Abstract: An optical PCB includes a substrate, conductive traces, a solder resist layer, and a light waveguide. The substrate includes a surface. The surface includes a flat area. The conductive traces are formed on the surface of the substrate and only positioned outside of the flat area. The solder resist layer is formed on the substrate and covers the conductive traces. The light waveguide is positioned on the solder resist layer. An orthogonal projection of the light waveguide on the surface of the substrate coincides with the flat area.

Abstract: A negative pressure wound therapy system has a buffering unit connected between an actuator and a wound dressing. The buffering unit has similar physical condition with the wound, and consumes its negative pressure to compensate for the negative pressure loss in the wound to resist the pressure rise in the wound during slight leakage. The buffering unit also keeps the actuator from directly operating on the wound to reduce the pain of the patient while lowering the pressure in the wound.

Abstract: A switching control method capable of continuously providing power is utilized for a power supply system having a first power supply unit and a second power supply unit. The switching control method includes generating a first input signal and a second input signal; performing a logical operation process on the first input signal and the second input signal to generate a first control signal; delaying the second input signal for a delay time to generate a second control signal; controlling a coupling relationship between the first power supply unit and a load according to the first control signal; and controlling a coupling relationship between the second power supply unit and the load according to the second control signal.

Abstract: Nonvolatile memory elements that are based on resistive switching memory element layers are provided. A nonvolatile memory element may have a resistive switching metal oxide layer. The resistive switching metal oxide layer may have one or more layers of oxide. A resistive switching metal oxide may be doped with a dopant that increases its melting temperature and enhances its thermal stability. Layers may be formed to enhance the thermal stability of the nonvolatile memory element. An electrode for a nonvolatile memory element may contain a conductive layer and a buffer layer.

Abstract: A wafer including a substrate, a dielectric layer over the substrate, and a conductive layer over the dielectric layer is disclosed. The substrate has a main portion. A periphery of the dielectric layer and the periphery of the main portion of the substrate are separated by a first distance. A periphery of the conductive layer and the periphery of the main portion of the substrate are separated by a second distance. The second distance ranges from about a value that is 0.5% of a diameter of the substrate less than the first distance to about a value that is 0.5% of the diameter greater than the first distance.

Abstract: An optical fiber connector is positioned on a printed circuit board (PCB) and includes a main body, a number of slots, and a number of optical fibers. The main body includes a number of light transceivers. Each of the light transceivers includes a light transmitting module and a light receiving module adjacent to the light transmitting module. One end of each of the optical fibers is optically coupled to a respective one of the light emitting modules and the light receiving modules, and the other end of each of the optical fibers is mounted on a respective one of the slots.

Abstract: An optical-electrical converting device includes a substrate, an electrical circuit layer, at least one auxiliary pad, and an optical-electrical converting lens. The electrical circuit layer includes at least one circuit portion. The optical-electrical lens includes at least one first supporting portion and at least one second supporting portion. Each of the at least one first supporting portion is positioned on a respective one of the at least one first circuit portion, and each of the at least one second supporting portion is positioned on a respective one of the at least one auxiliary pad. The electrical circuit layer and the at least one auxiliary pad are arranged on the substrate. The thickness of the at least one first circuit portion layer is substantially equal to the thickness of the at least one auxiliary pad.

Abstract: A light transmission system includes a light guide support, a first convex lens, an optical waveguide member, and two second convex lenses. The light guide support includes a first surface, a second surface, a hollow space formed between the first surface and the second surface, and an inner reflecting surface forming an angle of 45 degrees relative to the first surface. The first convex lens is formed at the first surface, and configured for converging light to the inner reflecting surface. The optical waveguide member is located at the hollow space, and includes a main section parallel with the first surface, two first branch sections extending from and forming equal angles relative to the main section, and two second branch sections extending from the respective first branch sections. The two second convex lenses are formed at the second surface and aligned with the respective second branch sections.

Abstract: An optical adapter includes a loading plate and a coupling lens. The coupling lens includes a main body, a first optical reflector, and a second optical reflector. The first optical reflector is positioned on the loading plate. The main body includes a top plate made of transparent material and spaced a predetermined distance from the loading plate. The second optical reflector is positioned on the first top plate. The first loading plate loads a portion of a planar optical waveguide of an optical printed circuit board. An optical signal from the planar optical waveguide is reflected by the first optical reflector to the second optical reflector, then is reflected by the second optical reflector to the outside of the optical adapter.

Abstract: An embodiment of the disclosure includes a conductive feature on a semiconductor die. A substrate is provided. A bond pad is formed over the substrate. The bond pad has a first width. A polyimide layer is formed over the substrate and the bond pad. The polyimide layer has a first opening over the bond pad with a second width. A silicon-based protection layer overlies the polyimide layer. The silicon-based protection layer has a second opening over the bond pad with a third width. The first opening and the second opening form a combined opening having sidewalls to expose a portion of the bond pad. A UBM layer is formed over the sidewalls of combined opening to contact the exposed portion of the bond pad. A conductive feature overlies the UBM layer.

Abstract: A circuit board assembly includes a first circuit board, and a second circuit board, a first optical transceiver, a number of first light wave guides, a second optical transceiver, and a number of second light wave guides. The first circuit board defines a number of first through holes. The second circuit board defines a number of second and third through holes. Each of the third through holes is aligned with a respective first though hole. The first optical transceiver is optically coupled with the second through holes. The first light wave guides are mounted on one surface of the first circuit board and optically coupled with the second through holes. The second optical transceiver is optically coupled with the third through holes. The second light wave guides are mounted on another surface of the first circuit board and are optically coupled with the first through holes.

Abstract: In a normal mode, the power supply is fed back in a close loop, but in a power saving mode, the power supply is fed back in an open loop. When it is detected that the power supply is continuously fed back in the open loop and in a substantially zero output status, the power supply circuit enters a power down status. If the back-stage circuit needs power supply again, then the feedback is switched to the close loop and the power supply circuit enters the normal mode.

Abstract: A resistive switching memory is described, including a first electrode comprising doped silicon having a first work function, a second electrode having a second work function that is different from the first work function by between 0.1 and 1.0 electron volts (eV), a metal oxide layer between the first electrode and the second electrode, the metal oxide layer switches using bulk-mediated switching using unipolar or bipolar switching voltages for switching from a low resistance state to a high resistance state and vice versa.

Abstract: A circuit board assembly includes a first circuit board, an optical transceiver, a second circuit board, and a number of light wave guides. The first circuit board includes a lower surface. The optical transceiver is mounted on the lower surface for sending and receiving light beams. The second circuit board is electrically connected to the first circuit board and includes a top surface facing the lower surface. The light wave guides are mounted on the top surface and optically coupled with the optical transceiver for transmitting the light beams.

Abstract: A method for testing a TSV comprises charging a through-silicon-via under test to a first predetermined voltage level charging a capacitance device to a second predetermined voltage level; performing charge-sharing between the through-silicon-via and the capacitance device; and determining that the through-silicon-via under test is not faulty if the voltage level of the through-silicon-via after the charge-sharing step is within a predetermined range.

Abstract: A negative pressure wound therapy system creates a negative pressure environment in the opening of a wound-dressing unit and a positive pressure environment in the collecting bag. Then a positive pressure detecting procedure is proceeded in the positive pressure environment and a negative pressure detecting procedure is proceeded in the negative pressure environment. The detecting results are sent to determine whether a micro pump is stopped.

Abstract: A circuit board assembly includes a substrate, a first optical connector, a second optical connector, and at least two planar light wave circuits. The first optical connector includes a first circuit board electrically connected to the substrate, at least one first laser diode, at least one first photodiode, and a first transparent shell. The second optical connector includes a second circuit board connected to the substrate, at least one second laser diode, at least one second photodiode, and a second transparent shell. The planar light wave circuits are arranged between the first and second transparent shells. Each first laser diode is optically coupled with a second photodiode through a first transparent shell, a planar light wave circuit, and a second transparent shell. Each second laser diode is optically coupled with a first photodiode through a second transparent shell, a planar light wave circuit, and a first transparent shell.

Abstract: A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an adhesive distributed in the through hole. A thickness of the adhesive is less than that of the connecting pad.

Abstract: A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two soldering balls formed thereon. The chip includes a number of second bonding pads, and each second bonding pad corresponds to a respective first bonding pad. The two soldering balls of each first bonding pad are electrically connected to a corresponding second bonding pad via two bonding wires, and the bonding wires are bonded to the second corresponding bonding pad by a wedge bonding manner.

Abstract: A terminal module used in an RJ45 female connector in which the first transmission terminal includes a triangle support portion having a downward bent downwardly extended from the bonding portion and an upward bent connected with the lower end thereof to the downward bent and the upper end thereof to the contact portion. The eighth transmission terminal includes a support portion obliquely upwardly from the bonding portion and terminating in the contact portion. Further, the contained angle defined between the inner end of the bonding portion of the eighth transmission terminal and the support portion and the contained angle defined between the contact portion of the eighth transmission terminal and the support portion are arc guide angles. These terminal shapes are used to prevent terminal deformation upon insertion of a non-matching male connector.