Patents by Inventor Wen Sung

Wen Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POWER SAVING SYSTEM FOR UNDERWATER VEHICLES
    Publication number: 20210016862
    Abstract: A power saving system for underwater vehicles includes a control system, a power unit and a battery. The control system controls the power unit to drive the underwater vehicle, and generates an output driving value. The control system includes a calculation unit, a three-axis accelerometer and gyro and an underwater vehicle weight value. The calculation unit creates a correspondent acceleration value by the output driving value and the underwater vehicle weight value. The three-axis accelerometer and gyro detects the acceleration of the underwater vehicle by every less than 0.5 second interval, and generates an acceleration value. The control system compares the correspondent acceleration value and the acceleration value to control the output driving value so as to save battery power and elongate the range of travelling of the underwater vehicles.
    Type: Application
    Filed: July 15, 2019
    Publication date: January 21, 2021
    Inventor: Wen-Sung Lee
  • Spacer Open Process By Dual Plasma
    Publication number: 20210005456
    Abstract: Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The method includes performing a spacer treatment process to expose the workpiece to species generated from a first process gas in a first plasma to perform a spacer treatment process on a spacer layer on the workpiece. The first plasma can be generated in the processing chamber. After performing the spacer treatment process, the method can include performing a spacer etch process to expose the workpiece to neutral radicals generated from a second process gas in a second plasma to etch at least a portion of the spacer layer on the workpiece. The second plasma can be generated in a plasma chamber that is remote from the processing chamber.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 7, 2021
    Inventors: Tsai Wen Sung, Chun Yan, Hua Chung, Michael X. Yang, Dixit V. Desai, Peter J. Lembesis
  • SEMICONDUCTOR PACKAGE
    Publication number: 20200381365
    Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.
    Type: Application
    Filed: August 17, 2020
    Publication date: December 3, 2020
    Inventors: Wen-Sung HSU, Tao CHENG, Nan-Cheng CHEN, Che-Ya CHOU, Wen-Chou WU, Yen-Ju LU, Chih-Ming HUNG, Wei-Hsiu HSU
  • NOVEL SUBSTITUTED BENZIMIDAZOLE DERIVATIVES AS D-AMINO ACID OXIDASE (DAAO) INHIBITORS
    Publication number: 20200361894
    Abstract: The present invention provides novel substituted benzimidazole derivatives used as DAAO inhibitors and for treatment and/or prevention of neurological disorders.
    Type: Application
    Filed: September 14, 2017
    Publication date: November 19, 2020
    Inventors: Yufeng Jane TSENG, Yu-Li LIU, Chung-Ming SUN, Wen-Sung LAI, Chih-Min LIU, Hai-Gwo HWU
  • CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
    Publication number: 20200312732
    Abstract: A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.
    Type: Application
    Filed: June 17, 2020
    Publication date: October 1, 2020
    Inventors: Yen-Yao CHI, Nai-Wei LIU, Ta-Jen YU, Tzu-Hung LIN, Wen-Sung HSU, Shih-Chin LIN
  • Semiconductor package
    Patent number: 10784206
    Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: September 22, 2020
    Assignee: MEDIATEK INC.
    Inventors: Wen-Sung Hsu, Tao Cheng, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu, Chih-Ming Hung, Wei-Hsiu Hsu
  • Semiconductor package with rigid under bump metallurgy (UBM) stack
    Patent number: 10756040
    Abstract: The invention provides a semiconductor package. The semiconductor package includes a semiconductor die and a conductive pillar bump structure and a conductive plug. The semiconductor die has a die pad thereon. The conductive pillar bump structure is positioned overlying the die pad. The conductive pillar bump structure includes an under bump metallurgy (UBM) stack having a first diameter and a conductive plug on the UBM stack. The conductive plug has a second diameter that is different than the first diameter.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: August 25, 2020
    Assignee: MediaTek Inc.
    Inventors: Ta-Jen Yu, Chi-Yuan Chen, Wen-Sung Hsu
  • METHOD OF PREPARING LIPID NANOCARRIER
    Publication number: 20200222507
    Abstract: A method of preparing a lipid nanocarrier for encapsulating a hydrophilic protein is provided. The preparing method includes the following steps. The hydrophilic protein, a lipophilic component, and a wetting agent are mixed to obtain a homogeneous solution. The homogeneous solution and a saturated salt solution comprising a surfactant are mixed to obtain the lipid nanocarrier in a single-step emulsification manner.
    Type: Application
    Filed: June 18, 2019
    Publication date: July 16, 2020
    Applicant: National Tsing Hua University
    Inventors: Hsing-Wen Sung, Po-Yen Lin, Kuan-Hung Chen
  • Immunothermosensitive Composite, Kit For Treating Cancer, And Use Thereof
    Publication number: 20200206349
    Abstract: An immunothermosensitive composition is provided in the present disclosure. The immunothermosensitive composition includes a carrier and an immune adjuvant. The shell is carrier formed by self-assembly of a hydrophilic amine-containing polymer and a conductive polymer to form a hydrophilic region and a hydrophobic region, and the hydrophilic region is located outside the hydrophobic region. The immune adjuvant is coated in the hydrophobic region of the carrier, wherein the immune adjuvant specifically binds to Toll-Like Receptor 7 (TLR7) and/or Toll-Like Receptor 8 (TLR8). The immunothermosensitive composition can absorb light energy to generate thermal energy and is maintained at a temperature greater than or equal to 39° C. and less than or equal to 45° C.
    Type: Application
    Filed: May 9, 2019
    Publication date: July 2, 2020
    Inventors: Hsing-Wen Sung, Po-Ming Chen, Wen-Yu Pan, Cheng-Yu Wu, Ching-Yen Yeh, Po-Kai Luo, Chun-Ju Chou, Yung-Seng Pang, Yu-Miao Liu
  • SILICON MANDREL ETCH AFTER NATIVE OXIDE PUNCH-THROUGH
    Publication number: 20200203182
    Abstract: Apparatus, systems, and methods for conducting a silicon containing material removal process on a workpiece are provided. In one example implementation, the method can include generating species from a process gas in a first chamber using an inductive coupling element. The method can include introducing a fluorine containing gas with the species to create a mixture. The mixture can include exposing a silicon structure of the workpiece to the mixture to remove at least a portion of the silicon structure.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 25, 2020
    Inventors: Chun Yan, Tsai Wen Sung, Sio On Lo, Hua Chung, Michael X. Yang
  • SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE
    Publication number: 20200176408
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 4, 2020
    Applicant: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang
  • Pharmaceutical Composition for Oral Delivery of Hydrophobic Small Molecule Drug and Hydrophilic Small Molecule Drug Concurrently
    Publication number: 20200146973
    Abstract: A pharmaceutical composition for oral delivery of hydrophobic small molecule drug and hydrophilic small molecule drug concurrently is provided. The pharmaceutical composition includes an enteric layer and a drug layer, in which the drug layer is encapsulated in the enteric layer. The drug layer includes a therapeutically effective amount of a hydrophobic small molecule drug, a therapeutically effective amount of a hydrophilic small molecule drug, a lipophilic solvent, an acidic compound and an effervescent ingredient.
    Type: Application
    Filed: December 6, 2019
    Publication date: May 14, 2020
    Inventors: Hsing-Wen SUNG, Po-Yen LIN, Kuan-Hung CHEN
  • SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE
    Publication number: 20200152479
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
    Type: Application
    Filed: January 15, 2020
    Publication date: May 14, 2020
    Applicant: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Ta-Jen Yu
  • CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
    Publication number: 20200091070
    Abstract: A semiconductor package structure including a semiconductor die having a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. A first protective insulating layer covers the first and third surfaces of the semiconductor die. A redistribution layer (RDL) structure is electrically coupled to the semiconductor die and surrounded by the first protective insulating layer on the first surface of the semiconductor die. A first passivation layer covers the first protective insulating layer and the RDL structure. At least one conductive structure passes through the first passivation layer and is electrically coupled to the RDL structure. A method of forming the semiconductor package is also provided.
    Type: Application
    Filed: June 3, 2019
    Publication date: March 19, 2020
    Applicant: MediaTek Inc.
    Inventors: Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu
  • SPEED ADJUSTMENT DEVICE FOR VEHICLES
    Publication number: 20200070669
    Abstract: A speed adjustment device for electric vehicles includes a motor, a battery, an acceleration detector, a control unit and a processing unit. The acceleration detector detects the speed of the electric vehicle every period of time which is less than 0.5 seconds, and the acceleration detector generates an acceleration value which is sent to the control unit, and the processing unit calculates the acceleration value and generates a current speed value. The control unit compares the current speed value and the preset constant speed value to control output of the motor and output of the battery.
    Type: Application
    Filed: September 4, 2018
    Publication date: March 5, 2020
    Inventor: Wen-Sung Lee
  • Semiconductor package and method for fabricating base for semiconductor package
    Patent number: 10580747
    Abstract: In one configuration, a semiconductor package includes a conductive trace embedded in a base and a semiconductor device mounted on the conductive trace via a conductive structure, wherein the conductive structure is a bump structure and the width of the bump structure is bigger than the width of the conductive trace. In another configuration, a method for fabricating a semiconductor package includes providing a base, forming at least one conductive trace on the base, forming an additional insulation material on the base, and defining patterns upon the additional insulation material, wherein the pattern is formed on at least one conductive trace, wherein the conductive structure is a bump structure and the width of the bump structure is bigger than the width of the conductive trace.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: March 3, 2020
    Assignee: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang
  • Semiconductor package and method for fabricating base for semiconductor package
    Patent number: 10573615
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: February 25, 2020
    Assignee: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang
  • Semiconductor package and method for fabricating base for semiconductor package
    Patent number: 10573616
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: February 25, 2020
    Assignee: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang
  • Semiconductor package and method for fabricating base for semiconductor package
    Patent number: 10573536
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: February 25, 2020
    Assignee: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Ta-Jen Yu
  • Semiconductor package with improved heat dissipation
    Patent number: 10573579
    Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, an interposer mounted on the top surface of the package substrate, a first semiconductor die and a second semiconductor die mounted on the interposer in a side-by-side manner, and a stiffener ring secured to the top surface of the package substrate. The stiffener ring encircles the first semiconductor die and the second semiconductor die. The stiffener ring comprises a reinforcement rib striding across the interposer.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: February 25, 2020
    Assignee: MEDIATEK INC.
    Inventors: Tai-Yu Chen, Wen-Sung Hsu, Sheng-Liang Kuo, Chi-Wen Pan, Jen-Chuan Chen