Patents by Inventor Wen Hsu

Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for preventing etch arcing during semiconductor processing
    Patent number: 8791571
    Abstract: A method for preventing arcing during processing of a back side of a semiconductor wafer is provided herein. The method comprising includes steps of depositing a dielectric layer over the back side and depositing an anti-arcing layer over the dielectric layer. The anti-arcing layer is a conductive layer, but it not suitable for conducting signals or power. The method further includes etching an opening through a plurality of material layers of the semiconductor wafer. The opening exposes a conductive layer located on a front side of the semiconductor wafer. Additionally, the method includes depositing a conductive layer in the opening to form a through-wafer interconnect. A semiconductor wafer fabricated according to the method is also disclosed.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: July 29, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Wen Hsu, Tung-Ting Wu, Jiech-Fun Lu, Yeur-Luen Tu, Chia-Shiung Tsai
  • Method of manufacturing the trench power semiconductor structure
    Patent number: 8785277
    Abstract: A method of manufacturing a trench power semiconductor structure is provided. The method comprising the steps of: providing a base, forming a dielectric pattern layer on the base to define an active region and a terminal region, wherein a portion of the base in the active region and the terminal region is covered by the dielectric pattern layer; selectively forming a first epitaxial layer on the base without being covered by the dielectric pattern layer; removing the dielectric pattern layer in the active region to form a gate trench on the base, and forming a gate dielectric layer on the first epitaxial layer and on the inner surface of the gate trench; forming the gate structure in the gate trench; utilizing the dielectric pattern layer to forming a body on or in the first epitaxial layer; and forming a source on the upper portion of the body.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: July 22, 2014
    Assignee: Super Group Semiconductor Co., Ltd.
    Inventor: Hsiu-Wen Hsu
  • MANUFACTURING METHODS FOR MICRO-ELECTROMECHANICAL SYSTEM DEVICE HAVING ELECTRICAL INSULATING STRUCTURE
    Publication number: 20140186987
    Abstract: The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.
    Type: Application
    Filed: February 19, 2014
    Publication date: July 3, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: YU WEN HSU, SHIH TING LIN, JEN YI CHEN, CHAO TA HUANG
  • Sensing device and manufacturing method thereof
    Patent number: 8763457
    Abstract: A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: July 1, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Lung-Tai Chen, Yu-Wen Hsu, Tzong-Che Ho, Li-Chi Pan
  • Detection apparatus
    Patent number: 8767198
    Abstract: A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 1, 2014
    Assignee: Genesis Photonics Inc
    Inventors: Tai-Cheng Tsai, Tai-Wei Wu, Gwo-Jiun Sheu, Shou-Wen Hsu, Yun-Li Li
  • MEMS DEVICE WITH MULTIPLE ELECTRODES AND FABRICATING METHOD THEREOF
    Publication number: 20140175572
    Abstract: A MEMS device with a first electrode, a second electrode and a third electrode is disclosed. These electrodes are disposed on a substrate in such a manner that (1) a pointing direction of the first electrode is in parallel with a normal direction of the substrate, (2) a pointing direction of the third electrode is perpendicular to the pointing direction of the first electrode, (3) the second electrode includes a sensing portion and a stationary portion, (4) the first electrode and the sensing portion are configured to define a sensing capacitor, and (5) the third electrode and the stationary portion are configured to define a reference capacitor. This arrangement facilitates the MEMS device such as a differential pressure sensor, differential barometer, differential microphone and decoupling capacitor to be miniaturized.
    Type: Application
    Filed: December 2, 2013
    Publication date: June 26, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: YU WEN HSU, CHIN FU KUO, CHAO TA HUANG, CHUN KAI MAO, CHIN HUNG WANG
  • PREFILLABLE AUTO-RETRACTABLE SAFETY SYRINGE
    Publication number: 20140180216
    Abstract: A retractable safety syringe includes a retractable needle hub holding a needle and having a first guiding means; and a hollow barrel having a second guiding means set correspondingly to the first guiding means; and a collapsible plunger comprising of a first plunger element having a protrusion releasably coupled with a second plunger element having a longitudinal slot with a pinched zone to curb the movement of said protrusion; and a spring disposed between the needle hub and hollow barrel and acts between the needle hub and the hollow barrel. The uncoupling of the collapsible plunger triggers the retraction mechanism to enable the needle hub to retract into the barrel by the decompression force of a spring. The reliability of retraction is further improved by a longitudinal slot and a protrusion to facilitate the retreating of the collapsible plunger in an orderly way.
    Type: Application
    Filed: November 15, 2013
    Publication date: June 26, 2014
    Applicant: BENCHA INTERNATIONAL GROUP INC.
    Inventors: Lee LIN LEE, Wen-Hsu CHANG
  • Light source device and projector
    Patent number: 8757810
    Abstract: A projector includes a projection lens set, a DMD, a prism unit, a light guide unit, and a light source device. The light source device includes a first and a second LEDs, a laser light source, and a color wheel. The first LED is positioned in a first optical path and generates a first light. The laser light source is positioned in a second optical path and generates a laser light. The second LED is positioned in a third optical path and generates a second light. The laser light irradiates the color wheel to generate a third light. A light merging unit merges the first, second, and third lights. The light guide unit guides the mixed light to the prism unit. The mixed light is refracted to the DMD via the prism unit. The refracted mixed light is reflected to the projection lens set via the DMD.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: June 24, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chien-Wen Hsu, Wen-Pin Yeh
  • SPLITTING APPARATUS
    Publication number: 20140166716
    Abstract: A splitting apparatus suitable to split a work piece along at least one cutting line formed on the work piece is provided. The splitting apparatus includes a chopper, a detector, a controller and an adjustor. The chopper is disposed above the work piece. The detector is disposed above the work piece for transmitting a signal to the work piece so as to get a specification data of the work piece. The controller connects the detector and receives the specification data and generates an adjustment data. The adjustor connects the controller and the chopper. The adjustor receives the adjustment data and adjusts a parameter data of the chopper according to the adjustment data so that the chopper splits the work piece for once along the cutting line formed on the work piece.
    Type: Application
    Filed: June 13, 2013
    Publication date: June 19, 2014
    Applicant: GENESIS PHOTONICS INC.
    Inventors: Tai-Cheng Tsai, Yung-Tsung Lin, Gwo-Jiun Sheu, Shou-Wen Hsu
  • DETECTION APPARATUS FOR LIGHT-EMITTING DIODE CHIP
    Publication number: 20140159732
    Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.
    Type: Application
    Filed: March 15, 2013
    Publication date: June 12, 2014
    Applicant: GENESIS PHOTONICS INC
    Inventors: TAI-WEI WU, TAI-CHENG TSAI, Hsin-Hung Lin, Ping-Tsung Tsai, Pei-Yi Huang, Gwo-Jiun Sheu, Shou-Wen Hsu, YUN-LI LI
  • DETECTION APPARATUS FOR LIGHT-EMITTING DIODE CHIP
    Publication number: 20140159733
    Abstract: A detection apparatus for light-emitting diode chip comprising a light-collecting apparatus having an opening, a bracing component and a probing device is disclosed. The bracing component is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two flexible current-transporting elements. The two ends of the current-transporting elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Besides, the detection apparatus for light-emitting diode chip of the present invention further comprises a thimble to push the light-emitting diode chip into the inside of the light-collecting apparatus via the opening such that the light beams emitted by the light-emitting diode chip are collected by the light-collecting apparatus.
    Type: Application
    Filed: March 15, 2013
    Publication date: June 12, 2014
    Applicant: GENESIS PHOTONICS INC
    Inventors: TAI-CHENG TSAI, TAI-WEI WU, HSIN-HUNG LIN, PING-TSUNG TSAI, GWO-JIUN SHEU, SHOU-WEN HSU, YUN-LI LI
  • Micro-Image Acquisition and Transmission System
    Publication number: 20140158862
    Abstract: A micro-image acquisition and transmission system is provided. In a preferred embodiment, the system is comprised of an image acquisition chip comprising an electronic imager, control electronics and a micro powered rotary stage comprising a transceiver array that acts as a hub to optically link a group of distributed image acquisition chips. A preferred embodiment is further comprised of a transceiver array chip comprising one or more micro-powered rotary stages having a transceiver array assembly disposed thereon. The micro-powered rotary stage is supported by a micro-brush bearing.
    Type: Application
    Filed: December 11, 2012
    Publication date: June 12, 2014
    Inventor: Ying Wen Hsu
  • Semiconductor structure with low resistance of substrate and low power consumption
    Patent number: 8729632
    Abstract: A semiconductor structure comprising a semiconductor unit, a first conductive structure, a first conductive plug, and a second conductive structure is provided. The semiconductor unit has a substrate on a first side of the semiconductor unit. The substrate has at least a hole. The first conductive plug is in the hole and the hole may be full of the conductive plug. The first conductive structure is on the surface of the semiconductor unit. The surface is at the first side of the semiconductor unit. The second conductive structure is on a surface at a second side of the substrate of the semiconductor unit.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: May 20, 2014
    Assignee: Niko Semiconductor Co., Ltd.
    Inventors: Hsiu Wen Hsu, Chih Cheng Hsieh
  • PROTECTIVE DEVICE AND PROTECTIVE MODULE
    Publication number: 20140133059
    Abstract: A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided.
    Type: Application
    Filed: January 23, 2014
    Publication date: May 15, 2014
    Applicant: CYNTEC CO., LTD.
    Inventors: Chung-Hsiung WANG, Hung-Ming LIN, Lang-Yi CHIANG, Wen-Shiang LUO, Kuo-Shu CHEN, Han-Yang CHUNG, Hui-Wen HSU, Po-Wei SU, Hong-Ming CHEN
  • Organic-inorganic metal oxide hybrid resin, a method for forming the same, and transparent resin composition formed therefrom
    Patent number: 8721919
    Abstract: In one embodiment, an organic-inorganic metal oxide hybrid resin having the following formula: wherein each R1 is independently a substituted or non-substituted C1 to C10 alkyl group; each R2 is independently a substituted or non-substituted C1 to C10 alkyl group or benzyl group; n is a positive integer from 3 to 30; and each Y is independently (MO4/2)l[(MO)(4-a)/2M(OH)a/2]m[MO(4-b)/2M(OZ)b/2]p, wherein M is a metal; l is a positive integer from 10 to 90; m is a positive integer from 2 to 20; p is a positive integer from 4 to 15; a is a positive integer from 1 to 2; b is a positive integer from 1 to 2; and Z is an organosilane group.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: May 13, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Shu-Chen Huang, Wen-Bin Chen, Hsun-Tien Li, Chia-Wen Hsu
  • Image lens assembly
    Patent number: 8717687
    Abstract: An image lens assembly includes, in order from an object side to an image side, the first lens element with positive refractive power having a convex object-side surface, the second lens element with negative refractive power, the third lens element with refractive power, the fourth lens element with positive refractive power made of plastic material, the fifth lens element with negative refractive power made of plastic material. At least one surface of the third lens element, the fourth lens element and the fifth lens element are aspheric.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: May 6, 2014
    Assignee: Largan Precision Co., Ltd.
    Inventors: Chih-Wen Hsu, Tsung-Han Tsai, Ming-Ta Chou
  • Power semiconductor device and fabrication method thereof
    Patent number: 8716787
    Abstract: A fabrication method of a power semiconductor device is provided. Firstly, a plurality of trenched gate structures is formed in the base. Then, a body mask is used for forming a pattern layer on the base. The pattern layer has at least a first open and a second open for forming at least a body region and a heavily doped region in the base respectively. Then, a shielding structure is formed on the base to fill the second open and line at least a sidewall of the first open. Next, a plurality of source doped regions is formed in the body region by using the pattern layer and the shielding structure as the mask. Then, an interlayer dielectric layer is formed on the base and a plurality of source contact windows is formed therein to expose the source doped regions.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: May 6, 2014
    Assignee: Super Group Semiconductor Co., Ltd.
    Inventors: Sung-Nien Tang, Hsiu-Wen Hsu
  • Circuit sharing time delay integrator
    Patent number: 8704580
    Abstract: The present invention discloses a circuit sharing time delay integrator structure. The major composing elements of this circuit sharing time delay integrator structure are: a sharing circuit, a first control block, a plurality of second control blocks and a timing set generated by a timing generator circuit. The sharing circuit can be an OP-AMP, an active load, or any of a variety of combinations used in signal accumulation applications. With the implementation of the present invention to applications of signal accumulations, the necessity of an adder circuitry is eliminated, the overall circuitry and hence the total amount of transistors required when producing the integrated circuit is massively reduced, and thus a great cost reduction and better timing and power efficiency can all be thereof achieved.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: April 22, 2014
    Assignee: National Applied Research Laboratories
    Inventors: Chin-Fong Chiu, Hann-Huei Tsai, Wen-Hsu Chang, Chih-Cheng Hsieh, Kuo-Wei Cheng
  • Micro-electromechanical system device having electrical insulating structure and manufacturing methods
    Patent number: 8695426
    Abstract: The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: April 15, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu Wen Hsu, Shih Ting Lin, Jen Yi Chen, Chao Ta Huang
  • Magnifying glass
    Patent number: D703718
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: April 29, 2014
    Inventor: Hua Wen Hsu