Abstract: A copper interconnect line formed on a passivation layer is protected by a copper-containing material layer including a group III element, a group IV element, a group V element or combinations thereof.

Abstract: A chip package includes a PCB, a chip positioned on the PCB and bonding wires electrically connecting the chip to the PCB. The PCB includes a number of first bonding pads formed thereon. Each first bonding pad includes a first soldering ball. The chip includes a number of second bonding pads. Each second bonding pad includes a second bonding ball. Each bonding wire electrically connects a first bonding pad to a corresponding second bonding ball. Each bonding wire forms a vaulted portion upon the first bonding ball.

Abstract: A circuit board assembly includes a circuit board, a first optical transceiver electrically connected to the circuit board, a first transparent shell optically coupled with the first optical transceiver, a second optical transceiver electrically connected to the circuit board, a second transparent shell optically coupled with the second optical transceiver, and a plurality of light wave guides optically coupled with the first transparent shell and the second transparent shell. The first optical transceiver sends first light signals. The first light signals are transmitted through the first transparent shell, the light wave guides, and the second transparent shell and are received by the second optical transceiver. The second optical transceiver sends second light signals. The second light signals are transmitted through the second transparent shell, the light wave guides, and the first transparent shell and are received by first optical transceiver.

Abstract: A chip package includes a PCB, a connecting pad fixed on a surface of the PCB and a chip fixed on the connecting pad. The connecting pad includes a first metal film on its surface facing away from the PCB. The chip includes a second metal film formed on its surface opposite to the PCB. The first and the second metal are connected to each other via a eutectic manner.

Abstract: A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.

Abstract: A fluid collector has a container, a T-tube, a first screw unit and a second screw unit. The T-tube is connected to the container and has a main pipe and a branch pipe. The first screw unit is mounted in an outlet end of the main pipe. The second screw unit is mounted in a connecting end of the branch pipe, which is connected to the main pipe. The branch pipe has a detecting opening far from the connecting end and connects to a detecting device. By changing the length of the first and second screw units, different detecting values of the pressure are adjusted according to containers with different capacities. Moreover, with the flowing resistance resulting from the first and second screw units, different pressure variations are performed when liquid or air passes through the T-tube. Therefore, massive hemorrhage is clearly identified to keep the patient safe.

Abstract: A method for forming a tooth bleaching catalytic is provided, wherein the method comprises steps as follows: Firstly a plurality of histidine-functionalized mesoporous silica nano-particles (MSNs) is provided. Subsequently, the histidine-functionalized MSNs are condensating with a plurality of metal ions.

Abstract: A laser chip package structure includes a printed circuit board (PCB), a flexible circuit board, a laser chip and a number of electronic elements. The PCB includes a supporting surface. The flexible circuit board is positioned on the supporting surface and electrically connected to the PCB. The laser chip is positioned on the flexible circuit board and electrically connected to the flexible circuit board. The laser chip is configured to emit a laser beam. The electronic elements are positioned on the flexible circuit board and electrically connected to the flexible circuit board.

Abstract: A card tray ejection mechanism for an electronic device, which includes a first elongated member rotatably mounted to the base, a second elongated member, and a driving member. The first elongated member includes a first end portion resisting against a side of the tray, a second end portion opposite to the first end portion and a pivoting rod located between the first and second end portions. The second elongated member is rotatably connected to the second end portion. The driving member drives the second elongated member to move longitudinally. When the second elongated member is driven to move longitudinally by the driving member, the first elongated member is driven to rotate around the pivoting rod by the second elongated member, and the card tray is ejected. An electronic device using the card tray ejection mechanism is also provided.

Abstract: A motherboard includes a first circuit board, a second circuit board, and wiring. The first circuit board includes at least a programmable chip, a programming interface, a first data interface, and at least one jumper corresponding to the programmable chip. The second circuit board includes a CPU (central processing unit), a RAM unit, and at least a second data interface corresponding to the programmable chip. The motherboard of the present disclosure concentrates programmable chips on the first circuit board, thereby providing a unified programming interface to enhance the convenience of programming multiple programmable chips.

Abstract: An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes.

Abstract: Disclosed is a light-emitting diode with a semiconductor layer including dielectric material layer, and a manufacturing method thereof for increasing the external quantum efficiency. The semiconductor layer includes a non-flat structure having a plurality of recess regions, and at least one dielectric material layer disposed within each recess region, the dielectric material layer has a generally inverted pyramid shape or a ball shape, and a portion of the non-flat structure is exposed outside the dielectric material layer. Photons emitted from the active layer are scattered by the dielectric material layer as photon scattering structure, and are guided by the inclined internal side faces of the recess regions so that the probability of photons escaping from the light-emitting diode is increased, and thus total internal reflection is reduced, thereby increasing the extraction efficiency and hence the external quantum efficiency.

Abstract: A laser emitting chip package includes a circuit board, a laser emitting chip, and at least three gold balls. The circuit board includes at least two substrate-pad areas. The laser emitting chip includes at least two chip-pad areas. Each of the chip-pad areas spatially corresponds to a respective one of the substrate-pad areas. The at least three gold balls are explanted on the at least two chip-pad areas. The laser emitting chip is supported on the circuit board by the at least three gold balls in a triangular or square arrangement between the chip-pad areas and the substrate-pad areas. The laser emitting chip is electrically connected to the circuit board through the gold balls.

Abstract: Disclosed is a light-emitting diode with a semiconductor layer including stacked-type scattering layer, and a manufacturing method thereof. The semiconductor layer includes a non-flat structure and at least two scattering layers disposed therein. The scattering layers are stacked on the non-flat structure. The top surface of each layer of the scattering layers is non-flat having an undulating fashion, and refractive indices of two adjacent layers of the scattering layers are different from each other.

Abstract: A high-frequency transmission module includes a first chip, a second chip, and a conductive wire. The first chip includes a first top surface and a number of pads arranged along a periphery of the first top surface. The pads include a first bonding pad. The second chip includes a second top surface and a second bonding pad on the second top surface. The second chip is positioned on the first top surface such that the pads are uncovered by the second chip and the second bonding pad is mostly closed to the first bonding pad. The conductive wire bonds to the first bonding pad and the second bonding pad to electrically connect the second chip to the first chip and is configured to transmit high-frequency signals between the first chip and the second chip.

Abstract: A computer-implemented method for tracking one or more objects in a sequence of images includes generating a dictionary based on object locations in a first image included in the sequence of images. One or more object landmark candidates are identified in the sequence of images and a plurality of tracking hypothesis for the object landmark candidates are generated. A first tracking hypothesis is selected from the plurality of tracking hypothesis based on the dictionary.

Abstract: A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two first soldering balls formed thereon. The chip includes a number of second bonding pads each corresponding to a first bonding pad. Each second bonding pad includes a second soldering ball. The two first soldering balls of a first bonding pad are electrically connected to the second soldering ball of a corresponding second bonding pad via two bonding wires.

Abstract: There are provided methods and apparatus for inter-layer residue prediction for scalable video. An apparatus is described for an encoder for encoding a block of a picture, or a decoder for decoding a block of a picture, by applying inverse tone mapping to an inter-layer residue prediction process for the block, wherein the inverse tone mapping is performed in the pixel domain. Methods for encoding or decoding a block of a picture are also described; and performed by applying inverse tone mapping to an inter-layer residue prediction process for the block, wherein the inverse tone mapping is performed in the pixel domain.

Abstract: The method and circuit for testing a TSV of the present invention exploit the electronic property of the TSV under test. The TSV under test is first reset to a first state, and is then sensed at only one end to determine whether the TSV under test follows the behavior of a normal TSV, wherein the reset and sense steps are performed at only one end of the TSV under test. If the TSV under test does not follow the behavior of a normal TSV, the TSV under test is determined faulty.

Abstract: A light-emitting diode (LED) streetlight structure, which includes a light-emitting module, a power module, and a lamppost. The light-emitting module is disposed on side of the power module; the lamppost is disposed on the other side of the power module and corresponds to the light-emitting module. A heat-dissipating structure is disposed on the surface of a housing of the power module. The heat-dissipating structure corresponds to a power supply in the power module, and can dissipate the heat generated by the power supply and reduce the temperature thereof. Accordingly, heat dissipation of the power supply is enhanced, and hence increasing its lifetime.