base plate. The locking plate members are adapted for mounting of a computer device therebetween. The cable organizing plate is adapted to stow a cable of the display or of the computer device. The stowage plate is adapted to stow an adapter of the display or other accessories. The locking plate members, the cable organizing plate, and the stowage plate can be selectively substituted by a support plate. The back frame module thus has various states of use to satisfy different user requirements.
    Type: Application
    Filed: August 1, 2013
    Publication date: February 20, 2014
    Applicant: Aopen Inc.
    Inventors: Chih-Hsiung Chen, Yao-Wen Hsu, Shuang-Ji Jiang, Hong-Chang Liu, Wen-Hsi Tsai
  • Optical image lens assembly
    Patent number: 8649115
    Abstract: An optical image lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has a convex object-side surface and a convex image-side surface. The second lens element with refractive power has a concave object-side surface and a convex image-side surface. The third lens element with refractive power has two surfaces being aspheric. The fourth lens element with positive refractive power has a convex image-side surface, wherein the surfaces of the fourth lens element are aspheric. The fifth lens element with negative refractive power has a concave image-side surface, wherein the surfaces of the fifth lens element are aspheric, and the fifth lens element has inflection points on at least one of the surfaces thereof.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: February 11, 2014
    Assignee: Largan Precision Co., Ltd.
    Inventors: Chun-Shan Chen, Chih-Wen Hsu, Hsin-Hsuan Huang
  • Pedometer
    Patent number: D700084
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: February 25, 2014
    Inventor: Hua Wen Hsu
  • Magnifying glass
    Patent number: D703718
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: April 29, 2014
    Inventor: Hua Wen Hsu