Patents by Inventor Wen Liao

Wen Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230197736
    Abstract: A pixel array substrate includes data lines, first gate lines, pixel structures, first common lines, and conductive line sets. The conductive line sets are arranged in a first direction. Each of the conductive line sets includes first conductive line groups and a second conductive line group sequentially arranged in the first direction. Each of the first conductive line groups includes second gate lines and a second common line. The second conductive line group includes first auxiliary lines and a second common line. An arrangement order of the second gate lines and the second common line of each of the first conductive line groups in the first direction are the same as an arrangement order of the first auxiliary lines and the second common line of the second conductive line group in the first direction, respectively.
    Type: Application
    Filed: February 22, 2023
    Publication date: June 22, 2023
    Applicant: AUO Corporation
    Inventors: Ping-Wen Chen, Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Yueh-Chi Wu, Shu-Wen Liao, Ti-Kuei Yu, Ya-Ling Hsu, Chen-Hsien Liao
  • Patent number: 11678592
    Abstract: The present disclosure is directed to a method for the formation of resistive random-access memory (RRAM) structures with a low profile between or within metallization layers. For example, the method includes forming, on a substrate, a first metallization layer with conductive structures and a first dielectric layer abutting sidewall surfaces of the conductive structures; etching a portion of the first dielectric layer to expose a portion of the sidewall surfaces of the conductive structures; depositing a memory stack on the first metallization layer, the exposed portion of the sidewall surfaces, and a top surface of the conductive structures; patterning the memory stack to form a memory structure that covers the exposed portion of the sidewall surfaces and the top surface of the conductive structures; depositing a second dielectric layer to encapsulate the memory stack; and forming a second metallization layer on the second dielectric layer.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: June 13, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Ming Wang, Chia-Wei Liu, Jen-Sheng Yang, Wen-Ting Chu, Yu-Wen Liao, Huei-Tzu Wang
  • Patent number: 11646320
    Abstract: A pixel array substrate, including multiple pixel structures, is provided. Each of the pixel structures includes a first common electrode, a thin film transistor, a conductive pattern, a first insulating layer, a color filter pattern, a second insulating layer, and a pixel electrode. The conductive pattern is electrically connected to the thin film transistor. A first portion of the conductive pattern is disposed on the first common electrode. The first insulating layer is disposed on the conductive pattern. The color filter pattern is disposed on the first insulating layer. The second insulating layer is disposed on the color filter pattern. The pixel electrode is disposed on the second insulating layer. In a top view of the pixel array substrate, the first portion of the conductive pattern covers all edges of the first common electrode within an opening of the color filter pattern.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: May 9, 2023
    Assignee: Au Optronics Corporation
    Inventors: Yueh-Chi Wu, Ti-Kuei Yu, Shu-Wen Liao
  • Patent number: 11637239
    Abstract: The present disclosure, in some embodiments, relates to a resistive random access memory (RRAM) cell. The RRAM cell has a bottom electrode over a substrate. A data storage layer is over the bottom electrode and has a first thickness. A capping layer is over the data storage layer. The capping layer has a second thickness that is in a range of between approximately 1.9 and approximately 3 times thicker than the first thickness. A top electrode is over the capping layer.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: April 25, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Trinh Hai Dang, Hsing-Lien Lin, Cheng-Yuan Tsai, Chin-Chieh Yang, Yu-Wen Liao, Wen-Ting Chu, Chia-Shiung Tsai
  • Patent number: 11636460
    Abstract: The present disclosure relates to an electronic device, a method, and a computer-readable recording medium for electronic transactions. The electronic device displays a first graphical user interface (GUI) on a touch screen, the first GUI including a currency amount, displays a second GUI corresponding to transmission of the currency amount according to a currency transmission signal input to the touch screen, determines an amount of an electronic transaction according to the currency transmission signal, and transmits a generated signal containing information on the amount of the electronic transaction to an information processing system.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: April 25, 2023
    Assignee: LINE CORPORATION
    Inventors: Yun-Ru Sun, Chien-Wei Hu, Yu-Chuan Wei, Li-Wen Liao
  • Patent number: 11629100
    Abstract: Methods, apparatus and systems using heat exchanger reactors to form polymer derived ceramic materials, including methods for making polysilocarb (SiOC) precursors.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: April 18, 2023
    Assignee: Melior Innovations, Inc.
    Inventors: Richard Landtiser, Wen Liao, Connor Kilgallen, Douglas Dukes, Isabel Burlingham
  • Patent number: 11632882
    Abstract: A heat dissipating module includes a heat dissipating substrate, a first structural plate, and a first heat conductive plate. The heat dissipating substrate has an inlet, an outlet, and a first container formed on a top surface of the heat dissipating substrate. The inlet and the outlet are communicated with the first container respectively. The first structural plate has a first channel member and is contained in the first container. The first channel member is communicated with the inlet and the outlet respectively. Heat dissipating liquid flows through the first channel member via the inlet, and flows out of the heat dissipating module via the outlet. The first heat conductive plate covers the first structural plate. The first heat conductive plate is in contact with a heat generating member for conducting heat energy generated by the heat generating member to the heat dissipating liquid.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: April 18, 2023
    Assignee: LSC Ecosystem Corporation
    Inventor: Tzu-Wen Liao
  • Patent number: 11626315
    Abstract: A planarization method includes forming a dielectric layer over a polish stop layer. The dielectric layer is polished until reaching the polish stop layer, and the polished dielectric layer has a concave top surface. A compensation layer is formed over the concave top surface. The compensation layer is polished.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: April 11, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Jung Huang, Hsu-Shui Liu, Han-Wen Liao, Yu-Yao Huang, Hsiao-Wei Chen, Yung-Lin Hsu, Kuang-Huan Hsu
  • Publication number: 20230086019
    Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Patent number: 11610920
    Abstract: A pixel array substrate includes data lines, first gate lines, pixel structures, first common lines, and conductive line sets. The conductive line sets are arranged in a first direction. Each of the conductive line sets includes first conductive line groups and a second conductive line group sequentially arranged in the first direction. Each of the first conductive line groups includes second gate lines and a second common line. The second conductive line group includes first auxiliary lines and a second common line. An arrangement order of the second gate lines and the second common line of each of the first conductive line groups in the first direction are the same as an arrangement order of the first auxiliary lines and the second common line of the second conductive line group in the first direction, respectively.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: March 21, 2023
    Assignee: Au Optronics Corporation
    Inventors: Ping-Wen Chen, Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Yueh-Chi Wu, Shu-Wen Liao, Ti-Kuei Yu, Ya-Ling Hsu, Chen-Hsien Liao
  • Publication number: 20230060538
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Publication number: 20230037915
    Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Publication number: 20220409552
    Abstract: The present invention provides novel pharmaceutical formulations comprising derivatives of NDGA, including M4N (tetra-0-methyl nordihydroguaiaretic acid) and temozolomide and their use in the inhibition and treatment of neoplastic diseases, including glioblastoma multiforme, lung and other cancers.
    Type: Application
    Filed: November 25, 2020
    Publication date: December 29, 2022
    Inventors: Ru Chih C. Huang, Jong Ho Chun, Yu-Ling Lin, Yu-Chuan LIang, Kuang-Wen Liao, Tiffany Jackson, David Mold, Chien-Hsien Lai
  • Patent number: 11519672
    Abstract: A liquid-cooled heat dissipation device is disclosed, comprising a main body, a centrifugal pump, an inlet pipe, an outlet pipe, a centrifugal fan and a motor. The main body comprises a shaft hole, liquid flow channels and airflow channels. The centrifugal pump guides a cooling liquid through the inlet pipe, main body and outlet pipe. The centrifugal fan guides air into the main body axially from the shaft hole. After passing through the centrifugal fan, the air forms centrifugal airflows and leaves the body radially through the airflow channels. With an extended flow path of the cooling liquid and the radial flow of the centrifugal airflow provided by the present invention, the temperature of the cooling liquid may be quickly reduced and the cooling effect may be improved. Thus, the structure is compact, small, light-weight, easy-to-assemble.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: December 6, 2022
    Assignee: Gogoro Inc.
    Inventors: Sung-Ching Lin, Tzu-Wen Liao, Yi-Hsiang Lin, Kai-Chiang Li, Yi-Chen Lu
  • Patent number: 11515339
    Abstract: A display device has a display area and a peripheral area and includes data lines, scan lines, gate transmission lines, and sub-pixels. The data lines and the gate transmission lines extend from the peripheral area into the display area. The data lines located in the display area extend along a first direction. The scan lines are located in the display area and extend along a second direction intersecting the first direction. The gate transmission lines are electrically connected to the scan lines. One of the gate transmission lines includes first, second, and third wires located in the display area. The first and third wires extend along the first direction. The second wire extends along the second direction. The first, second and third wires are electrically connected in sequence. The third wire is electrically connected to one of the scan lines.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: November 29, 2022
    Assignee: Au Optronics Corporation
    Inventors: Yueh-Chi Wu, Ti-Kuei Yu, Hung-Chia Liao, Shu-Wen Liao, Shiang-Lin Lian
  • Patent number: 11515645
    Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: November 29, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jenchun Chen, Ya-Wen Liao
  • Patent number: 11505882
    Abstract: The invention provides a system for performing dynamic production and knitting machine work management comprising a production demand management unit, an advanced scheduling management unit, a cloth pattern storage unit and a manufacturing execution unit. The production demand management unit receives at least one production demand data. The advanced scheduling management unit generates a production scheduling data according to working conditions of a plurality of knitting machines and the production demand data. The cloth pattern storage unit stores a plurality of knitting machine work setting data. The manufacturing execution unit controls each knitting machine to extract one of the plurality of knitting machine work setting data from the cloth pattern storage unit based on a production cloth pattern data. The knitting machine work setting data is forcibly deleted by the knitting machine when a knitting number meets a set value defined by the knitting number limiting data.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: November 22, 2022
    Assignee: WHOLEKNIT INTERNATIONAL CO., LTD.
    Inventor: Chih-Wen Liao
  • Publication number: 20220328960
    Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 13, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Publication number: 20220305070
    Abstract: Flavonoid extract of Cyclocarya paliurus leaves is used in the preparation of antibacterial drugs and/or antibacterial agents against the bacteria that are resistant to conventional antibiotics. Experiments have proved that the flavonoid extract of C. paliurus leaves has obvious killing effect on methicillin-resistant Staphylococcus aureus strains, which provides a potential resolution to the problem that methicillin-resistant S. aureus strains are resistant to most beta-lactam antibiotics.
    Type: Application
    Filed: August 20, 2020
    Publication date: September 29, 2022
    Inventors: Meiling SUN, Jie LIU, Wen LIAO, Minjun LIAO
  • Patent number: D984373
    Type: Grant
    Filed: April 11, 2021
    Date of Patent: April 25, 2023
    Assignee: GUANGDONG GOPOD GROUP CO., LTD.
    Inventor: Zhuo-Wen Liao