Patents by Inventor Wen Su

Wen Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ISOLATED PROGRAM EXECUTION ENVIRONMENT
    Publication number: 20160274876
    Abstract: Embodiments relate to an isolated program execution environment. An aspect includes receiving, by the isolated program execution environment on a computer comprising a processor and a memory, a request to run a program. Another aspect includes wrapping program code corresponding to the program as a function. Another aspect includes cloning a real global object of the isolated program execution environment to create a fake global object. Another aspect includes passing the fake global object to the function. Another aspect includes executing the function, such that the function executes the program.
    Type: Application
    Filed: March 28, 2016
    Publication date: September 22, 2016
    Inventors: Anthony Ffrench, Libra C. Huang, Timothy J. Smith, Chih-Wen Su, Yi-Hong Wang
  • ISOLATED PROGRAM EXECUTION ENVIRONMENT
    Publication number: 20160275286
    Abstract: Embodiments relate to an isolated program execution environment. An aspect includes receiving, by the isolated program execution environment on a computer comprising a processor and a memory, a request to run a program. Another aspect includes wrapping program code corresponding to the program as a function. Another aspect includes cloning a real global object of the isolated program execution environment to create a fake global object. Another aspect includes passing the fake global object to the function. Another aspect includes executing the function, such that the function executes the program.
    Type: Application
    Filed: March 17, 2015
    Publication date: September 22, 2016
    Inventors: Anthony Ffrench, Libra C. Huang, Timothy J. Smith, Chih-Wen Su, Yi-Hong Wang
  • Etching method for reducing microloading effect
    Patent number: 9443741
    Abstract: An etching method includes forming a high density structure and a low density structure on a substrate. A first material layer is formed to cover both structures. Part of the low density structure is exposed through the first material layer. A second material layer is formed to cover the first material layer. The second material layer is etched to remove the second material layer on the high density structure and part of the second material layer on the low density structure. The first material layer on the high density structure and the second material layer on the low density structure are simultaneously etched. The first material layer is etched to expose a first portion of the high density structure and a second portion of the low density structure. Finally, the first portion and the second portion are removed.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: September 13, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Wen Su, Zhi-Jian Wang, Cheng-Chang Wu, Hsin-Yu Hsieh, Shui-Yen Lu
  • Multiple-input-multiple-output antenna device
    Patent number: 9444530
    Abstract: A Multiple-Input-Multiple-Output (MIMO) antenna device is adapted for connecting electrically to a radio frequency (RF) circuit for transmitting and receiving RF signals. The MIMO antenna device includes a circuit board, a plurality of antenna units, and a plurality of multiplexer units. The antenna units are disposed on the circuit board proximate to a peripheral edge thereof, are arranged in a loop formation, and are divided into a plurality of groups of the antenna units. Each of the multiplexer units is connected electrically to a respective one of the groups of the antenna units for selecting one of the corresponding antenna units and for connecting electrically the selected one of the corresponding antenna units to the RF circuit, thereby achieving the MIMO technique with the independently and simultaneously operating antenna units.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: September 13, 2016
    Assignee: Lite-On Technology Corp.
    Inventors: Saou-Wen Su, Lin-Han Tsai, Chuan-Hsing Chen
  • Interconnect Structure Having Air Gap and Method of Forming the Same
    Publication number: 20160260665
    Abstract: A representative semiconductor device includes a first dielectric layer overlying a substrate, at least a first opening in the first dielectric layer, a conformal dense layer lining the at least first opening in the first dielectric layer, a barrier layer overlying the conformal dense layer, a conductive feature in the at least first opening, where a portion of the first dielectric layer between any two adjacent conductive features is removed to form a second opening, the second opening exposing the conformal dense layer between the two adjacent conductive features, and a second dielectric layer having an air gap formed therein, the second dielectric layer disposed between the two adjacent conductive features.
    Type: Application
    Filed: May 17, 2016
    Publication date: September 8, 2016
    Inventors: Chih-Chien Chi, Hung-Wen Su
  • Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
    Publication number: 20160240428
    Abstract: A semiconductor device and method of manufacture are provided which utilize an air gap to help isolate conductive structures within a dielectric layer. A first etch stop layer is deposited over the conductive structures, and the first etch stop layer is patterned to expose corner portions of the conductive structures. A portion of the dielectric layer is removed to form an opening. A second etch stop layer is deposited to line the opening, wherein the second etch stop layer forms a stepped structure over the corner portions of the conductive structures. Dielectric material is then deposited into the opening such that an air gap is formed to isolate the conductive structures.
    Type: Application
    Filed: February 12, 2015
    Publication date: August 18, 2016
    Inventors: Szu-Ping Tung, Chih-Chien Chi, Hung-Wen Su
  • PHYSICAL VAPOR DEPOSITION SYSTEM AND PHYSICAL VAPOR DEPOSITING METHOD USING THE SAME
    Publication number: 20160240357
    Abstract: A physical vapor deposition system includes a chamber, a cover plate, a pedestal, and a collimator. The cover plate is disposed on the chamber for holding a target. The pedestal is disposed in the chamber for supporting a wafer. The collimator is mounted between the cover plate and the pedestal. The collimator includes a plurality of sidewall sheets together forming a plurality of passages. At least one of the passages has an entrance and an exit opposite to the entrance. The entrance faces the cover plate, and the exit faces the pedestal. A thickness of one of the sidewall sheets at the entrance is thinner than a thickness of the sidewall sheet at the exit.
    Type: Application
    Filed: February 13, 2015
    Publication date: August 18, 2016
    Inventors: Chih-Chien CHI, Hung-Wen SU, Pei-Hsuan LEE
  • IDENTIFYING HOME AUTOMATION CORRELATED EVENTS AND CREATING PORTABLE RECIPES
    Publication number: 20160231717
    Abstract: A method for creating at least one portable environment recipe associated with at least one user and associated with an underlying architecture, whereby the underlying architecture includes an underlying actuator architecture or an underlying sensor architecture is provided. The method may include collecting a plurality of behavior data associated with the underlying architecture and the at least one user, wherein the at least one user is located at a first location. The method may further include analyzing the collected plurality of behavior data. The method may also include identifying at least one behavior pattern based on the analyzed plurality of behavior data. The method may include creating the at least one portable environment recipe based on the identified at least one behavior pattern. The method may also include uploading the created environment recipe to a repository.
    Type: Application
    Filed: February 11, 2015
    Publication date: August 11, 2016
    Inventors: Wei-Ting Chou, Wan-Tseng Hsiao, Jeffrey C.H. Liu, Chih-Wen Su
  • IDENTIFYING HOME AUTOMATION CORRELATED EVENTS AND CREATING PORTABLE RECIPES
    Publication number: 20160232454
    Abstract: A method for creating at least one portable environment recipe associated with at least one user and associated with an underlying architecture, whereby the underlying architecture includes an underlying actuator architecture or an underlying sensor architecture is provided. The method may include collecting a plurality of behavior data associated with the underlying architecture and the at least one user, wherein the at least one user is located at a first location. The method may further include analyzing the collected plurality of behavior data. The method may also include identifying at least one behavior pattern based on the analyzed plurality of behavior data. The method may include creating the at least one portable environment recipe based on the identified at least one behavior pattern. The method may also include uploading the created environment recipe to a repository.
    Type: Application
    Filed: August 18, 2015
    Publication date: August 11, 2016
    Inventors: Wei-Ting Chou, Wan-Tseng Hsiao, Jeffrey C.H. Liu, Chih-Wen Su
  • APPARATUSES AND METHODS FOR COORDINATING OPERATIONS OF MULTIPLE WIRELESS COMMUNICATIONS MODULES WITH MULTIPLE SUBSCRIBER NUMBERS
    Publication number: 20160219427
    Abstract: A wireless communications device is provided with a plurality of card slots, a first wireless communications module, and a second wireless communications module. The card slots are inserted with at least one subscriber identity card. The first wireless communications module performs wireless transceiving in compliance with at least a first wireless technology. The second wireless communications module determines at least a first subscriber number and a second subscriber number from the at least one subscriber identity card, and enables the wireless transceiving of the first wireless communications module using the first subscriber number. Also, the second wireless communications module performs wireless transceiving in compliance with at least a second wireless technology using the second subscriber number.
    Type: Application
    Filed: April 1, 2016
    Publication date: July 28, 2016
    Inventors: Ker Zhang, Hong-Kui Yang, Sheng-Hung Wang, Huai-Wen Su, Jian Gu, Amelia Hungmei I, Chia-Hsun Liu
  • Interconnect structure having air gap and method of forming the same
    Patent number: 9343294
    Abstract: A method for forming a semiconductor device includes forming a first dielectric layer overlying a substrate, forming at least a first opening in the first dielectric layer, forming a conformal dense layer lining the at least first opening in the first dielectric layer, forming a barrier layer overlying the conformal dense layer, forming a conductive feature in the at least first opening, removing a portion of the first dielectric layer between any two adjacent conductive features to form a second opening, wherein the second opening exposes the conformal dense layer between the two adjacent conductive features, and depositing between the two adjacent conductive features a second dielectric layer having an air gap formed therein.
    Type: Grant
    Filed: April 28, 2014
    Date of Patent: May 17, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Chi, Hung-Wen Su
  • MECHANISMS OF FORMING DAMASCENE INTERCONNECT STRUCTURES
    Publication number: 20160133514
    Abstract: A method of forming a conductive structure includes forming a first opening and a second opening in a dielectric layer on a substrate, wherein the first opening is narrower than the second opening. The method further includes depositing a diffusion barrier layer to line the first opening and the second opening. The method further includes forming a metal layer over the diffusion barrier layer to fill at least portions of the first opening and the second opening, wherein a maximum thickness of the metal layer in the first opening is greater than a maximum thickness of the metal layer in the second opening.
    Type: Application
    Filed: January 5, 2016
    Publication date: May 12, 2016
    Inventors: Chien-An Chen, Wen-Jiun Liu, Chun-Chieh Lin, Hung-Wen Su, Ming-Hsing Tsai, Syun-Ming Jang
  • SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20160126185
    Abstract: A method of forming a semiconductor structure includes the steps: providing a substrate; forming a dielectric over the substrate; forming an opening recessed under a top surface of the dielectric; forming a barrier layer on a sidewall of the opening; performing a physical vapor deposition (PVD) to form a copper layer over the barrier layer, a corner of the opening intersecting with the top surface and the top surface with a predetermined resputter ratio so that the ratio of the thickness of the copper layer on the barrier layer and the thickness of the copper layer over the top surface is substantially greater than 1.
    Type: Application
    Filed: January 5, 2016
    Publication date: May 5, 2016
    Inventors: KEN-YU CHANG, HUNG-WEN SU
  • Apparatuses and methods for coordinating operations of multiple wireless communications modules with multiple subscriber numbers
    Patent number: 9332417
    Abstract: A wireless communications device is provided with a plurality of card slots, a first wireless communications module, and a second wireless communications module. The card slots are inserted with at least one subscriber identity card. The first wireless communications module performs wireless transceiving in compliance with at least a first wireless technology. The second wireless communications module determines at least a first subscriber number and a second subscriber number from the at least one subscriber identity card, and enables the wireless transceiving of the first wireless communications module using the first subscriber number. Also, the second wireless communications module performs wireless transceiving in compliance with at least a second wireless technology using the second subscriber number.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: May 3, 2016
    Assignee: Intel Corporation
    Inventors: Ker Zhang, Hong-Kui Yang, Sheng-Hung Wang, Huai-Wen Su, Jian Gu, Amelia Hungmei I, Chia-Hsun Liu
  • Seat for two wheeled vehicle
    Patent number: D760508
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: July 5, 2016
    Assignee: GOGORO INC.
    Inventors: Hok-Sum Horace Luke, Chien-Chih Weng, Hsin-Wen Su, Song-Fu Wang
  • Electric motor
    Patent number: D761204
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: July 12, 2016
    Assignee: Gogoro Inc.
    Inventors: Hok-Sum Horace Luke, Chien-Chih Weng, Hsin-Wen Su, Song-Fu Wang, Chi-Wang Lien
  • Headlamp for vehicle
    Patent number: D762888
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: August 2, 2016
    Assignee: GOGORO INC.
    Inventors: Hok-Sum Horace Luke, Chien-Chih Weng, Hsin-Wen Su, Song-Fu Wang
  • Turn signal lamp
    Patent number: D762889
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: August 2, 2016
    Assignee: GOGORO INC.
    Inventors: Hok-Sum Horace Luke, Chien-Chih Weng, Hsin-Wen Su, Song-Fu Wang
  • Tail lamp housing unit
    Patent number: D763483
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: August 9, 2016
    Assignee: GOGORO INC.
    Inventors: Hok-Sum Horace Luke, Chien-Chih Weng, Hsin-Wen Su
  • Rear-view side mirror
    Patent number: D763755
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: August 16, 2016
    Assignee: GOGORO, Inc.
    Inventor: Shin-Wen Su