Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.

Abstract: An electromagnetic induction type coordinate positioning apparatus includes a first induction coil, a second induction coil, a first signal processing circuit, a second signal processing circuit, and a control circuit. The first induction coil and the second induction coil respectively generate a first induction signal and a second induction signal when a pointer device comes close. The first signal processing circuit performs a first signal processing procedure on one of the first induction signal and the second induction signal. The second signal processing circuit performs a second signal processing procedure on the other one of the first induction signal and the second induction signal. The control circuit calculates position information of the pointer device according to the first induction signal and the second induction signal that have been respectively processed by the first signal processing procedure and the second signal processing procedure.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including an interconnect structure overlying a substrate. The interconnect structure has a plurality of metal layers overlying over the substrate. A first dielectric layer overlies an uppermost surface of the interconnect structure. The first dielectric layer has opposing sidewalls defining a trench. A first magnetic layer is disposed within the trench and conformally extends along the opposing sidewalls. Conductive wires are disposed within the trench and overlie the first magnetic layer. A second magnetic layer overlies the first magnetic layer and the conductive wires. The second magnetic layer laterally extends from over a first sidewall of the opposing sidewalls to a second sidewall of the opposing sidewalls.

Abstract: A crank apparatus includes a crank arm having at least one cavity on one of the surfaces of the crank arm, at least one thin material layer embedded within the at least one cavity and having an exposed outer surface, and at least one sensing element attached to the outer surface of the thin material layer. The crank arm is manufactured of a material with non-uniform strain characteristics, the thin material layer is manufactured of a material with uniform strain characteristics, the crank arm is adapted to be deformed by a force, the thin material layer is adapted to be deformed correspondingly with the deformation of the crank arm, the at least one sensing element is adapted to measure the corresponding strain of the thin material layer to measure the force applied on the crank arm. A bicycle and a stationary exercise bicycle equipped with the crank apparatus are further provided.

Abstract: An electromagnetic induction type coordinate positioning apparatus is provided. The apparatus includes a first induction coil, a second induction coil, a trigger circuit, and a control circuit. The first induction coil is flowed through a first current signal, and the first induction coil is configured to sense a pointer device when the electromagnetic induction type coordinate positioning apparatus is in a sleep mode, and generate a first induction signal when detecting the pointer device. The second induction coil is flowed through a second current signal, and the first induction coil is configured to sense and communicate with the pointer device when in an operating mode. The trigger circuit sends an interrupt signal according to the first induction signal. The control circuit interrupts the sleep mode according to the interrupt signal and switches to the operating mode. The control circuit in the operating mode controls the second control signal to flow through the second induction coil.

Abstract: An electromagnetic induction type coordinate positioning apparatus includes a first induction coil, a second induction coil, a first signal processing circuit, a second signal processing circuit, and a control circuit. The first induction coil and the second induction coil respectively generate a first induction signal and a second induction signal when a pointer device comes close. The first signal processing circuit performs a first signal processing procedure on one of the first induction signal and the second induction signal. The second signal processing circuit performs a second signal processing procedure on the other one of the first induction signal and the second induction signal. The control circuit calculates position information of the pointer device according to the first induction signal and the second induction signal that have been respectively processed by the first signal processing procedure and the second signal processing procedure.

Abstract: An electromagnetic induction type coordinate positioning apparatus includes a first induction coil, a second induction coil, a first amplification circuit, a second amplification circuit, and a control circuit. The first induction coil and the second induction coil respectively generate a first induction signal and a second induction signal when a pointer device comes close. The first amplification circuit and the second amplification circuit may be electrically connected to the first induction coil and the second induction coil, to receive the first induction signal and the second induction signal. The control circuit controls the first amplification circuit and the second amplification circuit to amplify the first induction signal and the second induction signal, so that a power level of the amplified first induction signal and a power level of the amplified second induction signal reach a first predefined level and a second predefined level.

Abstract: An electromagnetic induction type coordinate positioning apparatus includes a first induction coil, a second induction coil, a first impedance circuit, a second impedance circuit, and a control circuit. The first induction coil and the first impedance circuit form a first excited current signal and the second induction coil and the second impedance circuit form a second excited current signal. The control circuit controls a first impedance value of the first induction coil to conform to a first predefined value and controls a second impedance value of the second induction coil to conform to a second predefined value, so that a first excited current signal reaching a first predefined level is formed on a current path between the first impedance circuit and the first induction coil, and a second excited current signal reaching a second predefined level is formed on a current path between the second impedance circuit and the second induction coil.

Abstract: An amplifier circuit includes an output terminal, an amplification unit and a switch. The output terminal is used to output an amplification signal. The amplification unit includes a first transistor and a second transistor. The first transistor includes a control terminal for receiving a first input signal, a first terminal coupled to the output terminal for outputting an amplified first input signal, and a second terminal. The second transistor includes a control terminal for receiving a second input signal, a first terminal coupled to the output terminal for outputting an amplified second input signal, and a second terminal. The switch includes a first terminal coupled to the second terminal of the first transistor, and a second terminal. The amplification signal is generated using at least the amplified first input signal and/or the amplified second input signal.

Abstract: A speaker device having a resonance chamber with adjustable volume can include a speaker chamber and an acoustic deflecting module. The speaker chamber has a transducer, and the audio signal generated by the speaker chamber can be output via the transducer. The acoustic deflecting module is disposed adjacent to the speaker chamber. An outer surface of the acoustic deflecting module changes a transmission direction of the audio signal. An inner volume of the acoustic deflecting module is the resonance chamber with the adjustable volume. The acoustic deflecting module includes a base, a cover, a plate and a driving mechanism. The cover is assembled with the base. The plate is movably disposed inside the cover to form a resonance chamber. The driving mechanism is disposed on the cover and assembled with the plate, and adapted to move the plate inside the resonance chamber for vary a volume of the resonance chamber.

Abstract: A driving mechanism for supporting an optical member is provided, including a base, a frame, a movable portion, a driving module, and an adhesive member. The base includes a plurality of first sidewalls, and at least one recess is formed on the first sidewalls. The frame includes a plurality of second sidewalls, and at least one opening is formed on the second sidewalls. The base and the frame form a hollow box, and the opening corresponds to the recess. The movable portion and the driving module are disposed in the hollow box. The driving module can drive the movable portion to move relative to the base. The adhesive member is accommodated in the opening and the recess, and extended along the first sidewalls. The adhesive member is disposed between the first sidewalls and the second sidewalls.

Abstract: A semiconductor device includes a substrate, a fin structure protruding from the substrate, a gate insulating layer covering a channel region formed of the fin structure, a gate electrode layer covering the gate insulating layer, and isolation layers disposed on opposite sides of the fin structure. The fin structure includes a bottom portion, a neck portion, and a top portion sequentially disposed on the substrate. A width of the neck portion is less than a width of the bottom portion and a width of a portion of the top portion.

Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.

Abstract: An optical system includes a base, a first lens driving module, and a second lens driving module. The first lens driving module includes a first lens holder, a first magnet, and a first coil. The first lens holder is configured to hold a first optical element. The first coil corresponding to the first magnet is configured to drive the first lens holder to move relative to the base. The second lens driving module includes a second lens holder, a second magnet, and a second coil. The second lens holder is configured to hold a second optical element. The second coil corresponding to the second magnet is configured to drive the second lens holder to move relative to the base. The first magnet is disposed between the first and second lens holders, and no other magnet is disposed between the first and second lens holders except the first magnet.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A device includes a substrate and a plurality of photosensitive regions in the substrate. The substrate has a first side and a second side opposite to the first side. The device further includes an interconnect structure on the first side of the substrate, and a plurality of recesses on the second side of the substrate. The plurality of recesses extend into a semiconductor material of the substrate.

Abstract: A waterproof structure includes a housing and a waterproof button. The housing has a first surface, a first side surface, and a second surface. The first side surface is recessed in the first surface to define a first opening, the first side surface is connected between the first surface and the second surface, and the second surface is exposed from the first opening. The waterproof button is disposed in the first opening and includes at least one first water blocking structure, and the first water blocking structure is pressed and deformed to abut against the first side surface.

Abstract: The disclosure relates to a microelectromechanical apparatus including a substrate, a stationary electrode, a movable electrode, and a heater. The substrate includes an upper surface, an inner bottom surface, and an inner side surface. The inner side surface surrounds and connects with the inner bottom surface. The inner side surface and the inner bottom surface define a recess. The stationary electrode is disposed on the inner bottom surface. The movable electrode covers the recess. The movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber. The heater is disposed on the movable electrode and located above the hermetic chamber.

Abstract: A trench power semiconductor device and a manufacturing method thereof are provided. The trench power semiconductor device includes a substrate, an epitaxial layer disposed on the substrate, and a gate structure. The epitaxial layer has at least one trench formed therein, and the gate structure is disposed in the trench. A gate structure includes a lower doped region and an upper doped region disposed above the lower doped region to form a PN junction. The concentration of the impurity decreases along a direction from a peripheral portion of the upper doped region toward a central portion of the upper doped region.

Abstract: A semiconductor power device and a manufacturing method thereof are provided. In the manufacturing method, before the self-aligned silicide process is performed, a gate stacked structure and a spacer are formed on a semiconductor layer having a body region and a source region. The spacer defines a portion of the source region for forming a silicide layer. Subsequently, the self-aligned silicide process is performed with the gate stacked structure and the spacer functioning as a mask to form the silicide layer at the defined portion of the source region. Thereafter, an interconnection structure including an interlayer dielectric layer and a source conductive layer is formed on the semiconductor layer. The source conductive layer is electrically connected to the source region. The silicide layer extends toward the gate stacked structure from a position under the source conductive layer to another position under the interlayer dielectric layer.

Abstract: A driving mechanism for moving an optical element is provided, including a movable portion, a fixed portion, a driving assembly, and a first resilient element. The movable portion is for connecting the optical element. The movable portion is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The first resilient element has a board structure. The movable portion is movably connected to the fixed portion via the first resilient element. The fixed portion includes a connection surface, a restricting surface, and a recessed portion. At least a portion of the first resilient element is disposed on the connection surface. The restricting surface contacts and restricts the movable portion. The recessed portion is located between the connection surface and the restricting surface, wherein the recessed portion is lower than the connection surface and the restricting surface.