Abstract: The disclosure relates to a microelectromechanical apparatus including a substrate, a stationary electrode, a movable electrode, and a heater. The substrate includes an upper surface, an inner bottom surface, and an inner side surface. The inner side surface surrounds and connects with the inner bottom surface. The inner side surface and the inner bottom surface define a recess. The stationary electrode is disposed on the inner bottom surface. The movable electrode covers the recess. The movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber. The heater is disposed on the movable electrode and located above the hermetic chamber.

Abstract: A brake pad assembly is provided in the present disclosure. The brake pad assembly includes at least one back plate, at least one brake pad, at least one sensor plate and a warning module. The brake pad is on the surface of the board. The brake pad is surrounded by the sensor plate, and the sensor plate forms a closed circuit. The warning module is electrically connected to the sensor plate. A warning signal is generated by the warning module when the closed circuit of the sensor plate forms an open circuit or a short circuit.

Abstract: In some embodiments, the present disclosure relates to a method for forming an image sensor and associated device structure. A backside deep trench isolation (BDTI) structure is formed in a substrate separating a plurality of pixel regions. The BDTI structure encloses a plurality of photodiodes and comprising a first BDTI component arranged at a crossroad of the plurality of pixel regions and a second BDTI component arranged at remaining peripheries of the plurality of pixel regions. The first BDTI component has a first depth from a backside of the substrate smaller than a second depth of the second BDTI component.

Abstract: The present disclosure relates to, in part, an inductor structure that includes an etch stop layer arranged over an interconnect structure overlying a substrate. A magnetic structure includes a plurality of stacked layers is arranged over the etch stop layer. The magnetic structure includes a bottommost layer that is wider than a topmost layer. A first conductive wire and a second conductive wire extend in parallel over the magnetic structure. The magnetic structure is configured to modify magnetic fields generated by the first and second conductive wires. A pattern enhancement layer is arranged between the bottommost layer of the magnetic structure and the etch stop layer. The pattern enhancement layer has a first thickness, and the bottommost layer of the magnetic structure has a second thickness that is less than the first thickness.

Abstract: An imaging lens assembly, having an optical axis, includes an imaging lens set and a lens holding member. The lens holding member accommodates the imaging lens set for aligning the imaging lens set with the optical axis. The lens holding member includes a plurality of light-blocking structures, which are disposed on an object side of the imaging lens set and surround the optical axis for forming a light passing hole. Each of the light-blocking structures is a straight-line shape and has two end points and one central point, and the central point is closer to the optical axis than each of the two end points thereto. A maximum radius of the light passing hole is defined by a position near each of the two end points, and a minimum radius thereof is defined by a position near the central point.

Abstract: An electronic component includes: an insulating layer; and a first metal bump disposed on the insulating layer and provided with: a first metal layer disposed on the insulating layer; and a second metal layer disposed on the first metal layer, wherein, in a cross-sectional view of the electronic component, the first metal layer has a first width, the second metal layer has a second width, and the first width is smaller than the second width.

Abstract: A light blocking sheet having a central axis includes a central hole and a plurality of inner extended portions. The central axis passes through the central hole, which is enclosed by a hole inner surface. The hole inner surface has a first corresponding circle and a second corresponding circle, wherein a diameter of the first corresponding circle is greater than a diameter of the second corresponding circle. The inner extended portions are adjacent to and surround the central hole, wherein each of the inner extended portions is extended and tapered from the first corresponding circle towards the second corresponding circle and includes an inner surface, and the inner surface includes a line pair. The line pair includes two line sections, wherein one end of one line section thereof and one end of the other line section thereof are towards the second corresponding circle and approach to each other.

Abstract: An imaging lens assembly includes a plurality of optical lens elements, a single-piece-formed light blocking sheet and a lens barrel. The lens barrel has a circular light-passing hole corresponding to the plurality of optical lens elements and the single-piece-formed light blocking sheet. The single-piece-formed light blocking sheet has a central aperture corresponding to the lens barrel and the plurality of optical lens elements. A maximum aperture diameter is defined by the central aperture. The single-piece-formed light blocking sheet comprises a plurality of light blocking structures surrounding and disposed adjacent to the central aperture. A minimum inner radius of the central aperture is defined near the center of each of the light blocking structures.

Abstract: The present disclosure relates to, in part, an inductor structure that includes an etch stop layer arranged over an interconnect structure overlying a substrate. A magnetic structure includes a plurality of stacked layers is arranged over the etch stop layer. The magnetic structure includes a bottommost layer that is wider than a topmost layer. A first conductive wire and a second conductive wire extend in parallel over the magnetic structure. The magnetic structure is configured to modify magnetic fields generated by the first and second conductive wires. A pattern enhancement layer is arranged between the bottommost layer of the magnetic structure and the etch stop layer. The pattern enhancement layer has a first thickness, and the bottommost layer of the magnetic structure has a second thickness that is less than the first thickness.

Abstract: A display panel includes a first substrate, a second substrate, a liquid crystal layer, a pixel electrode, a common electrode, a first polarizer and a second polarizer. The pixel electrode includes a trunk portion, first to fourth branch portions, and first to fourth strip portions. The trunk portion extends along a first direction. The first and second branch portions are connected to a first end of the trunk portion. The third and fourth branch portions are connected to a second end of the trunk portion. The first strip portions are connected to the first and second branch portions. The second strip portions are connected to the third and fourth branch portions. The third strip portions are connected to the first and third branch portions and the trunk portion. The fourth strip portions are connected to the second and fourth branch portions and the trunk portion.

Abstract: Various embodiments include a camera having a sensor-shifting mechanism. For example, the camera may include a voice coil motor (VCM) actuator to move an image sensor, relative to a lens group, to provide autofocus (AF) functionality. According to some embodiments, the VCM actuator may include one or more coils attached to a coil carrier, and one or more magnets attached to a stationary structure of the camera. The coil carrier may be attached to an image sensor package such that the image sensor is movable together with the coil carrier, in at least one direction parallel to an optical axis defined by the lens group. In some embodiments, the camera may include one or more suspension arrangements to suspend the coil carrier and/or the image sensor package from one or more stationary structures of the camera.

Abstract: A bicycle trainer includes a base having a base portion and a standing portion, a supporting frame rotationally pivoted on the standing portion of the base around an axle, a cassette module mounted on the supporting frame and having multiple sprockets, and a flywheel module mounted on the supporting frame. A height adjusting member includes the standing portion, the supporting frame and a fixing element. The fixing element is placed in or between the standing portion and the supporting frame for keeping the supporting frame at a predetermined angle with respect to the standing portion.

Abstract: A light blocking sheet having a central axis includes a central hole and a plurality of inner extended portions. The central axis passes through the central hole, which is enclosed by a hole inner surface. The hole inner surface has a first corresponding circle and a second corresponding circle, wherein a diameter of the first corresponding circle is greater than a diameter of the second corresponding circle. The inner extended portions are adjacent to and surround the central hole, wherein each of the inner extended portions is extended and tapered from the first corresponding circle towards the second corresponding circle and includes an inner surface, and the inner surface includes a line pair. The line pair includes two line sections, wherein one end of one line section thereof and one end of the other line section thereof are towards the second corresponding circle and approach to each other.

Abstract: The present disclosure describes a semiconductor device having radiation-sensing regions separated by trench isolation structures. The semiconductor structure includes a first trench fill structure on a substrate and a second trench fill structure on the substrate. The first trench fill structure has a first width and a convex bottom surface. The second trench fill structure has a concave bottom surface and a second width greater than the first width.

Abstract: An electromagnetic driving mechanism is provided for driving two different optical lenses, including a base, a first holder, a frame, a resilient element, a first electromagnetic driving assembly, a second holder, and a second electromagnetic driving assembly. The first and second holders are provided for holding the optical lenses. The frame is affixed to the base, has magnetically permeable material, and surrounds the first holder. The resilient element connects the first holder with the frame. The first electromagnetic driving assembly is disposed between the first holder and the frame to drive the first holder moving relative to the base. The second electromagnetic driving assembly is disposed on an outer side of the second holder to drive the second holder moving relative to the base.

Abstract: A moving mechanism for holding a lens is provided, including a carrier having an accommodating space, a coil, a sensing object, a base, at least one magnetic member, and a position detector, wherein the lens is disposed in the accommodating space. The coil and the sensing object are disposed on the carrier, and the coil surrounds the accommodating space. At least a portion of the coil is disposed between the sensing object and the accommodating space. The magnetic member and the position detector are disposed on the base, and the position detector is adjacent to the sensing object. When a current flows through the coil, the carrier moves relative to the base.

Abstract: A method comprises depositing a mask layer on a front-side surface of a wafer, wherein a portion of the wafer has a first resistivity; with the mask layer in place, performing an ion implantation process on a backside surface of the wafer to implant a resistivity reduction impurity into the wafer through the backside surface of the wafer to lower the first resistivity of the portion of the wafer to a second resistivity; after performing the ion implantation process, removing the mask layer from the front-side surface of the wafer; and forming semiconductor devices on the front-side surface of the wafer.

Abstract: The invention provides a radio frequency (RF) amplifier apparatus including an amplifier and a resonance circuit. An input terminal of the amplifier receives an RF signal. The amplifier amplifies a first frequency component of the RF signal and outputs the amplified first frequency component to an output terminal of the amplifier. A first terminal and a second terminal of the resonance circuit are respectively coupled to the input terminal and the output terminal of the amplifier. The resonance circuit provides a low impedance path for a second frequency component of the RF signal between the input terminal and the output terminal of the amplifier, and provides a high impedance path for the first frequency component of the RF signal between the input terminal and the output terminal of the amplifier.

Abstract: A trench power semiconductor component and a method for manufacturing the same are provided. The trench power semiconductor component includes an epitaxial layer having a trench, a bottom insulating layer, a gate insulating layer, a shielding electrode disposed in the trench, a gate, and a separation structure that includes a covering portion and a spacer portion. The gate is disposed on and separated from the shielding electrode by the separation structure. The covering portion covers a top portion of the shielding electrode and the bottom insulating layer, is connected to the gate insulating layer, and defines a recessed region. The spacer portion is disposed in the recessed region, and includes a main filling portion that closes off the recessed region and a first barrier portion located between the main filling portion and the covering portion. The main filling and the first barrier portion are made of different materials.

Abstract: An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.