Abstract: A method and a module for improving personal speech recognition capability for use in a portable electronic device are provided. The portable electronic device has a predetermined recognition model constructed of a phoneme model for recognizing at least a command speech from a user. The method comprises the steps of: establishing a database having specific characters which are related to the command speech; construing an adaptation parameter by retrieving a plurality of speech datum spoken by the user according to the database; and modulating the recognition model by integrating the phoneme model and the adaptation parameter. The user can effectively adapt the recognition model to improve the recognition capability according to the above steps.

Abstract: A liquid crystal display panel may have a substrate body, a patterned overcoat layer disposed on the substrate body, and a transparent conductive layer disposed on the patterned overcoat layer. The patterned overcoat layer may have a plurality of slits, the depth of the slits greater than the thickness of the transparent conductive layer. By using the height difference of the slits in the overcoat layer and the thickness of the transparent conductive layer, the transparent conductive layer may be patterned during formation. Thus, the fabricating process can be simplified, the cost reduced, and the through put and the productive yield improved.

Abstract: The present invention provides an apparatus and a method for panel/wafer molding. The present invention discloses a base with a first separation layer, an upper molding base with a second separation layer, a cheap molding layer and a vacuum panel bonding machine for bonding, a curing unit, a cleaning unit and a separating unit; wherein upper molding base is rectangular or round. Therefore the present invention providing a simple, cheap universal panel/wafer molding apparatus for a round or rectangular type panel, and does no harm to the chip active surface.

Abstract: An automatic charging station for an autonomous mobile machine includes a base, a housing, and a signal transmitter. The base is mounted on the ground or on a planar surface. The housing is rotatably mounted on the base, having at least one guide member and a plurality of electrically conductive members on a surface thereof. The electrically conductive members are located on the housing. The signal transmitter is mounted on the housing for transmitting a signal. When the autonomous mobile machine senses the signal transmitted by the transmitter while moving, the autonomous mobile machine moves along a route towards the housing and then forces the guide member to enable the housing to rotate for facing and accommodating the autonomous mobile machine and to further enable the autonomous mobile machine to contact against the housing to have its electrodes in contact with the electrically conductive members for charging.

Abstract: The present invention provides an apparatus and a method for self chip redistribution. The apparatus of the present invention comprises a glass base on which a trench and a cavity formed by a layer of photo resistance. Chips are picked from a sawed wafer and placed on the glass base and moved by fluid flow to the front of index bar. The glass base and the index bar vibrate with low frequency to fill chips into chip cavities. The present invention further provides a method for self chip redistribution, comprising providing a self redistribution tool, transferring redistributed chips onto a panel forming tool, forming a chip panel and separating said chip panel from panel forming tool.

Abstract: The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate.

Abstract: The present invention provides a semiconductor device package comprising a substrate with at lease a pre-formed die receiving cavity formed and terminal contact metal pads formed within an upper surface of the substrate. At lease a first die is disposed within the die receiving cavity. A first dielectric layer is formed on the first die and the substrate and refilled into a gap between the first die and the substrate to absorb thermal mechanical stress there between. A first re-distribution layer (RDL) is formed on the first dielectric layer and coupled to the first die. A second dielectric layer is formed on the first RDL, and then a second die is disposed on the second dielectric layer and surrounded by core pastes having through holes thereon. A second re-distribution layer (RDL) is formed on the core pastes to fill the through holes, and then a third dielectric layer formed on the second RDL.

Abstract: A stable composition useful for myocardial perfusion imaging contains one or more 2-alkynyladenosine derivatives; and a solvent which is made up of water and hydroxypropyl-?-cyclodextrin.

Abstract: A structure of semiconductor device package having inter-adhesion with gap comprising: a chip with bonding pads and a sensor area embedded into a substrate with die window and inter-connecting through holes, wherein a RDL is formed over the substrate for coupling between the bonding pads and the inter-connecting through holes; a multiple rings (dam bar) formed over the substrate, the RDL, and the bonding pads area except the sensor area; an adhesive glues fill into the space of the multiple ring except the sensor area; and a transparency material bonded on the top of the multiple ring and the adhesive glues, wherein the adhesive glues adhesion between the transparency material and the multiple rings.

Abstract: A nitride trapping memory device includes a comparator, a bias unit, a memory cell, a cycling cell, a compensation cell and a control unit. The comparator has a reference voltage. The bias unit is for outputting a bias voltage to the comparator, and the comparator outputs a bit value according to comparison of the bias voltage and the reference voltage. The memory cell is connected to the bias unit via a first switch. The cycling cell is connected to the bias unit via a second switch. The compensation cell is connected to the bias unit via a third switch. The control unit is for controlling the cycling cell and the compensation cell according to the bit value.

Abstract: A method for soft configuring communication a memory device to act as a Key Card that can switch on or off some particular functions of either an application program or the memory device itself. The method comprising the steps of: connecting the memory device to an external device; running a specific application program on the external device, the application program writing and storing a specific data into the memory device, the specific data including at least a command and a key; the memory device generating a response value according to the command and key of the specific data; and the external device reading the response value from the memory device and checking a status of the response value; if the response value is checked to be valid, then the application program will be able to access the memory device by using functions defined by the command; if the response value is checked to be invalid, then functions of the application program will be restricted.

Abstract: The present invention provides a semiconductor device package with the die receiving through hole and connecting through holes structure comprising a substrate with a die receiving through hole, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A die is disposed within the die receiving through hole. A first adhesion material is formed under the die and a second adhesion material is filled in the gap between the die and sidewall of the die receiving though hole of the substrate. Further, a bonding wire is formed to couple and the bonding pads and the first contact pads. A dielectric layer is formed on the bonding wire, the die and the substrate.

Abstract: The present invention provides a structure of multi-chips package and Method of the same comprising a substrate with a pre-formed die receiving cavity formed within an upper surface of the substrate. A die is disposed within the die receiving cavity by adhesion and an elastic dielectric layer filled into a gap between the die and the substrate to absorb thermal mechanical stress; therefore the thickness of the package is reduced and the CTE mismatch of the structure is reduced. The present invention also provides a structure for SIP with higher reliability and lower manufacturing cost. the process is simpler and it is easy to form the multi-chips package than the traditional one. Therefore, the present invention discloses a fan-out WLP with reduced thickness and good CTE matching performance.

Abstract: An antenna is formed integrally into one piece and has a ground plane, a feeding strip and two pairs of radiating patches. The feeding strip is connected integrally to the ground plane. The pairs of the radiating patches are formed symmetrically and integrally on the feeding strip. The antenna formed integrally into one piece simplifies the manufacture of the antenna lowers the manufacturing cost of the antenna.

Abstract: The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A thick dielectric layer is formed on the die and the substrate except the micro lens, bonding pads and contact pads. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. And core paste is filled into the gap between the die edge and the sidewall of the die through hole of the substrate. A transparent cover is disposed on the die and the thick dielectric layer by adhesion to create a gap between the transparent cover.

Abstract: The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. A protective layer is formed to cover the wire bonding. A transparent cover is disposed on the die within the die through hole by adhesion to expose the micro lens area. Conductive bumps are coupled to the terminal pads.

Abstract: A nitride trapping memory device includes a comparator, a bias unit, a memory cell, a cycling cell, a compensation cell and a control unit. The comparator has a reference voltage. The bias unit is for outputting a bias voltage to the comparator, and the comparator outputs a bit value according to comparison of the bias voltage and the reference voltage. The memory cell is connected to the bias unit via a first switch. The cycling cell is connected to the bias unit via a second switch. The compensation cell is connected to the bias unit via a third switch. The control unit is for controlling the cycling cell and the compensation cell according to the bit value.

Abstract: A method for a communication device, receiving MMS messages, receives an SMS message from a system service terminal. When the received SMS message is determined as a notification message related to an MMS message, the values of a first flag and a second flag are detected. When both the first and second flags are of a first value, the SMS message is sent to a message client terminal, the first flag is set to a second value, and a timer is activated. Next, the second flag is set to the second value and the MMS message is retrieved from the system service terminal. Last, the second flag is set to the first value after finishing retrieving the MMS message, and the first flag is set to the first value when the timer has expired.