Abstract: Various embodiments of the present disclosure are directed towards an integrated chip (IC). The IC comprises a substrate. A resistor overlies the substrate. The resistor comprises a resistive structure overlying the substrate. The resistor also comprises a conductive contact overlying and electrically coupled to the resistive structure. A capping structure is disposed over the conductive contact, wherein the capping structure extends laterally over an upper surface of the conductive contact and vertically along a first sidewall of the conductive contact, such that a lower surface of the capping structure is disposed below a lower surface of the conductive contact.

Abstract: A method for making a semiconductor structure includes forming a first fin and a second fin over a substrate. The method includes forming one or more work function layers over the first and second fins. The method includes forming a nitride-based metal film over the one or more work function layers. The method includes covering the first fin with a patternable layer. The method includes removing a second portion of the nitride-based metal film from the second fin, while leaving a first portion of the nitride-based metal film over the first fin substantially intact.

Abstract: An amplifier circuit having an adjustable gain is provided. The amplifier circuit includes an input terminal, an output terminal, an amplifier, and an attenuation circuit. The input terminal receives an input signal, which is in turn received by an input terminal of the amplifier. An output terminal of the amplifier outputs the input signal that is amplified. The attenuation circuit is coupled between the output terminal of the amplifier and the output terminal to provide a plurality of attenuation to the input signal that is amplified and generate a first attenuation signal, or between the input terminal and the output terminal to provide the plurality of attenuations to the input signal and generate a second attenuation signal. A difference between an impedance value of the input terminal of the attenuation circuit and an impedance value of the output terminal of the attenuation circuit is within a predetermined range.

Abstract: A self-powered apparatus is used for various kinds of cycling and indoor exercise devices. The self-powered apparatus includes a pedal unit, a spindle, a generator and an energy storage element. The pedal unit includes an inner surface to form an accommodating space therein. The spindle is accommodated in the accommodating space. The generator includes a stator and a rotor. The stator is disposed on the spindle, the rotor is disposed on the inner surface of the pedal unit, and the rotor surrounds the stator correspondingly and is non-contact with the stator. The energy storage element is electrically coupled to the generator. When the pedal unit is being pedaled to rotate by a rider, the stator is fixed on the spindle, the rotor rotates relatively to the stator and along with the pedal unit, and a power is generated by the generator to charge the energy storage element.

Abstract: A flash memory device includes a substrate, a semiconductor quantum well layer, a semiconductor spacer, a semiconductor channel layer, a gate structure, and source/drain regions. The semiconductor quantum well layer is formed of a first semiconductor material and is disposed over the substrate. The semiconductor spacer is formed of a second semiconductor material and is disposed over the first semiconductor channel layer. The semiconductor channel layer is formed of the first semiconductor material and is disposed over the semiconductor spacer. Thea gate structure is over the second semiconductor channel layer. The source/drain regions are over the substrate and are on opposite sides of the gate structure.

Abstract: An antenna structure includes a metal housing, a first feed source, and a first radiator. The metal housing includes a front frame, a backboard, and a side frame. The side frame defines a slot and the front frame defines a gap. The metal housing is divided into at least a long portion and a short portion by the slot and the gap. The first radiator is positioned in the housing and includes a first radiating portion and a second radiating portion. One end of the first radiating portion is electrically connected to the first feed source and another end of the first radiating portion is spaced apart from the long portion. One end of the second radiating portion is electrically connected to the first feed source and another end of the second radiating portion is spaced apart from the short portion.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. The substrate has a plurality of protrusions disposed along a first side of the substrate over the image sensing element and a ridge disposed along the first side of the substrate. The ridge continuously extends around the plurality of protrusions.

Abstract: A semiconductor device may include function circuits and a test line structure beside the function circuits. The test line structure includes standard cell circuit blocks including a first components and environment circuit regions between the standard cell circuit blocks. The environment circuit regions include second components. The first components are different from the second components in structure, arrangement or a combination thereof.

Abstract: Disclosed herein is an isolated strain of Roseburia hominis HGM001, which is deposited at Deutsche Sammlung von Mikroorganismen and Zellkulturen GmbH under an accession number DSM 34119. A method for producing butyric acid using the isolated strain of Roseburia hominis HGM001, a fermented culture produced by the method, and a method for alleviating an inflammatory disorder using the fermented culture are also disclosed.

Abstract: According to examples, a system for generating and providing organization-bounded spaces for a virtual community of users may include a processor and a memory storing instructions. The processor, when executing the instructions, may cause the system to generate an organization-bounded space; analyze user information to associate a user with the organization-bounded space; enable the user to receive and publish a content item; and implement a security feature for communications associated with an organization-bounded space and/or its associated users. The processor may further determine recommend a group to the user and identify a user representative for the organization-bounded space.

Abstract: Semiconductor devices and methods which utilize a treatment process of a bottom anti-reflective layer are provided. The treatment process may be a physical treatment process in which material is added in order to fill holes and pores within the material of the bottom anti-reflective layer or else the treatment process may be a chemical treatment process in which a chemical reaction is used to form a protective layer. By treating the bottom anti-reflective layer the diffusion of subsequently applied chemicals is reduced or eliminated, thereby helping to prevent defects that arise from such diffusion.

Abstract: A device includes a substrate, a first fin, a second fin, a first isolation structure, a second isolation structure, and a gate structure. The first fin extends from a p-type region of the substrate. The second fin extends from an n-type region of the substrate. The first isolation structure is over the p-type region and adjacent to the first fin. The first isolation structure has a bottom surface and opposite first and second sidewalls connected to the bottom surface, a first round corner is between the bottom surface and the first sidewall of the first isolation structure, and the first sidewall is substantially parallel to the second sidewall. The second isolation structure is over the n-type region and adjacent to the first fin. The first isolation structure is deeper than the second isolation structure. The gate structure is over the first isolation structure and covering the first fin.

Abstract: An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.

Abstract: A brake pad assembly is provided in the present disclosure. The brake pad assembly includes at least one back plate, at least one brake pad, at least one sensor plate and a warning module. The brake pad is on the surface of the board. The brake pad is surrounded by the sensor plate, and the sensor plate forms a closed circuit. The warning module is electrically connected to the sensor plate. A warning signal is generated by the warning module when the closed circuit of the sensor plate forms an open circuit or a short circuit.

Abstract: A driving mechanism for moving an optical element is provided, including a movable portion, a fixed portion, a driving assembly, and a first resilient element. The movable portion is for connecting the optical element. The movable portion is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The first resilient element has a board structure. The movable portion is movably connected to the fixed portion via the first resilient element. The fixed portion includes a connection surface, a restricting surface, and a recessed portion. At least a portion of the first resilient element is disposed on the connection surface. The restricting surface contacts and restricts the movable portion. The recessed portion is located between the connection surface and the restricting surface, wherein the recessed portion is lower than the connection surface and the restricting surface.

Abstract: A wireless input component and an operation method thereof are provided. The wireless input component includes a wireless reception device and a peripheral input device. The wireless reception device includes a connection interface, a storage device and a processor. The connection interface is connected to a first host. The storage device is configured to record operation parameter information of the first host. The processor connects the connection interface and the storage device and is configured to control the storage device. The communication device connects the processor. The peripheral input device includes an input device and a transmission device. The input device is configured to generate an input signal. The transmission device connects the input device and is connected to the communication device through a wireless communication path and configured to transmit the input signal to the communication device of the wireless reception device.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) chip comprising a stilted pad structure. A wire underlies a semiconductor substrate on a frontside of the semiconductor substrate. Further, a trench isolation structure extends into the frontside of the semiconductor substrate. The stilted pad structure is inset into a backside of the semiconductor substrate that is opposite the frontside. The stilted pad structure comprises a pad body and a pad protrusion. The pad protrusion underlies the pad body and protrudes from the pad body, through a portion of the semiconductor substrate and the trench isolation structure, towards the wire. The pad body overlies the portion of the semiconductor substrate and is separated from the trench isolation structure by the portion of the semiconductor substrate.

Abstract: A calibration system for calibrating pressure sensor comprises communication pipe, base, inlet valve, outlet valve, pump, inlet pipe, heater and reference pressure sensor. The communication pipe has first and second openings. The base comprises chamber body and outlet being disposed at the chamber body. The inlet valve is disposed at the first opening. The chamber body is connected to the second opening so as to define a space between the inlet valve and the outlet valve. The heater is to heat a fluid in the space. The reference pressure sensor is configured to measure a pressure of the fluid. The at least one target pressure sensor is detachably mounted on the chamber body via the base so as to measure the pressure of the fluid in the space.