Abstract: A computer cooling system includes a computer housing, a refrigeration loop and two fans. The housing includes an inner layer and an outer layer and defines an air inlet and an air outlet on opposite sides thereof. The refrigeration loop orderly includes a compressor, a condenser, an expansion valve, an evaporator and pipes connecting the compressor, the condenser, the expansion valve and the evaporator. The compressor and the pipes are located between the inner and outer layers. The fans are respectively located near the air inlet and the air outlet, in order to draw air into the housing and expel the air out of the housing.

Abstract: A heat dissipation device includes a heat sink (22), a first fan (24) disposed on one part of the heat sink, a second fan (26) disposed on another part of the heat sink and a cover (30) disposed to enclose the heat sink, the first fan and the second fan. The second fan draws the air produced by the first fan and flowing through the heat sink to quickly leave the heat sink.

Abstract: A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.

Abstract: A combination includes an extruded heat sink and a fan secured to the heat sink. The heat sink includes a planar fin and an L-shaped fin. The planar fin and the L-shaped fin commonly define a channel and an entrance to the channel. The fan includes lead wires packed together. The lead wires are allowed to pass through the entrance one by one and to be received in the channel side by side after being turned 90 degrees.

Abstract: A heat dissipation device includes a base, a first and second fin sets on the base, and a fan located atop the first and second fin sets. The base has a first face for contacting with an electronic device, and two sloped faces extending from the first face and toward each other. The first fin set defined a channel receiving the base therein. A plat extends from an end of the first face of the base. The second fin set is arranged on the plat of the base. The first face of the base has two grooves defined therein. A retaining member is attached to the first face of the base and has two retaining bars thereof fitted in the two grooves of the first face, respectively.

Abstract: A VGA card assembly comprises a VGA card (10) having a socket (13) thereon. A GPU (11) is attached on the socket. A base plate (22) is located on the VGA card and contacts with the GPU, for dissipating heat generated by the GPU. A back plate (30) is located below the VGA card, for supporting the VGA card. The back plate has studs extend upwardly through the VGA card. Fasteners extend downwardly through the socket to threadedly engage with the studs. Screws extend downwardly through the base plate to threadedly engage with the fasteners. A heat dissipation device including a fan, a heat pipe, fins and a lid is removably mounted on the base plate.

Abstract: A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation unit is attached to a top surface of the heat-generating component. The second heat dissipation unit has a main portion disposed beneath the printed circuit board and another portion extending from a level beneath the printed circuit board to another level above the printed circuit board. The heat pipe is wholly disposed above the printed circuit board and comprises an evaporating portion rotatably received in the channel of the first heat dissipation unit and a condensing portion rotatably received in the channel of the second heat dissipation unit.

Abstract: A heat dissipation device includes a heat spreader (100), a fin assembly (300) located above the heat spreader and a heat pipe (400). The heat spreader has a bottom (110) for contacting a heat-generating component (500) and an upper surface (120) with a groove (122) defined therein. The fin assembly includes a plurality of horizontal fins stacked on each other. The heat pipe includes a first section (410) accommodated in the groove of the heat spreader, a pair of first legs (422) extending from opposite ends of the first section, respectively, and away from the heat spreader, and a second leg (424) bent from each of the first legs towards the heat spreader. The first and second legs pass through the horizontal fins and are fixed to and thermally connected with the horizontal fins.

Abstract: A heat dissipation device includes a fin set including a plurality of fins assembled together and a fan located beside the fin set. Pluralities of air passages are defined between the fins. Each fin has two spaced flaps extending from a main body thereof and dividing the main body to upper and lower portions and a middle portion between the two flaps. The middle portion has a converging entrance between two corresponding end sections of the two flaps. The fan confronts to the air passages and the converging entrances of the middle portions of the fins of the fin set.

Abstract: A heat dissipation device includes a heat sink (22), a first fan (24) disposed on one part of the heat sink, a second fan (26) disposed on another part of the heat sink and a cover (30) disposed to enclose the heat sink, the first fan and the second fan. The second fan draws the air produced by the first fan and flowing through the heat sink to quickly leave the heat sink.

Abstract: A heat dissipating apparatus mounted onto an add-on card (20) includes a base (70), a cover (30) mounted on the base, a plurality of fins (60) received between and thermally connecting the cover and the base, a fan (40) positioned on the base to blow air to the fins, and a heat pipe (50) including an evaporating portion (52) and a condensing portion (54). The evaporating portion and condensing portion are sandwiched between the base and the fins. The cover absorbs heat from the fins and dissipates the heat to ambient air. Thus, the heat dissipating area is increased due to the cover, and the heat dissipating apparatus has a better heat dissipating efficiency.

Abstract: An air-packing device has an improved shock absorbing capability to protect a product in a container box. The air-packing device is comprised of first and second thermoplastic films where predetermined portions are bonded thereby creating a plurality of air containers, a plurality of heat-seal lands each sealing the first and second thermoplastic films in a small area of the air container thereby creating a plurality of series connected air cells for each air container, a plurality of check valves for corresponding air containers for allowing the compressed air to flow in a forward direction, and at least one pocket formed of a sheet of thermoplastic film bonded to either the first thermoplastic film or the second thermoplatic film at boundaries between two adjacent air containers. The air-packing device is folded after the product is inserted in the pocket and installed in a container box.

Abstract: An air-packing device has an improved shock absorbing capability to protect a product in a container box. The air-packing device is comprised of first and second thermoplastic films where predetermined portions are bonded thereby creating a plurality of air containers, a plurality of heat-seal lands each sealing the first and second thermoplastic films in a small area of the air container thereby creating a plurality of series connected air cells for each air container, a plurality of check valves for corresponding air containers for allowing the compressed air to flow in a forward direction. The plurality of heat-seal lands at predetermined sides of the air-packing device create triangled areas of the air cells, and the air-packing device is folded at the heat-seal lands, thereby creating an inner space for packing a product therein.

Abstract: A heat sink assembly includes a heat sink (10) deposited on a circuit board (100), a pair of bolts (30), and a clip (20) attached to the circuit board. The clip includes a pressing portion (22) engaging the circuit board, a first locking portion (26) and a second locking portion (28). The first locking portion defines an opening (42) and a slot (40) and the second locking portion defines a positioning groove (50). The clip further includes a clamping portion (70) linearly movably and rotatable mounted on the second locking portion. One bolt has a head engaging with the heat sink and a bead engaging with the first locking portion. The other bolt has a head engaging with the heat sink and a bead engaging with the clamping portion.

Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

Abstract: A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together.

Abstract: An electrical connector includes a generally rectangular housing having a pair of opposite long sides defining a long direction and a pair of short ends defining a short direction. A plurality of terminal-receiving passages are formed in the housing. The connector includes a plurality of power terminals and a plurality of signal terminals including RJ45 terminals and RJ11 terminals. The terminal-receiving passages are divided into a power terminal-receiving section and a signal terminal-receiving section spaced from each other in the long direction. The signal terminal-receiving section is divided into an RJ45 terminal-receiving section and an RJ11 terminal-receiving section spaced from each other in the short direction.

Abstract: A bubble wrapping sheet has a simple structure and can easily inflate all of the air bubbles to wrap a product to be protected. The air bubbles can be constructed by tube partition seals that create air tubes and by bubble partition seals that divide the air tubes into a plurality of series connected air bubbles. The shape and size of the tube partition seals and bubble partition seals can be modified to change the shape of air bubbles and the density of the air bubbles on the bubble wrapping sheet. A check valve for the bubble wrapping sheet is provided to each air tube. The check valve may be configured by an air flow maze portion having a zig-zag air passage and a common air duct portion which provides the air to the air flow maze portion of a current air tube as well as to the air flow maze portion of a next air tube.

Abstract: An electronic type protective relay integrates the mechanical structure into a single operation rod to protect electric machinery. The electronic type protective relay includes an insulating shell, a tripping rod, a magnetic-force device and an operation device. The tripping rod is pivoted in the inner part of the insulating shell and conducts two pairs of connection pins. The tripping rod includes a control magnetic core. The magnetic-force device includes a tripping electromagnet, a reset electromagnet, and a permanent magnet installed between the tripping electromagnet and the reset electromagnet. The operation device includes an auxiliary rod located on one side of the tripping rod, an operation rod installed between the tripping rod and the auxiliary rod and protruding beyond the insulating shell. The operation rod can be located at four locations and in cooperation with the auxiliary rod to stop or reset.

Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.