Abstract: A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced apart from and oriented parallel to each other, and form a plurality of air passages therebetween. The axial fan is installed at a lateral side of the fin set and directs airflow into the fin set through the air passages. The fin set has an inclined area at an end thereof, and the fan is installed on the inclined area of the fin set and oblique to the base.

Abstract: A method and email system for improving efficiency of email discussion within an email client comprising: an email tag filter for filtering a special tag in email contents, extracting original email contents, and identifying tag related information which includes at least an author name corresponding to the email contents; and a content style setting component for receiving and keeping the tag related information fed by the email tag filter, then identifying which part of the email contents is written by which author according to the tag information, and assigning correct style to corresponding contents using a user customization style for each author. The invention differentiates different users mainly by automatically labeling the contents input by the users, and the input contents can be distributed in different positions within a single email, which matches the natural convention of the current users to use the email system.

Abstract: Systems for displaying images and methods for fabricating the same. A representative system includes a substrate having a display region and a peripheral region, and a mosaic color filter pattern formed in the peripheral region. The mosaic color filter pattern includes a plurality of separated pillars and a plurality of channels adjacent to the pillars. Specifically the volume ratio between the pillars and the channel is 1:5 to 2:1, preferably 1:3 to 1:1.

Abstract: An instant messaging communication method, computer program product and apparatus. The instant messaging communication apparatus includes input means for inputting an instant message and a semantic tag for the instant message; a network module for transmitting the input instant message and semantic tag and receiving an instant message with a semantic tag; construction means for constructing a visual topic structural diagram of the transmitted and received instant messages according to the semantic tag; and display means for displaying the visual topic structural diagram. An embodiment of the communication apparatus provides structured guidance to the user's discussion, directs the user to make pertinent announcement and enables the user to easily sum up the main points of the discussion from the log through a visualized topic structural diagram.

Abstract: A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes (20) each comprise an evaporating portion (22) embedded in the base (10) and a condensing portion (24) extending from an end of the evaporating portion (22). The heat radiator (40) comprises first and second fin assemblies (42, 44) each having two contacting faces (43, 45), the condensing portions (24) of the heat pipes (20) are sandwiched between the contacting faces (43, 45) by the first and second fin assemblies (42, 44), and an opening is enclosed by the first and second fin assemblies (42, 44) and receives an electric fan (50) therein.

Abstract: A heat dissipation device (100) is mounted on a heat-generating device (12) of a graphics card (10) and comprises a heat sink (20), a fan (30), a cover (40) and a heat pipe (50). The heat sink (20) has a base (22) and a plurality of fins (24) on the base (22). The fan (30) is mounted on the base (22) of the heat sink (20) beside the fins (24). The cover (40) covers the heat sink (20) and the fan (30). The heat pipe (50) is embedded in a bottom surface of the base (22) of the heat sink (20) in direct contact with the heat-generating device (12). The heat pipe (50) has a bottom face coplanar with the bottom surface of the base (22). The base (22) and the fins (24) are integrally formed as a monolithic piece by aluminum extrusion.

Abstract: A heat dissipation device is to be mounted in a computer enclosure for dissipating heat generated by a VGA card (10). The heat dissipation device includes a heat sink (90), a fan (60) and a fan duct (50) connecting the heat sink (90) and the fan (60). The heat sink (90) contacts a heat-generating device (12) of the VGA card. The fan (60) has an inlet port (62) and an outlet port (63). The outlet port (63) communicates with an ambient air outside the computer enclosure. The fan duct (50) has two open ends (55,52). One open end (55) engages with the heat sink (90) and the other open end (52) engages with the inlet port (62) of the fan (60).

Abstract: A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the fins and the fan. The retention assembly includes four pegs each having a first end locked in the base of the heat sink and a second end, a back plate secured beneath the add-on card and two wire clips. The second ends of the pegs extend through the base, the add-on card and the back plate in turn and are held in position by the wire clips beneath the back plate, whereby the heat sink and the back plate are secured to opposite sides of the add-on card.

Abstract: A VGA card assembly comprises a VGA card (10) having a socket (13) thereon. A GPU (11) is attached on the socket. A base plate (22) is located on the VGA card and contacts with the GPU, for dissipating heat generated by the GPU. A back plate (30) is located below the VGA card, for supporting the VGA card. The back plate has studs extend upwardly through the VGA card. Fasteners extend downwardly through the socket to threadedly engage with the studs. Screws extend downwardly through the base plate to threadedly engage with the fasteners. A heat dissipation device including a fan, a heat pipe, fins and a lid is removably mounted on the base plate.

Abstract: A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.

Abstract: A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.

Abstract: A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the fins and the fan. The retention assembly includes fours pegs each having a first end locked in the base of the heat sink and a second end, a back plate secured beneath the add-on card and two wire clips. The second ends of the pegs extend through the base, the add-on card and the back plate in turn and are held in position by the wire clips beneath the back plate, whereby the heat sink and the back plate are secured to opposite sides of the add-on card.

Abstract: A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining a receiving room (57) therein. A thermal module (10) is received in the receiving room. A bottom of the thermal module contacts with the heat-generating electronic component. A cover (80) is movably mounted on the flow director to cover the thermal module in the flow director. The cover is capable of rotating or sliding relative to the flow director to facilitate open or close of the receiving room. When the receiving room is opened, the thermal module is exposed.

Abstract: A heat dissipation device cooling a power adapter (50) includes first and second heat dissipation units (10), (20), at least one heat pipe (30) connecting the first and second heat dissipation units and a plurality of positioning elements (60) securing the first and second heat dissipation units on the power adapter. The positioning elements extend through the first heat dissipation unit and bottom ends of the positioning elements are screwed into the second heat dissipation unit. Top ends of the positioning elements are secured to the first heat dissipation unit. Therefore, the power adapter is tightly sandwiched between the first heat dissipation unit and the second heat dissipation unit by the positioning elements. Spring forces are exerted by the positioning elements on the first heat dissipation unit toward the second heat dissipation unit.

Abstract: An electronic type protective relay integrates the mechanical structure into a single operation rod to protect electric machinery. The electronic type protective relay includes an insulating shell, a tripping rod, a magnetic-force device and an operation device. The tripping rod is pivoted in the inner part of the insulating shell and conducts two pairs of connection pins. The tripping rod includes a control magnetic core. The magnetic-force device includes a tripping electromagnet, a reset electromagnet, and a permanent magnet installed between the tripping electromagnet and the reset electromagnet. The operation device includes an auxiliary rod located on one side of the tripping rod, an operation rod installed between the tripping rod and the auxiliary rod and protruding beyond the insulating shell. The operation rod can be located at four locations and in cooperation with the auxiliary rod to stop or reset.

Abstract: A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together.

Abstract: A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation unit is attached to a top surface of the heat-generating component. The second heat dissipation unit has a main portion disposed beneath the printed circuit board and another portion extending from a level beneath the printed circuit board to another level above the printed circuit board. The heat pipe is wholly disposed above the printed circuit board and comprises an evaporating portion rotatably received in the channel of the first heat dissipation unit and a condensing portion rotatably received in the channel of the second heat dissipation unit.

Abstract: A heat dissipation device for removing heat from an electronic component includes separated first and second heat sinks and a plate-type heat pipe. The first heat sink has a side oriented to the second heat sink and defines a notch in the side thereof. The second heat sink defines a channel therein. The heat pipe includes a heat-absorber at one end thereof and a heat-exhauster at an opposite end thereof. The heat-absorber is attached into the notch and has a main surface facing the second heat sink. The heat-exhauster is fittingly engaged into the channel of the second heat sink to position the second heat sink thereon. The heat-exhauster dissipates heat transferred from the heat-absorber to the second heat sink.

Abstract: A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.

Abstract: A vapor chamber heat sink attached to a heat-generating electronic component includes a base (10) defining an opening therein. A plurality of fins (20) is mounted on the base. A heat pipe (30) thermally connects the electronic component and the fins. The heat pipe comprises a plate-type lower portion (32) contacting a bottom surface of the base and a bottom surface (22) of the fins and overlaying a top surface of the electronic component, a plate-type upper portion (34) parallel to the lower portion contacting a top surface (24) of the fins, and a connecting portion (36) interconnecting opposite two ends of the lower and upper portions. The heat pipe is configured in such a manner so as to enhance contact area and thermal conductivity between the heat pipe and the electronic component and between the heat pipe and the fins.