Abstract: Disclosed herein is an isolated strain of Roseburia hominis HGM001, which is deposited at Deutsche Sammlung von Mikroorganismen and Zellkulturen GmbH under an accession number DSM 34119. A method for producing butyric acid using the isolated strain of Roseburia hominis HGM001, a fermented culture produced by the method, and a method for alleviating an inflammatory disorder using the fermented culture are also disclosed.

Abstract: According to examples, a system for generating and providing organization-bounded spaces for a virtual community of users may include a processor and a memory storing instructions. The processor, when executing the instructions, may cause the system to generate an organization-bounded space; analyze user information to associate a user with the organization-bounded space; enable the user to receive and publish a content item; and implement a security feature for communications associated with an organization-bounded space and/or its associated users. The processor may further determine recommend a group to the user and identify a user representative for the organization-bounded space.

Abstract: Semiconductor devices and methods which utilize a treatment process of a bottom anti-reflective layer are provided. The treatment process may be a physical treatment process in which material is added in order to fill holes and pores within the material of the bottom anti-reflective layer or else the treatment process may be a chemical treatment process in which a chemical reaction is used to form a protective layer. By treating the bottom anti-reflective layer the diffusion of subsequently applied chemicals is reduced or eliminated, thereby helping to prevent defects that arise from such diffusion.

Abstract: A device includes a substrate, a first fin, a second fin, a first isolation structure, a second isolation structure, and a gate structure. The first fin extends from a p-type region of the substrate. The second fin extends from an n-type region of the substrate. The first isolation structure is over the p-type region and adjacent to the first fin. The first isolation structure has a bottom surface and opposite first and second sidewalls connected to the bottom surface, a first round corner is between the bottom surface and the first sidewall of the first isolation structure, and the first sidewall is substantially parallel to the second sidewall. The second isolation structure is over the n-type region and adjacent to the first fin. The first isolation structure is deeper than the second isolation structure. The gate structure is over the first isolation structure and covering the first fin.

Abstract: An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.

Abstract: A brake pad assembly is provided in the present disclosure. The brake pad assembly includes at least one back plate, at least one brake pad, at least one sensor plate and a warning module. The brake pad is on the surface of the board. The brake pad is surrounded by the sensor plate, and the sensor plate forms a closed circuit. The warning module is electrically connected to the sensor plate. A warning signal is generated by the warning module when the closed circuit of the sensor plate forms an open circuit or a short circuit.

Abstract: A driving mechanism for moving an optical element is provided, including a movable portion, a fixed portion, a driving assembly, and a first resilient element. The movable portion is for connecting the optical element. The movable portion is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The first resilient element has a board structure. The movable portion is movably connected to the fixed portion via the first resilient element. The fixed portion includes a connection surface, a restricting surface, and a recessed portion. At least a portion of the first resilient element is disposed on the connection surface. The restricting surface contacts and restricts the movable portion. The recessed portion is located between the connection surface and the restricting surface, wherein the recessed portion is lower than the connection surface and the restricting surface.

Abstract: A wireless input component and an operation method thereof are provided. The wireless input component includes a wireless reception device and a peripheral input device. The wireless reception device includes a connection interface, a storage device and a processor. The connection interface is connected to a first host. The storage device is configured to record operation parameter information of the first host. The processor connects the connection interface and the storage device and is configured to control the storage device. The communication device connects the processor. The peripheral input device includes an input device and a transmission device. The input device is configured to generate an input signal. The transmission device connects the input device and is connected to the communication device through a wireless communication path and configured to transmit the input signal to the communication device of the wireless reception device.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) chip comprising a stilted pad structure. A wire underlies a semiconductor substrate on a frontside of the semiconductor substrate. Further, a trench isolation structure extends into the frontside of the semiconductor substrate. The stilted pad structure is inset into a backside of the semiconductor substrate that is opposite the frontside. The stilted pad structure comprises a pad body and a pad protrusion. The pad protrusion underlies the pad body and protrudes from the pad body, through a portion of the semiconductor substrate and the trench isolation structure, towards the wire. The pad body overlies the portion of the semiconductor substrate and is separated from the trench isolation structure by the portion of the semiconductor substrate.

Abstract: A calibration system for calibrating pressure sensor comprises communication pipe, base, inlet valve, outlet valve, pump, inlet pipe, heater and reference pressure sensor. The communication pipe has first and second openings. The base comprises chamber body and outlet being disposed at the chamber body. The inlet valve is disposed at the first opening. The chamber body is connected to the second opening so as to define a space between the inlet valve and the outlet valve. The heater is to heat a fluid in the space. The reference pressure sensor is configured to measure a pressure of the fluid. The at least one target pressure sensor is detachably mounted on the chamber body via the base so as to measure the pressure of the fluid in the space.

Abstract: A work piece is positioned on a work piece support, which includes a plurality of temperature control zones. A pre-etch surface topography is determined by measuring a plurality of pre-etch surface heights or thicknesses at a plurality of sites on the work piece. The plurality of sites correspond to the plurality of temperature control zones on the work piece support. At least a first zone of the temperature control zones is heated or cooled based on the measured plurality of pre-etch surface heights or thicknesses, so that the first zone has a first temperature different from a second temperature of a second zone of the temperature control zones. A dry etch is carried out while the first zone has the first temperature different from the second temperature of the second zone of the temperature control zones.

Abstract: A driving mechanism is provided and configured to drive an optical element. The driving mechanism includes a base unit, a holding unit, a driving assembly, a sensing assembly, and a first circuit component. The holding unit is configured to hold an optical element that has an optical axis. The driving assembly is configured to drive the optical element to move relative to the base unit. The sensing assembly is configured to detect the movement of the holding unit relative to the base unit. The first circuit component is disposed in the base unit and electrically connected to the sensing assembly, wherein the first circuit component extends in a direction that is substantially parallel to the optical axis.

Abstract: A calibration system for calibrating pressure sensor comprises communication pipe, base, inlet valve, outlet valve, pump, inlet pipe, heater and reference pressure sensor. The communication pipe has first and second openings. The base comprises chamber body and outlet being disposed at the chamber body. The inlet valve is disposed at the first opening. The chamber body is connected to the second opening so as to define a space between the inlet valve and the outlet valve. The heater is to heat a fluid in the space. The reference pressure sensor is configured to measure a pressure of the fluid. The at least one target pressure sensor is detachably mounted on the chamber body via the base so as to measure the pressure of the fluid in the space.

Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.

Abstract: A pressure sensor with calibration function includes a casing, a diaphragm, a sensing element, a medium, and at least one calibration element. The diaphragm is disposed on the casing, wherein the casing and the diaphragm define an accommodating space. The sensing element is disposed in the casing. The medium is filled in the accommodating space and in contact with the sensing element. The at least one calibration element is adjustably disposed at the casing and extended into the accommodating space to be in contact with the medium, wherein when the at least one calibration element is moved relative to the casing, the at least one calibration element changes the pressure applied to the medium.

Abstract: Semiconductor devices and methods which utilize a treatment process of a bottom anti-reflective layer are provided. The treatment process may be a physical treatment process in which material is added in order to fill holes and pores within the material of the bottom anti-reflective layer or else the treatment process may be a chemical treatment process in which a chemical reaction is used to form a protective layer. By treating the bottom anti-reflective layer the diffusion of subsequently applied chemicals is reduced or eliminated, thereby helping to prevent defects that arise from such diffusion.

Abstract: An opening is formed within a dielectric material overlying a semiconductor substrate. The opening may comprise a via portion and a trench portion. During the manufacturing process a treatment chemical is placed into contact with the exposed surfaces in order to release charges that have built up on the surfaces. By releasing the charges, a surface change potential difference is reduced, helping to prevent galvanic corrosion from occurring during further manufacturing.

Abstract: The invention provides a radio frequency (RF) amplifier apparatus including an amplifier and a resonance circuit. An input terminal of the amplifier receives an RF signal. The amplifier amplifies a first frequency component of the RF signal and outputs the amplified first frequency component to an output terminal of the amplifier. A first terminal and a second terminal of the resonance circuit are respectively coupled to the input terminal and the output terminal of the amplifier. The resonance circuit provides a low impedance path for a second frequency component of the RF signal between the input terminal and the output terminal of the amplifier, and provides a high impedance path for the first frequency component of the RF signal between the input terminal and the output terminal of the amplifier.

Abstract: An electromagnetic induction type coordinate positioning apparatus includes a first induction coil, a second induction coil, a first amplification circuit, a second amplification circuit, and a control circuit. The first induction coil and the second induction coil respectively generate a first induction signal and a second induction signal when a pointer device comes close. The first amplification circuit and the second amplification circuit may be electrically connected to the first induction coil and the second induction coil, to receive the first induction signal and the second induction signal. The control circuit controls the first amplification circuit and the second amplification circuit to amplify the first induction signal and the second induction signal, so that a power level of the amplified first induction signal and a power level of the amplified second induction signal reach a first predefined level and a second predefined level.